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CN-224234105-U - LED display module and electronic product

CN224234105UCN 224234105 UCN224234105 UCN 224234105UCN-224234105-U

Abstract

The utility model belongs to the technical field of LED display module packaging, and particularly relates to an LED display module and an electronic product. The LED display module comprises a substrate, a plurality of bonding pads, an LED light emitting chip, a first groove and a second groove, wherein the substrate is provided with a circuit, the bonding pads are arranged on the substrate and are electrically connected with the circuit, a gap is formed between at least two adjacent bonding pads, the bottom of the LED light emitting chip is connected with the bonding pads, the LED light emitting chip is arranged above the gap between the two adjacent bonding pads in a crossing mode, the first groove is arranged on the substrate and is located below the gap, and the first groove is recessed towards the direction opposite to the LED light emitting chip. The utility model can improve the packaging quality of the LED display module.

Inventors

  • LI MANTIE
  • CHEN YONGLIN
  • YU LIANG
  • TU MENGLONG

Assignees

  • 深圳雷曼光电科技股份有限公司

Dates

Publication Date
20260512
Application Date
20250530

Claims (10)

  1. An led display module, comprising: a substrate on which a wiring is provided; The bonding pads are arranged on the substrate, are electrically connected with the circuit, and are provided with gaps between at least two adjacent bonding pads; the bottom of the LED light-emitting chip is connected with the bonding pads, and the LED light-emitting chip is arranged above a gap between two adjacent bonding pads in a crossing manner; The LED light-emitting device comprises a substrate, and is characterized in that a first groove is formed in the substrate and located below the gap, and the first groove is recessed in the direction opposite to the LED light-emitting chip.
  2. 2. The LED display module of claim 1, wherein the first groove is a reflective groove.
  3. 3. The LED display module of claim 2, wherein a surface of the first recess is provided with a reflective layer.
  4. 4. The LED display module of claim 1, wherein the substrate is provided with a through hole communicating with opposite surfaces of the substrate.
  5. 5. The LED display module of claim 4, wherein the through holes are disposed perpendicular to the surface of the substrate.
  6. 6. The LED display module of claim 1, wherein the two adjacent bonding pads are a first bonding pad and a second bonding pad, the circuit is disposed under the first bonding pad, the circuit is disposed under the second bonding pad, the edge of one side of the first groove is connected with the circuit under the first bonding pad, and the edge of the other side is connected with the circuit under the second bonding pad.
  7. 7. The LED display module of claim 1, wherein the surfaces of the substrate and the traces are covered with an ink layer.
  8. 8. The LED display module according to claim 1, wherein the first recess has a semicircular and/or rectangular and/or triangular and/or trapezoidal cross-sectional shape.
  9. 9. The LED display module of any of claims 1 to 8, wherein the LED light emitting chip is a mini flip chip and/or micro chip and/or MIP device.
  10. 10. An electronic product comprising the LED display module according to any one of claims 1 to 9.

Description

LED display module and electronic product Technical Field The utility model belongs to the technical field of LED display packaging, and particularly relates to an LED display module and an electronic product. Background The mode of manufacturing the LED by adopting the plastic packaging technology at present is to spray a copper circuit on the surface of a glass substrate, then spray a layer of black ink, and further coat ink at the gap position between adjacent bonding pads to prevent light from refracting inside the glass substrate and reflecting back to the lamp surface, thereby avoiding affecting the light color consistency of the display module and finally only exposing the bonding pad position. However, in the face of the trend of smaller and smaller LED chips, the gaps between the pads on the corresponding glass substrate will also be correspondingly reduced, and the accuracy of the ink process may not be able to adapt to the smaller and smaller pad gaps. If the ink accuracy of the coating gap is insufficient, the ink covers the bonding pad to enable the bonding pad to be high on one side and low on the other side, so that the problems of inclination, floating and the like of the chip are caused, and the bonding pad spacing is increased to cause the cold joint problem. And after the chip is miniaturized, the tiny bonding pad gap easily causes short circuit after solder paste reflows, and after moisture invades, the micro-circuit is easily formed to conduct the anode and the cathode of the lamp bead, so that the short circuit is formed, and the LED packaging quality is seriously affected. Disclosure of utility model In view of the above, the present utility model provides an LED display module, which includes: a substrate on which a wiring is provided; The bonding pads are arranged on the substrate, are electrically connected with the circuit, and are provided with gaps between at least two adjacent bonding pads; the bottom of the LED light-emitting chip is connected with the bonding pads, and the LED light-emitting chip is arranged above a gap between two adjacent bonding pads in a crossing manner; The LED light-emitting device comprises a substrate, and is characterized in that a first groove is formed in the substrate and located below the gap, and the first groove is recessed in the direction opposite to the LED light-emitting chip. Preferably, the first groove is a reflective groove. Preferably, the surface of the first groove is provided with a light reflecting layer. Preferably, the substrate is provided with a through hole communicating with opposite surfaces of the substrate. Preferably, the through holes are arranged perpendicular to the surface of the substrate. Preferably, the two adjacent bonding pads are a first bonding pad and a second bonding pad respectively, the circuit is arranged below the first bonding pad, the circuit is arranged below the second bonding pad, the edge of one side of the first groove is connected with the circuit below the first bonding pad, and the edge of the other side of the first groove is connected with the circuit below the second bonding pad. Preferably, the surfaces of the substrate and the circuit are covered with an ink layer. Preferably, the cross-sectional shape of the first groove includes a semicircle, a rectangle, a triangle, a trapezoid. Preferably, the LED light emitting chip comprises a mini flip chip, a micro chip and a MIP device. The second aspect of the utility model provides an electronic product, which comprises the LED display module set in the first aspect. The LED display module and the electronic product have the beneficial effects that the solder paste for welding is prevented from flowing back through the first groove arranged at the position of the gap between the bonding pads on the substrate, so that the phenomenon of short circuit caused by solder paste flowing back under the condition of smaller gap between the bonding pads is effectively avoided. And under the condition that the precision of the ink spray head is not matched with the gap size, the situation that the bonding pad is covered by ink, so that the bonding pad is high on one side and low on the other side, and therefore the wafer is inclined and floats up or the bonding pad distance is increased to cause cold joint can be avoided. Drawings In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings required to be used in the embodiments of the present utility model will be briefly described, and it is within the scope of the present utility model to obtain other drawings according to these drawings without inventive effort for a person skilled in the art. Fig. 1 is a cross-sectional view of an LED display module according to the present utility model; FIG. 2 is a top view of an LED display module according to the present utility model; FIG. 3 is a schematic diagram of a structure of TGV punching performed o