CN-224234100-U - Light-emitting diode packaging structure

Abstract

A light-emitting diode packaging structure comprises a base layer, a light-emitting diode arranged on the base layer, a shell arranged on the base layer, a first light-transmitting layer arranged on the light-emitting diode, and a second light-transmitting layer arranged on the first light-transmitting layer, wherein the first light-transmitting layer is clamped between the light-emitting diode and the second light-transmitting layer, the base layer, the shell and the second light-transmitting layer are enclosed to form a sealing space, and the light-emitting diode is located in the sealing space. Therefore, the surface of the light-emitting diode is protected, the brightness is improved, the luminous efficiency is improved, the reliability is maintained, and the service life is prolonged.

Inventors

• HONG RONGHAO
• YANG YUJUN

Assignees

• 葳天科技股份有限公司

Dates

Publication Date

20260512

Application Date

20250527

Claims (9)

1. 1. A light emitting diode package structure, comprising: a base layer; a light emitting diode disposed on the base layer; a shell arranged on the base layer; a first transparent layer disposed on the LED, and The second light-transmitting layer is arranged on the first light-transmitting layer; The first light-transmitting layer is clamped between the light-emitting diode and the second light-transmitting layer, the base layer, the shell and the second light-transmitting layer are enclosed to form a sealed space, and the light-emitting diode is positioned in the sealed space.
2. 2. The LED package structure of claim 1, wherein a refractive index of the first transparent layer is between 0.85 times a refractive index of the second transparent layer and 1.15 times a refractive index of the LED.
3. 3. The led package structure of claim 1, wherein the material of the first light-transmitting layer is an elastic material.
4. 4. The light emitting diode package structure of claim 1, further comprising: An adhesive layer is sandwiched between the housing and the second transparent layer.
5. 5. The LED package structure of claim 4, wherein the adhesive layer is a heat-resistant adhesive.
6. 6. The light emitting diode package structure of claim 1, further comprising: an adhesive layer disposed on the housing, and An inorganic layer sandwiched between the adhesive layer and the second transparent layer.
7. 7. The LED package according to claim 6, wherein the inorganic layer has a light transmittance of substantially 0 between a light-emitting wavelength band of the LED.
8. 8. The led package structure of claim 6, wherein the inorganic layer is made of gold, silver, nickel, copper, tin or lead.
9. 9. The LED package according to claim 1, wherein the LED is an ultraviolet LED, the housing is made of ceramic, metal or quartz, and the second transparent layer is made of quartz, magnesium fluoride, calcium fluoride, glass or polytetrafluoroethylene.

Description

Light-emitting diode packaging structure Technical Field The utility model relates to the technical field of light emitting diodes, in particular to a light emitting diode packaging structure. Background The visible light LED chip can be processed into a visible light LED packaging structure applied to the fields of illumination, display, decoration, medical treatment and the like. The infrared light emitting diode chip can be processed into an infrared light emitting diode packaging structure applied to the fields of remote control, night vision photography, face recognition, distance sensing, communication and the like. The common visible light emitting diode package structure or the infrared light emitting diode package structure comprises a base layer, a light emitting diode and an organic colloid. The organic colloid can protect the LED chip. The ultraviolet light emitting diode chip can be processed into an ultraviolet light emitting diode packaging structure applied to sterilization, air purification, curing, medical treatment, identification, detection and semiconductor manufacturing. However, since the ultraviolet light emitted by the ultraviolet light emitting diode chip may damage the organic colloid, the ultraviolet light emitting diode chip cannot be packaged by the organic colloid. Therefore, a general uv led package structure includes a base layer, a uv led, a housing, and quartz glass. The packaging mode protects the ultraviolet light emitting diode chip through quartz glass and air, and the quartz glass and the air cannot be damaged by ultraviolet light irradiation. However, after the uv light emitting diode of the general uv light emitting diode package structure emits uv light, the uv light will be reflected at the interface between the uv light emitting diode and air, the interface between the air and quartz glass, and the interface between the quartz glass and the outside air, so that the uv light ratio of the uv light emitting diode package structure finally emitted is greatly reduced, resulting in poor brightness and luminous efficiency of the uv light emitting diode package structure. Furthermore, the adhesion between the base layer and the quartz glass of the general ultraviolet light emitting diode package structure is damaged by ultraviolet light, so that the reliability of the general ultraviolet light emitting diode package structure is poor and the service life is low. In view of this, how to improve the brightness and the luminous efficiency of the led package structure, maintain the reliability and increase the service life of the led package structure is one of the problems to be solved. Disclosure of utility model The utility model provides a light-emitting diode packaging structure which can protect the surface of a light-emitting diode, improve the brightness, improve the luminous efficiency, maintain the reliability and prolong the service life. The utility model provides a light-emitting diode packaging structure which comprises a base layer, a light-emitting diode arranged on the base layer, a shell arranged on the base layer, a first light-transmitting layer arranged on the light-emitting diode, and a second light-transmitting layer arranged on the first light-transmitting layer, wherein the first light-transmitting layer is clamped between the light-emitting diode and the second light-transmitting layer, and the base layer, the shell and the second light-transmitting layer are enclosed to form a sealing space, and the light-emitting diode is positioned in the sealing space. In some embodiments, the refractive index of the first light-transmitting layer is between 0.85 times the refractive index of the second light-transmitting layer and 1.15 times the refractive index of the light-emitting diode. In some embodiments, the material of the first light-transmitting layer is an elastic material. In some embodiments, the first light-transmitting layer is a non-tacky light-transmitting layer. In some embodiments, the LED package further includes an adhesive layer sandwiched between the housing and the second transparent layer. In some embodiments, the adhesive layer is a heat resistant adhesive. In some embodiments, the LED package structure further includes an adhesive layer disposed on the housing, and an inorganic layer sandwiched between the adhesive layer and the second transparent layer. In some embodiments, the inorganic layer has a light transmittance of substantially 0 between the light emitting wavelength bands of the light emitting diode. In certain embodiments, the material of the inorganic layer is gold, silver, nickel, copper, tin, or lead. In some embodiments, the light emitting diode is an ultraviolet light emitting diode, the material of the housing is ceramic, metal or quartz, and the material of the second light-transmitting layer is quartz, magnesium fluoride, calcium fluoride, glass or polytetrafluoroethylene. As mentioned above, the light emitting diod