CN-224234119-U - Semiconductor wafer transfer monitoring apparatus

CN224234119UCN 224234119 UCN224234119 UCN 224234119UCN-224234119-U

Abstract

The present disclosure provides a semiconductor wafer transfer monitoring apparatus including measuring vibration of a component during semiconductor wafer transfer. The measured vibration is analyzed to detect collisions or scratches of the semiconductor wafer during the transfer. At least one remedial action is performed in response to detecting a collision or scratch of the semiconductor wafer, such as outputting a notification of the collision or scratch or stopping the transfer of the semiconductor wafer. The element measuring its vibration may be a wafer transfer robot used in transfer. Analysis of the measured vibration may include inputting the measured vibration into an Artificial Intelligence (AI) algorithm trained to detect collisions or scratches of the semiconductor wafer.

Inventors

Jian Junying
ZHANG TINGHAO
LIN ZIXIU
QIAN WENQI
ZHANG JUNWEI

Assignees

台湾积体电路制造股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250121
Priority Date: 20240220

Claims (10)

1. A semiconductor wafer transfer monitoring apparatus operable in conjunction with an associated semiconductor wafer transfer apparatus, the semiconductor wafer transfer monitoring apparatus comprising: A shock sensor operatively connected to measure measured shock data of an element of an associated semiconductor wafer transfer apparatus during performance of a semiconductor wafer transfer by the associated semiconductor wafer transfer apparatus, and An electronic processor programmed to analyze the measured shock data to detect a problem with the semiconductor wafer transfer and to perform at least one remedial action in response to detection of the problem with the semiconductor wafer transfer.
2. The semiconductor wafer transfer monitoring apparatus of claim 1, wherein the at least one remedial action comprises stopping the semiconductor wafer transfer performed by the associated semiconductor wafer transfer apparatus or outputting a warning indicative of the problem.
3. The semiconductor wafer transport monitoring apparatus of claim 1, wherein the electronic processor is programmed to analyze the measured shock data to detect the problem with the semiconductor wafer transport via an artificial intelligence algorithm that inputs the measured shock data to the problem trained to detect the semiconductor wafer transport.
4. The semiconductor wafer transfer monitoring apparatus of claim 1, wherein the electronic processor is programmed to analyze the measured shock data to detect the problem with the semiconductor wafer transfer by comparing the measured shock data to reference shock data representative of a successful semiconductor wafer transfer.
5. The semiconductor wafer transfer monitoring apparatus of claim 1, wherein the shock sensor is operatively connected to measure shock data of a wafer transfer robot of the associated semiconductor wafer transfer apparatus.
6. The semiconductor wafer transfer monitoring apparatus of claim 1, wherein the electronic processor is programmed to analyze the shock data to detect the problem with the semiconductor wafer transfer includes a collision of a semiconductor wafer transferred by the semiconductor wafer transfer, a formation of at least one scratch on a semiconductor wafer transferred by the semiconductor wafer transfer, or an angled insertion or removal of a semiconductor wafer transferred by the semiconductor wafer transfer to or from a wafer storage tank.
7. The semiconductor wafer transport monitoring apparatus of claim 1, wherein the electronic processor is further programmed to: receiving control data related to the semiconductor wafer transfer; Determining from the control data a stage of the semiconductor wafer transfer at the moment of the problem of the semiconductor wafer transfer, and The problems of the semiconductor wafer transfer are classified based at least in part on the stage of the semiconductor wafer transfer at the time of the problem of the semiconductor wafer transfer.
8. The semiconductor wafer transfer monitoring apparatus of claim 7, wherein the electronic processor is programmed to receive the control data related to the semiconductor wafer transfer from the associated semiconductor wafer transfer apparatus.
9. A semiconductor wafer transfer monitoring apparatus, comprising: A wafer transfer robot for transferring semiconductor wafers between a wafer carrier and a semiconductor wafer processing or characterization tool; a vibration sensor for measuring vibration of the wafer transfer robot, and An electronic processor programmed to detect problems with semiconductor wafer transfer performed by the wafer transfer robot via analysis of vibrations of the wafer transfer robot measured by the vibration sensor during transfer.
10. The semiconductor wafer transfer monitoring apparatus of claim 9, wherein the shock sensor is disposed on the wafer transfer robot and the shock sensor comprises: A wireless transceiver or transmitter to transmit the measurement of the vibration of the wafer transfer robot from the vibration sensor to the electronic processor.

Description

Semiconductor wafer transfer monitoring apparatus Technical Field The present disclosure relates to a semiconductor wafer transfer monitoring apparatus and a semiconductor wafer transfer monitoring method. Background The following relates to semiconductor fabrication techniques, semiconductor wafer transfer techniques, and related techniques. Disclosure of utility model According to some embodiments of the present disclosure, a semiconductor wafer transfer monitoring apparatus operates in conjunction with an associated semiconductor wafer transfer apparatus. The semiconductor wafer transfer monitoring apparatus includes a shock sensor operatively connected to measure shock data of an element of the associated semiconductor wafer transfer apparatus during performance of the semiconductor wafer transfer by the associated semiconductor wafer transfer apparatus, and an electronic processor programmed to analyze the measured shock data to detect a problem with the semiconductor wafer transfer and to perform at least one remedial action in response to detection of the problem with the semiconductor wafer transfer. According to some embodiments of the present disclosure, a semiconductor wafer transfer monitoring method includes measuring vibration of an element during transfer of a semiconductor wafer, and analyzing the measured vibration to detect a collision or scratch of the semiconductor wafer during transfer, and performing at least one remedial action in response to detection of the collision or scratch of the semiconductor wafer. According to some embodiments of the present disclosure, a semiconductor wafer transfer apparatus includes a wafer transfer robot configured to transfer a semiconductor wafer between a wafer carrier and a semiconductor wafer processing or characterization tool, a shock sensor for measuring a shock of the wafer transfer robot, and an electronic processor programmed to detect a problem of transfer of the semiconductor wafer performed by the wafer transfer robot by analyzing the shock of the wafer transfer robot measured by the shock sensor during transfer. In order to make the above features and advantages of the present disclosure more comprehensible, embodiments accompanied with figures are described in detail below. Drawings Aspects of the disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawing figures. It should be noted that the various features are not drawn to scale in accordance with standard practices in the industry. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Fig. 1 schematically illustrates a combination of a semiconductor wafer handling monitoring apparatus and a semiconductor wafer handling apparatus. Fig. 2 schematically illustrates an automated semiconductor wafer transport monitoring method. Fig. 3 and 4 schematically present some modes of vibration that may be characteristic of various problems. Fig. 5 schematically illustrates another non-limiting illustrative embodiment of shock analysis of an automated semiconductor wafer transfer monitoring method. Description of the reference numerals 10 Wafer transfer robot 12 Base 14 Mechanical arm 16 Load port 18 Front opening wafer transfer box and FOUP 20 Slot 22 Wafer 30, 31 Vibration sensor 32 Electronic processor 34. 35, 36 Transceiver 37 Vibration data 38 Battery 40 Analysis Wafer transfer problem remediator 42 43 Collision with 44 Notification 46 Output device 48 Signal 50 Control data 60. 62, 64, 66, 70, 72, 74, 76, 78: Operation 64-1, 64-2, 64-3 Detection operation 70-1, 70-2, 70-3 Decision operations 72-1, 72-2, 72-3: Remedial action Detailed Description The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, these elements and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature is formed in direct contact with the second feature, and may further include embodiments in which additional features may be formed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. Such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as "under," "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another