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CN-224234078-U - Solar cell module

CN224234078UCN 224234078 UCN224234078 UCN 224234078UCN-224234078-U

Abstract

The utility model relates to the technical field of solar cells, in particular to a solar cell module which comprises a back plate structure layer and a cell arranged on the upper surface of the back plate structure layer, wherein a first packaging structure layer is arranged on the upper surface of the cell, a front panel structure layer is arranged on the upper surface of the first packaging structure layer, and a plurality of through holes penetrating through the upper surface and the lower surface of the first packaging structure layer are formed in the first packaging structure layer. Compared with the prior art, through the arrangement of the through holes on the first packaging structure layer, the stress distribution of the first packaging structure layer can be changed through the through holes in the bending process of the first packaging structure layer, so that the stress is redistributed around the holes, and the phenomenon of reducing stress concentration is obtained, thereby being beneficial to the more uniform deformation of the first packaging structure layer in bending, reducing the local too high stress of the first packaging structure layer, ensuring that the first packaging structure layer cannot crack or break due to the too high stress in the bending process, and improving the service reliability and service life of the solar cell module.

Inventors

  • Ning Zuozheng

Assignees

  • 深圳市德乐士光电科技有限公司

Dates

Publication Date
20260512
Application Date
20250430

Claims (10)

  1. 1. The solar cell module comprises a back plate structure layer (10) and a cell (20) arranged on the upper surface of the back plate structure layer (10), and is characterized in that a first packaging structure layer (30) is arranged on the upper surface of the cell (20), a front panel structure layer (40) is arranged on the upper surface of the first packaging structure layer (30), and a plurality of through holes penetrating through the upper surface and the lower surface of the first packaging structure layer (30) are formed.
  2. 2. The solar cell module according to claim 1, wherein the through holes comprise at least a first row of through holes and a second row of through holes, the first row of through holes and the second row of through holes being arranged along a longitudinal pitch of the first encapsulation structure layer (30); The first row of through holes are provided with a plurality of first through holes (31) which are arranged along the transverse interval of the first packaging structure layer (30), the second row of through holes are provided with a plurality of second through holes (32) which are arranged along the transverse interval of the front panel structure layer (40), and the plurality of first through holes (31) and the plurality of second through holes (32) are arranged in a staggered mode.
  3. 3. Solar cell module according to claim 2, characterized in that one second through hole (32) is located between two first through holes (31), one second through hole (32) being arranged in an equilateral triangle configuration with two first through holes (31).
  4. 4. The solar cell module of any one of claims 1-3, wherein the through-holes are any one of circular holes, rectangular holes, oblong holes, diamond holes, hexagonal holes, cross holes, triangular holes, oval holes, splayed holes, or quincuncial holes.
  5. 5. A solar cell module according to any of claims 1-3, characterized in that the first thickness (h 1) of the first encapsulation structure layer (30) is between 0.05mm and 0.35mm, the first diameter (a 1) of the through holes is between 0.5mm and 2.0mm, and the first hole pitch (a 2) of both through holes is between 1mm and 5 mm.
  6. 6. The solar cell module according to claim 5, wherein when the first thickness (h 1) of the first encapsulation structure layer (30) is 0.15mm-0.27mm, the first diameter (a 1) of the through holes is 1.3mm and the first hole margin (a 2) of both through holes is 3mm.
  7. 7. The solar cell module according to claim 1, 2, 3 or 6, wherein the back plate structural layer (10) and the cell (20) are bonded together by an adhesive film layer (50), the first packaging structural layer (30) and the cell (20) are bonded together by the adhesive film layer (50), and the front plate structural layer (40) and the first packaging structural layer (30) are bonded together by the adhesive film layer (50); And the adhesive film layers (50) are positioned above and below the first packaging structure layer (30), and the plastic of the adhesive film layers (50) can be embedded into the through holes after hot melt bonding.
  8. 8. The solar cell module according to claim 7, wherein the back sheet structural layer (10) is any one of a double-coated fluorine-containing structural back sheet, a trifluorocarbon-coated structural back sheet, a single-sided fluorine-containing structural back sheet, a glass fiber reinforced polypropylene structural back sheet, an epoxy glass fiber prepreg structural back sheet, or an acrylic powder-coated glass fiber structural back sheet.
  9. 9. The solar cell module according to claim 7, wherein the first encapsulation structure layer (30) and the front panel structure layer (40) are any one of a double-coated fluorine-containing structure back sheet, a fluorocarbon coating structure back sheet, and a single-sided fluorine-containing structure back sheet.
  10. 10. The solar cell module according to claim 7, wherein the adhesive film layer (50) is any one of a transparent EVA adhesive film, a white EVA adhesive film, a POE adhesive film, a co-extruded POE adhesive film, or an acrylic adhesive film.

Description

Solar cell module Technical Field The utility model relates to the technical field of solar cells, in particular to a solar cell module. Background In the related art, the solar cell module at least comprises a back plate structure layer, a cell arranged on the upper surface of the back plate structure layer and a packaging structure layer for packaging the cell on the back plate structure layer, wherein the packaging structure layer is usually made of a double-coating fluorine-containing structure plate or a trifluoro carbon coating plate, but the solar cell module is inevitably bent due to the action of external force in the transportation or installation process, the bending resistance of the packaging structure layer is general, when the solar cell module is bent to a certain extent, the packaging structure layer is easy to break, and at the moment, the packaging structure layer cannot isolate the external gas and the liquid, and also has the risk of puncturing the cell, so that the service reliability and the service life of the solar cell module are severely limited. Therefore, a new technical solution is needed to solve the above problems. Disclosure of utility model In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its primary object is to provide a solar cell module, which effectively solves the technical drawbacks of low reliability and service life of the solar cell module in the prior art. The solar cell module comprises a back plate structure layer and a cell arranged on the upper surface of the back plate structure layer, wherein a first packaging structure layer is arranged on the upper surface of the cell, a front panel structure layer is arranged on the upper surface of the first packaging structure layer, and a plurality of through holes penetrating through the upper surface and the lower surface of the first packaging structure layer are formed in the first packaging structure layer. The solar cell module has the beneficial effects that compared with the prior art; According to the solar cell module, through the through holes penetrating through the upper surface and the lower surface of the first packaging structure layer, in the bending process of the first packaging structure layer, the stress distribution of the first packaging structure layer can be changed through the through holes, so that the stress is redistributed around the holes, and the phenomenon of relieving stress concentration is obtained, so that the first packaging structure layer can be more uniformly deformed during bending, the local too high stress of the first packaging structure layer is reduced, the first packaging structure layer is further ensured not to crack or break due to the too high stress in the bending process, the first packaging structure layer can provide reliable capability of isolating external gas and liquid for a cell, and the service reliability and the service life of the solar cell module are improved; In the second aspect, through the through holes, the total mass of the first packaging structure layer can be reduced, so that the inertia force required by the first packaging structure layer in the bending process is reduced, the first packaging structure layer is easier to bend and deform, and through the through holes, the flexibility of the first packaging structure layer can be improved, so that the local area can be more flexibly adapted to the strain requirement in the bending process when the first packaging structure layer is integrally bent. As a preferable scheme, the through holes at least comprise a first row of through holes and a second row of through holes, and the first row of through holes and the second row of through holes are arranged along the longitudinal interval of the first packaging structure layer; The first row of through holes are provided with a plurality of first through holes which are arranged along the transverse interval of the first packaging structure layer, the second row of through holes are provided with a plurality of second through holes which are arranged along the transverse interval of the front panel structure layer, and the first through holes and the second through holes are arranged in a staggered manner. As a preferred solution, one second through hole is located between the two first through holes, and one second through hole and the two first through holes are arranged in an equilateral triangle structure. As a preferable scheme, the through hole is any one of a circular hole, a rectangular hole, an oblong hole, a diamond hole, a hexagonal hole, a cross hole, a triangular hole, an elliptical hole, a splayed hole or a plum blossom hole. As a preferable scheme, the first thickness of the first packaging structure layer is between 0.05mm and 0.35mm, the first diameter of the through holes is between 0.5mm and 2.0mm, and the first hole edge distance of the two through holes is between 1mm and 5