CN-224234108-U - Encapsulation structure of perovskite device and perovskite solar cell

CN224234108UCN 224234108 UCN224234108 UCN 224234108UCN-224234108-U

Abstract

The utility model discloses a perovskite device packaging structure and a perovskite solar cell, and relates to the field of perovskite solar cells. The perovskite device packaging structure comprises a glass substrate, a perovskite device, a conductive adhesive tape, a butyl adhesive tape, a packaging adhesive film and a glass cover plate, wherein the conductive adhesive tape comprises a conductive connecting section and a conductive leading-out section, the conductive connecting section is connected with the perovskite device, one end of the conductive leading-out section is connected with the conductive connecting section, the other end of the conductive leading-out section extends to the outer side of the glass substrate along the direction away from the perovskite device to be connected with an external circuit, a groove is formed in the glass substrate, the butyl adhesive tape or the glass cover plate, the groove corresponds to the conductive leading-out section, and the conductive leading-out section is embedded in the groove. According to the utility model, the accommodating space of the conductive adhesive tape is formed by reserving the grooves, so that the conductive adhesive tape is embedded, the bulge caused by the thickness of the adhesive tape is eliminated, a continuous and void-free sealing layer is formed, the waterproof vapor permeation capacity of the assembly is obviously improved, and the service life of the perovskite battery is prolonged.

Inventors

LI JIAFENG
BAO ZHENG
XU FAN
YANG XIAOYU
YE FENGJUN
TU YONGGUANG

Assignees

北京烁威光电科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250523

Claims (10)

1. A packaging structure of perovskite device is characterized in that the packaging structure comprises a glass substrate, perovskite devices, conductive adhesive tapes, butyl adhesive tapes, packaging adhesive films and a glass cover plate, The perovskite device is deposited on the surface of the glass substrate, the conductive adhesive tapes are adhered on two sides of the perovskite device, the butyl adhesive tapes are adhered on the periphery of the glass substrate, the packaging adhesive film is adhered on the inner side of the butyl adhesive and the surface of the perovskite device, and the glass cover plate is arranged on the surface of the packaging adhesive film; The conductive adhesive tape comprises a conductive connecting section and a conductive leading-out section, wherein the conductive connecting section is connected with the perovskite device, one end of the conductive leading-out section is connected with the conductive connecting section, the other end of the conductive leading-out section extends to the outer side of the glass substrate along the direction away from the perovskite device so as to be connected with an external circuit, a groove is formed in the glass substrate, the butyl adhesive tape or the glass cover plate, the groove corresponds to the conductive leading-out section, and the conductive leading-out section is embedded in the groove.
2. The package structure of a perovskite device according to claim 1, wherein a bending section is provided between the conductive connection section and the conductive lead-out section.
3. A perovskite device package structure according to claim 1, wherein the width of the groove is 0.1-3mm wider than the width of the conductive tape, and the width of the groove is 4-8mm.
4. A perovskite device package structure according to claim 1, wherein the depth of the recess is 0.06-0.2mm.
5. The package structure of claim 4, wherein the depth of the groove is 0.01-0.02mm smaller than the thickness of the conductive tape when the groove is arranged on the glass substrate or the glass cover plate, and the length of the groove is 4-7.5mm.
6. The package structure of claim 4, wherein when the groove is formed on the butyl tape, the depth of the groove is 1/8-1/2 of the thickness of the butyl tape, the depth of the groove is 0.01-0.02mm greater than the thickness of the conductive tape, and the length of the groove is the bandwidth of the butyl tape.
7. The package structure of a perovskite device according to claim 1, wherein the butyl tape is quadrilateral, the inner side of the butyl tape is 4-7.5mm away from the peripheral edge of the perovskite device, and the outer side of the butyl tape is 1-2mm away from the peripheral edge of the perovskite device.
8. The encapsulation structure of a perovskite device according to claim 1, wherein the perovskite device comprises a PIN type perovskite device or a NIP type perovskite device.
9. The package structure of a perovskite device according to claim 8, wherein the PIN type perovskite device comprises a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer and a top electrode which are sequentially deposited on the glass substrate, and etching is performed by laser after each film layer is deposited, so that a multi-cell series connection assembly is formed.
10. A perovskite solar cell, characterized in that it comprises an encapsulation structure of a perovskite device according to any one of claims 1-9.

Description

Encapsulation structure of perovskite device and perovskite solar cell Technical Field The application relates to the field of perovskite solar cells, in particular to a perovskite device packaging structure and a perovskite solar cell. Background During the encapsulation process of the perovskite device, the conductive tape needs to be led out from the glass edge of the perovskite device to connect with an external circuit. However, in the conventional packaging technology, since the conductive tape is directly attached between the perovskite device glass and the butyl tape, the bump is easily formed due to the thickness of the conductive tape during lamination packaging, so that a tiny gap is formed between the packaging material (such as the butyl tape) and the conductive tape (refer to fig. 2). Moisture can permeate into the device through the gaps, so that the perovskite active layer is degraded, and the service life and the performance of the perovskite device are affected. Therefore, a structure capable of eliminating the package void of the butyl tape region is needed. Disclosure of utility model An object of an embodiment of the present application is to provide a perovskite device package structure and a perovskite solar cell capable of preventing the perovskite device from being intruded by moisture through structural optimization. In a first aspect, the present utility model provides a perovskite device package structure, comprising a glass substrate, a perovskite device, a conductive tape, a butyl tape, a packaging adhesive film and a glass cover plate; the perovskite device is deposited on the surface of the glass substrate, the conductive adhesive tapes are adhered on two sides of the perovskite device, the butyl adhesive tapes are adhered on the periphery of the glass substrate, the packaging adhesive film is adhered on the inner side of the butyl adhesive and the surface of the perovskite device, and the glass cover plate is arranged on the surface of the packaging adhesive film; The conductive adhesive tape comprises a conductive connecting section and a conductive leading-out section, wherein the conductive connecting section is connected with the perovskite device, one end of the conductive leading-out section is connected with the conductive connecting section, the other end of the conductive leading-out section extends to the outer side of the glass substrate along the direction away from the perovskite device so as to be connected with an external circuit, a groove is formed in the glass substrate, the butyl adhesive tape or the glass cover plate, the groove corresponds to the conductive leading-out section, and the conductive leading-out section is embedded in the groove. In an alternative embodiment, a bending section is arranged between the conductive connecting section and the conductive lead-out section. In an alternative embodiment, the width of the groove is 0.1-3mm wider than the width of the conductive tape, and the width of the groove is 4-8mm. In an alternative embodiment, the depth of the groove is 0.06-0.2mm. In an alternative embodiment, when the groove is arranged on the glass substrate or the glass cover plate, the depth of the groove is 0.01-0.02mm smaller than the thickness of the conductive adhesive tape, and the length of the groove is 4-7.5mm. In an alternative embodiment, when the groove is arranged on the butyl rubber belt, the depth of the groove is 1/8-1/2 of the thickness of the butyl rubber belt, the depth of the groove is 0.01-0.02mm greater than the thickness of the conductive rubber belt, and the length of the groove is the bandwidth of the butyl rubber belt. In an alternative embodiment, the butyl tape is quadrilateral, the inner side of the butyl tape is 4-7.5mm away from the peripheral edge of the perovskite device, and the outer side of the butyl tape is 1-2mm away from the peripheral edge of the perovskite device. In an alternative embodiment, the perovskite device comprises a PIN perovskite device or a NIP perovskite device. In an alternative embodiment, the PIN perovskite device comprises a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer and a top electrode which are sequentially deposited on the glass substrate, and etching is performed by laser after each film layer is deposited, so that a multi-cell series-connection assembly is formed. In a second aspect, the present utility model provides a perovskite solar cell comprising an encapsulation structure of a perovskite device as claimed in any one of the preceding embodiments. The utility model has the beneficial effects that: According to the utility model, through optimizing the structure of the glass substrate, the butyl adhesive tape or the glass cover plate, the grooves are reserved on the glass substrate, the butyl adhesive tape or the glass cover plate, so that the accommodating space of the conductive adhesive tape is formed, the conduc