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CN-224234120-U - Wafer carrier leveling device

CN224234120UCN 224234120 UCN224234120 UCN 224234120UCN-224234120-U

Abstract

The utility model discloses a wafer carrying table leveling device which comprises a first carrying table, a first adjusting assembly and a second carrying table. The first plummer is used for bearing the wafer, and first adjusting component includes a plurality of first actuating mechanism, and first actuating mechanism is used for driving first plummer and goes up and down, and the second plummer sets up around first plummer, and the second plummer is used for bearing the mask plate. The wafer carrier leveling device can ensure the uniformity of the surface coating of the wafer, thereby improving the coating quality, preventing the back surface of the wafer from being polluted by the coating liquid, reducing the production period, improving the production efficiency, reducing the production cost and improving the utilization rate of the coating liquid.

Inventors

  • Request for anonymity
  • Request for anonymity

Assignees

  • 德沪涂膜设备(苏州)有限公司

Dates

Publication Date
20260512
Application Date
20250303

Claims (10)

  1. 1. A wafer carrier leveling device, comprising: The first bearing table is used for bearing the wafer; The first adjusting assembly comprises a plurality of first driving mechanisms, and the first driving mechanisms are used for driving the first bearing table to lift; The second bearing table is arranged around the first bearing table and is used for bearing the mask plate.
  2. 2. The wafer carrier leveling device of claim 1, further comprising at least two pressure measurement modules disposed above the first carrier, the pressure measurement modules configured to measure pressure values of the pressure measurement modules when in contact with different locations of the first carrier, the first drive mechanism being adjustable according to the pressure values of the pressure measurement modules.
  3. 3. The wafer carrier leveling device of claim 1, further comprising a base plate, wherein the second carrier is disposed on the base plate, a second adjusting assembly is disposed on a surface of the base plate opposite to the second carrier, and the second adjusting assembly comprises one or more second driving mechanisms, and the second driving mechanisms are used for driving the base plate to lift.
  4. 4. The wafer carrier leveling device of claim 3, further comprising a third adjustment assembly disposed on the base plate and a support plate disposed below the first carrier, the first drive mechanism disposed on the support plate, the third adjustment assembly comprising one or more third drive mechanisms for driving the support plate to lift.
  5. 5. The wafer carrier leveling device of claim 4, wherein the second carrier has a through hole, and the third adjustment assembly is configured to drive the support plate and drive the first carrier to reciprocate in an extending direction of the through hole; The third adjusting assembly can drive the first bearing table to drive the wafer to move in a direction away from the through hole, so that the first bearing table protrudes out of the through hole; The third adjusting assembly can drive the first bearing table to drive the wafer to move in the direction close to the through hole, so that the height difference between the upper surface of the wafer and the upper surface of the mask plate is reduced.
  6. 6. The wafer carrier leveling device of claim 4, wherein the first adjustment assembly further comprises one or more buffer assemblies disposed on a side of the carrier toward the support plate, the buffer assemblies configured to reduce a rate of ascent of the first carrier.
  7. 7. The wafer carrier leveling device of claim 3, further comprising a mounting bracket, wherein the second adjustment assembly is disposed on the mounting bracket, wherein mounting holes are formed in the mounting bracket, and wherein the mounting bracket is secured to the mounting surface by fasteners through the mounting holes.
  8. 8. The wafer carrier leveling device of claim 1, wherein a ball head is arranged at one end of the first driving mechanism, which is close to the first carrier, and a ball socket matched with the ball head is arranged at one surface of the first carrier, which faces the first driving mechanism; The ball socket is directly arranged on one surface of the first bearing table, which faces the first driving mechanism, or a positioning block is arranged on one surface of the first bearing table, which faces the first driving mechanism, and the ball socket is arranged on one surface of the positioning block, which faces the first driving mechanism.
  9. 9. The wafer carrier leveling device of claim 1, wherein a first recess is provided on a side of the first carrier facing the wafer, a first connector is provided on a side of the first carrier facing away from the wafer, the first connector being in communication with the first recess, the first recess being connected to a vacuum pump through the first connector so that the wafer is adsorbed to the first carrier.
  10. 10. The wafer carrier leveling device of claim 1, wherein a second groove is formed in a surface of the second carrier facing the mask plate, a second connector communicated with the second groove is formed in the second carrier, and the second groove is connected with a vacuum pump through the second connector so that the mask plate is adsorbed on the second carrier.

Description

Wafer carrier leveling device Technical Field The utility model relates to the technical field of coating equipment, in particular to a leveling device for a wafer carrier. Background With the development of technology, more and more product preparation processes need to use a film preparation technology, and the liquid film preparation technology is widely applied due to the simplicity and practicality. Among the most widely used in the prior art are spin coating and slot coating, each of which has an unused applicability. Spin coating is suitable for coating materials with lower viscosity on a round substrate, and slot coating is suitable for coating materials with high, medium and low viscosity on a square substrate. The spin coating is to place a wafer on a wafer carrying table, drop the coating liquid at the middle position of the wafer, and the wafer carrying table drives the wafer to rotate circumferentially, so that the coating liquid is coated on the surface of the wafer by centrifugal force. However, spin coating is low in the use ratio of the coating liquid, and particularly when the viscosity of the coating liquid is high, not only is the use ratio of the coating liquid low, but also uneven distribution of the coating liquid may be caused. In addition, during the coating process, the coating liquid also contaminates the back surface of the wafer, and a back surface cleaning module is required to be separately arranged, so that unnecessary procedures are increased, and the productivity of equipment is reduced. Disclosure of Invention The utility model aims to provide a wafer carrier leveling device which can ensure the uniformity of coating on the surface of a wafer so as to improve the coating quality, can prevent the coating liquid from polluting the back surface of the wafer, does not need to clean the wafer, shortens the production period, improves the production efficiency, reduces the production cost and can also improve the utilization rate of the coating liquid. The utility model adopts the following technical scheme: A wafer carrier leveling device, comprising: The first bearing table is used for bearing the wafer; The first adjusting assembly comprises a plurality of first driving mechanisms, and the first driving mechanisms are used for driving the first bearing table to lift; The second bearing table is arranged around the first bearing table and is used for bearing the mask plate. Preferably, the device further comprises at least two pressure measurement modules, wherein the pressure measurement modules are arranged above the first bearing table, the pressure measurement modules are used for measuring pressure values when the pressure measurement modules are in contact with different positions of the first bearing table, and the first driving mechanism can be adjusted according to the pressure values of the pressure measurement modules. Preferably, the lifting device further comprises a bottom plate, the second bearing table is arranged on the bottom plate, a second adjusting assembly is arranged on one surface, facing away from the second bearing table, of the bottom plate, the second adjusting assembly comprises one or more second driving mechanisms, and the second driving mechanisms are used for driving the bottom plate to lift. Preferably, the lifting device further comprises a third adjusting assembly arranged on the bottom plate and a supporting plate arranged below the first bearing table, wherein the first driving mechanism is arranged on the supporting plate, the third adjusting assembly comprises one or more third driving mechanisms, and the third driving mechanisms are used for driving the supporting plate to lift. Preferably, the second bearing table is provided with a through hole, and the third adjusting component is used for driving the supporting plate and driving the first bearing table to reciprocate in the extending direction of the through hole; The third adjusting assembly can drive the first bearing table to drive the wafer to move in a direction away from the through hole, so that the first bearing table protrudes out of the through hole; The third adjusting assembly can drive the first bearing table to drive the wafer to move in the direction close to the through hole, so that the height difference between the upper surface of the wafer and the upper surface of the mask plate is reduced. Preferably, the first adjusting assembly further comprises one or more buffer assemblies, the buffer assemblies are arranged on one side of the bearing table facing the supporting plate, and the buffer assemblies are used for reducing the rising speed of the first bearing table. Preferably, the mounting bracket is further included, the second adjusting component is arranged on the mounting bracket, a mounting hole is formed in the mounting bracket, and the fixing piece is used for fixing the mounting bracket on the mounting surface through the mounting hole. Preferably, a ball