CN-224234095-U - LED support and LED packaging body

CN224234095UCN 224234095 UCN224234095 UCN 224234095UCN-224234095-U

Abstract

The utility model relates to the technical field of LED lighting elements, in particular to an LED support and an LED packaging body, wherein the LED support comprises a conductive part, the conductive part comprises an anode part and a cathode part which are insulated and separated, an insulating surrounding dam is arranged on the conductive part and surrounds a groove with the conductive part, the conductive part is positioned at the bottom of the groove, a part of the area of the bottom of the groove is a chip mounting area and is used for mounting a chip, a raised strip structure is arranged between at least one side of the chip mounting area and the insulating surrounding dam, the raised strip structure protrudes out of the bottom of the groove and surrounds a gluing area with the insulating surrounding dam, the gluing area is used for coating a reinforcing glue layer for reinforcing the structural strength of the LED support, and the surface of the raised strip structure is a concave-convex surface with concave parts and convex parts so as to prolong the path of water vapor when penetrating into the chip mounting area along the surface of the raised strip structure, and improve the luminous flux maintenance rate of the LED packaging body.

Inventors

LV XIANGPING
WU GUIXIN
LI ZHI
LI ZHUANGZHI

Assignees

惠州市聚飞光电有限公司
芜湖聚飞光电科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250331

Claims (10)

1. An LED support, comprising: The conductive piece comprises an anode part and a cathode part which are isolated and electrically connected with the anode and the cathode of the chip respectively; The insulating box dam is arranged on the conductive piece and forms a groove with the conductive piece, and the conductive piece is positioned at the bottom of the groove; The LED lamp comprises a LED support, a groove, a convex strip structure, a rubber coating area, a chip mounting area, a protective cover and a protective cover, wherein part of the area of the groove bottom of the groove is the chip mounting area and is used for mounting the chip, the convex strip structure is arranged between at least one side of the chip mounting area and the insulating cover dam and protrudes out of the groove bottom of the groove and surrounds the rubber coating area with the insulating cover dam, and the rubber coating area is used for coating a reinforcing rubber layer for reinforcing the structural strength of the LED support; The surface of the raised line structure is a concave-convex surface with concave parts and convex parts so as to prolong the path of vapor penetrating along the surface of the raised line structure to the chip mounting area.
2. The LED mount of claim 1 wherein the protrusions are ribs extending along the length of the ridge structure and the recesses are grooves extending along the length of the ridge structure, the ribs and grooves being alternately arranged from a side of the ridge structure adjacent to the chip mounting region to a side remote from the chip mounting region.
3. The LED fixture of claim 1, wherein the ridge structure comprises first and second ridge arranged at intervals, two ends of the first ridge and two ends of the second ridge are respectively connected with the insulating dam, and the chip mounting area is located between the first ridge and the second ridge.
4. The LED fixture of claim 3, wherein the recess is an elongated recess having two long sides arranged opposite to each other, and both ends of the first ridge and both ends of the second ridge are connected to the insulating dams at the two long sides, respectively.
5. A LED holder according to claim 3, wherein a bottom of the recess has a mounting groove through which ribs are provided, the ribs including fitting portions fitted in the mounting groove, and exposed portions exposing the mounting groove, the exposed portions constituting the first protrusions, a surface area of the fitting portions being larger than a surface area of the exposed portions.
6. The LED bracket of claim 5, wherein at least a portion of the cross-sectional lateral dimension of the recessed portion is greater than the maximum cross-sectional lateral dimension of the first rib in a cross-section intersecting the rib.
7. The LED support according to any one of claims 3 to 6, wherein the positive electrode portion and the negative electrode portion are separated by an insulating spacer having a convex portion protruding from a bottom of the groove, the convex portion constituting the second ridge.
8. The LED support of claim 7, wherein a side of the second ridge adjacent to the die-attach area is defined as an inner side, a side adjacent to the glue-applied area is defined as an outer side, and the insulating spacer is bent toward the inner side and/or the outer side.
9. An LED package, comprising an LED support, a chip, a reinforcing adhesive layer, and a packaging adhesive, wherein the LED support is an LED support according to any one of claims 1 to 8, the chip is disposed in the chip mounting area, the reinforcing adhesive layer is formed by an adhesive solution coated in the adhesive coating area, and the packaging adhesive encapsulates the chip in the LED support.
10. The LED package of claim 9, wherein the glue area has a silver coating at the bottom, the LED package further comprising an organic coating disposed between the silver coating and the reinforcing glue layer, the organic coating for insulating the silver coating.

Description

LED support and LED packaging body Technical Field The utility model relates to the technical field of LED lighting elements, in particular to an LED bracket and an LED packaging body. Background The LED package body comprises an LED support and a chip, specifically, the LED support comprises a conductive lead frame and an insulating box dam arranged at the edge of the conductive lead frame, the insulating box dam protrudes upwards relative to the conductive lead frame to form a groove in a matched mode with the conductive lead frame, and the chip is arranged at the bottom of the groove and is in conductive connection with the conductive lead frame. In order to improve the structural strength of the LED packaging body, a reinforcing adhesive layer is arranged between the chip and the surrounding dam, and the chip is packaged in the LED bracket through the packaging adhesive. In actual use, water vapor permeates to the position of the chip through the bonding interface between the reinforcing adhesive layer and the packaging adhesive, influences the silver coating layer and the chip at the bottom of the bracket, and influences the luminous flux of the LED packaging body. Disclosure of utility model The utility model provides an LED bracket and an LED package body, which are used for solving the technical problem that the luminous flux maintenance rate of the LED package body is easily affected by water vapor in the prior art. In a first aspect, the present utility model provides an LED support comprising: The conductive piece comprises an anode part and a cathode part which are isolated and electrically connected with the anode and the cathode of the chip respectively; The insulating box dam is arranged on the conductive piece and forms a groove with the conductive piece, and the conductive piece is positioned at the bottom of the groove; The LED lamp comprises a LED support, a groove, a convex strip structure, a rubber coating area, a chip mounting area, a protective cover and a protective cover, wherein part of the area of the groove bottom of the groove is the chip mounting area and is used for mounting the chip, the convex strip structure is arranged between at least one side of the chip mounting area and the insulating cover dam and protrudes out of the groove bottom of the groove and surrounds the rubber coating area with the insulating cover dam, and the rubber coating area is used for coating a reinforcing rubber layer for reinforcing the structural strength of the LED support; The surface of the raised line structure is a concave-convex surface with concave parts and convex parts so as to prolong the path of vapor penetrating along the surface of the raised line structure to the chip mounting area. In one technical scheme, the convex part is a convex rib extending along the length direction of the convex strip structure, the concave part is a groove extending along the length direction of the convex strip structure, and the convex rib and the groove are alternately arranged from one side of the convex strip structure, which is close to the chip mounting area, to one side of the convex strip structure, which is far away from the chip mounting area. In one technical scheme, the sand grip structure includes first sand grip and the second sand grip of interval arrangement, the both ends of first sand grip with the both ends of second sand grip respectively with insulating box dam is connected, the chip mounting district is located first sand grip with between the second sand grip. In one technical scheme, the groove is a strip-shaped groove and is provided with two long sides which are oppositely arranged, and two ends of the first raised strip and two ends of the second raised strip are respectively connected with the insulating surrounding dams at the two long sides. In one technical scheme, the groove bottom of the groove is provided with a mounting groove, ribs are arranged through the mounting groove, the ribs comprise embedded parts embedded in the mounting groove and exposed parts exposing the mounting groove, the exposed parts form the first raised strips, and the surface area of the embedded parts is larger than that of the exposed parts. In one embodiment, at least a portion of the insertion portion has a cross-sectional transverse dimension greater than a maximum cross-sectional transverse dimension of the first rib in a cross-section intersecting the rib. In one technical scheme, the positive electrode part and the negative electrode part are separated by an insulating parting strip, the insulating parting strip is provided with a protruding part protruding out of the bottom of the groove, and the protruding part forms the second raised line. In one technical scheme, one side, close to the chip mounting area, of the second raised line is defined as an inner side, one side, close to the gluing area, of the second raised line is defined as an outer side, and the insulating division bars are be