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CN-224234097-U - Workpiece structure suitable for optimizing Wire Bonding operation surface

CN224234097UCN 224234097 UCN224234097 UCN 224234097UCN-224234097-U

Abstract

The application provides a workpiece structure suitable for optimizing a Wire Bonding operation surface, which relates to the technical field of LED packaging, and comprises a Bonding Wire bottom plate, the LED Bonding Wire comprises a Bonding Wire base plate, wherein a base plate groove for packaging LED particles is formed in the Bonding Wire base plate, a plurality of pits are formed in the bottom of an inner cavity of the base plate groove, and the pits are used for containing pins of the LED particles. According to the LED module, the pits are arranged and used for accommodating the pins of the LED particles, the LED particles sink after being accommodated by the pits, and the LED particles contact with the bottom of the inner cavity of the bottom plate groove after sinking, so that the plastic material part of the LED particles is supported, and the overall flatness is ensured.

Inventors

  • YE XUEPING
  • LI FEILONG
  • YANG SHAN
  • MA YUNHE
  • Ying Jianwen

Assignees

  • 盐城东山精密制造有限公司

Dates

Publication Date
20260512
Application Date
20250423

Claims (10)

  1. 1. The utility model provides a work piece structure suitable for optimize Wire Bonding working face, its characterized in that, including Bonding Wire bottom plate (1), be provided with on Bonding Wire bottom plate (1) and be used for encapsulating LED granule bottom plate groove (2), and the bottom of bottom plate groove (2) inner chamber is provided with a plurality of pit (3), pit (3) are used for holding the pin of LED granule.
  2. 2. A workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 1, characterized in that the LED particles are sunk after the pins are received by the pockets (3) and the LED particles are sunk and in contact with the bottom of the cavity of the floor tub (2).
  3. 3. A workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 2, characterized in that the pits (3) are machined by means of an electric discharge.
  4. 4. A workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 3, characterized in that the number of said pits (3) is four, four of said pits (3) being arranged in a matrix.
  5. 5. A workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 4, characterized in that between four of said pockets (3) there is left an LED particle support surface (4) supporting LED particles.
  6. 6. The workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 5, wherein the LED particle support surface (4) is provided with anti-slip micro-textures, and the micro-textures are V-shaped grooves or honeycomb-shaped pits distributed in a staggered manner.
  7. 7. A work piece structure suitable for optimizing Wire Bonding work surfaces according to claim 6, characterized in that the opening edge of the pit (3) is provided with a chamfer for guiding LED pellet pins into the pit (3).
  8. 8. A workpiece structure suitable for optimizing Wire Bonding work surfaces according to claim 1 or 7, characterized in that the edge of the Wire Bonding bottom plate (1) is provided with an anti-oxidation layer, the material of which is nickel-phosphorus alloy.
  9. 9. The workpiece structure of claim 8, wherein the surface of the oxidation preventing layer is covered with a wear resistant coating, and the wear resistant coating is made of titanium nitride or tungsten carbide.
  10. 10. A work piece structure suitable for optimizing Wire Bonding work surfaces according to claim 9, characterized in that the inner walls of the pit (3) are coated with a conductive coating, the material of which is silver.

Description

Workpiece structure suitable for optimizing Wire Bonding operation surface Technical Field The utility model relates to the technical field of LED packaging, in particular to a workpiece structure suitable for optimizing a Wire Bonding operation surface. Background In the LED packaging industry, the bottom plate structure of Wire Bonding directly influences packaging efficiency and product quality, a flat bottom plate or a bottom plate with a transverse groove process is commonly adopted in the prior art, but particle unevenness easily occurs in the bottom/cover plate lamination process, with the miniaturization of the LED particle size, the lamination precision requirement is obviously improved, the problem of insufficient flatness of the traditional structure is more and more remarkable, the maintenance period of a corner cutting die is forced to be shortened, the maintenance cost (comprising manpower and material cost) is greatly increased, in addition, the traditional process depends on the contact of a soldering corner and the bottom plate, the consistency of supporting strength is difficult to ensure, and the production efficiency and the product yield are further restricted. Therefore, we have made improvements to this by proposing a work piece structure suitable for optimizing the Wire Bonding work plane. Disclosure of utility model The utility model aims to solve the problem of insufficient package flatness of LED particles existing at present. In order to achieve the above object, the present utility model provides a work structure suitable for optimizing a Wire Bonding work plane to improve the above problems. The application is specifically as follows: the utility model provides a work piece structure suitable for optimize Wire Bonding working face, includes the Bonding Wire bottom plate, be provided with the bottom plate groove that is used for encapsulating the LED granule on the Bonding Wire bottom plate, and the bottom in bottom plate groove inner chamber is provided with a plurality of pit, the pit is used for holding the pin of LED granule. According to the LED module, the pits are arranged and used for accommodating the pins of the LED particles, the LED particles sink after being accommodated by the pits, and the LED particles contact with the bottom of the inner cavity of the bottom plate groove after sinking, so that the plastic material part of the LED particles is supported, and the overall flatness is ensured. As the preferable technical scheme of the application, the LED particles sink after the pins are accommodated by the pits, and the LED particles contact with the bottom of the inner cavity of the bottom plate groove after sinking. As a preferable technical scheme of the application, the pit is processed by adopting an electric discharge mode. As a preferable technical scheme of the application, the number of the pits is four, the four pits are arranged in a matrix, and an LED particle supporting surface for supporting LED particles is reserved among the four pits. As a preferable technical scheme of the application, the LED particle supporting surface is provided with anti-skid micro-textures, and the micro-textures are V-shaped grooves or honeycomb-shaped pits which are distributed in a staggered manner. As a preferable technical scheme of the application, the opening edge of the pit is provided with a chamfer which is used for guiding the LED particle pins to enter the pit. As a preferable technical scheme of the application, the edge of the welding wire bottom plate is provided with an anti-oxidation layer, and the anti-oxidation layer is made of nickel-phosphorus alloy. As a preferable technical scheme of the application, the surface of the oxidation-resistant layer is covered with a wear-resistant coating, and the wear-resistant coating is made of titanium nitride or tungsten carbide. As a preferable technical scheme of the application, the inner wall of the pit is coated with a conductive coating, and the conductive coating is made of silver. Compared with the prior art, the utility model has the beneficial effects that: In the scheme of the application: In order to solve the problem of insufficient package flatness of LED particles in the prior art, the LED particles are sunk after being accommodated by the pits through the pits which are arranged, and the LED particles are contacted with the bottom of the inner cavity of the bottom plate groove after being sunk, so that the plastic material part of the LED particles is supported, and the overall flatness is ensured. Drawings FIG. 1 is a schematic diagram of a work piece structure suitable for optimizing a Wire Bonding work surface according to the present application; FIG. 2 is a schematic top view of a work piece structure suitable for optimizing a Wire Bonding work surface according to the present application; FIG. 3 is a schematic side view of a work piece structure suitable for optimizing a Wire Bonding work surfac