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CN-224234122-U - Wafer back cleaning device

CN224234122UCN 224234122 UCN224234122 UCN 224234122UCN-224234122-U

Abstract

The utility model discloses a wafer back cleaning device which comprises an installation table, wherein the installation table comprises a front and back cleaning mechanism, a waterproof shield mechanism and a spin-drying mechanism, the front and back cleaning mechanism comprises a water inlet pipe, one end of the water inlet pipe is fixedly connected with a tee joint, the other two ends of the tee joint are respectively fixedly connected with an upper liquid outlet pipe and a back liquid outlet pipe, one end of the upper liquid outlet pipe is fixedly connected with a cleaning spray head, the cleaning spray head is connected to the installation table through a swing arm mechanism, the protective shield mechanism comprises an inner waterproof shield, the inner waterproof shield is fixedly connected to the upper side of the installation table, and an outer waterproof shield is sleeved on the inner waterproof shield. The utility model can clean the front and back surfaces of the round wafer simultaneously, so as to remove the pollutants on the surface of the round wafer, including the metal particles and organic matters on the back surface, thereby providing higher cleaning effect and better product quality.

Inventors

  • ZHAO WENTAO

Assignees

  • 河北中科微电子有限公司

Dates

Publication Date
20260512
Application Date
20250421

Claims (6)

  1. 1. The wafer back cleaning device comprises a mounting table (1), and is characterized in that the mounting table (1) comprises a front and back cleaning mechanism, a waterproof shield mechanism and a spin-drying mechanism; The front and back cleaning mechanism comprises a water inlet pipe (9), one end of the water inlet pipe (9) is fixedly connected with a three-way head (10), the other two ends of the three-way head (10) are respectively fixedly connected with an upper liquid outlet pipe (11) and a back liquid outlet pipe (6), one end of the upper liquid outlet pipe (11) is fixedly connected with a cleaning spray head (14), and the cleaning spray head (14) is connected onto the mounting table (1) through a swing arm mechanism; The waterproof shield mechanism comprises an inner waterproof shield (3), the inner waterproof shield (3) is fixedly connected to the upper side of the mounting table (1), and an outer waterproof shield (2) is sleeved on the inner waterproof shield (3); The utility model provides a water-proof structure, including spin-drying motor (20), spin-drying motor (20) fixed connection is on the bottom lateral wall of mount table (1), spin-drying motor (20)'s output shaft fixedly connected with motor connection spool (18), the central authorities of interior waterproof guard (3) are the siphunculus form setting, motor connection spool (18) run through the siphunculus form central authorities of interior waterproof guard (3), the upper end fixedly connected with wafer spin-drying head (19) of motor connection spool (18), set up wafer placement machine on wafer spin-drying head (19), the lateral wall of spin-drying motor (20), motor connection spool (18), wafer spin-drying head (19) is run through in proper order to the one end of back drain pipe (6) to correspond from top to bottom with cleaning nozzle (14) position.
  2. 2. The wafer back cleaning device according to claim 1, wherein the swing arm mechanism comprises a mounting plate (7), the mounting plate (7) is fixedly connected to the bottom side wall of the mounting table (1), a swing arm motor (8) is mounted on the mounting table (1), an output shaft of the swing arm motor (8) is fixedly connected with a swing arm rod (12), the swing arm rod (12) penetrates through the side wall of the mounting table (1), the upper end of the swing arm rod (12) is fixedly connected with a cleaning pipe fixing plate (13), one end of the cleaning pipe fixing plate (13) is fixedly connected with a spray head fixing plate (15), the cleaning spray head (14) is fixedly connected to the spray head fixing plate (15), and one section of the upper liquid outlet pipe (11) is fixedly connected to the cleaning pipe fixing plate (13).
  3. 3. A wafer backside cleaning apparatus according to claim 2, wherein the wafer placement mechanism comprises four wafer spin-drying columns (17), and the four wafer spin-drying columns (17) are fixedly connected to the circumferential side wall of the wafer spin-drying head (19) in an annular array.
  4. 4. A wafer backside cleaning apparatus according to claim 3, wherein a drain pipe (5) is fixedly connected to a bottom side wall of the inner waterproof cover (3).
  5. 5. The wafer back surface cleaning device according to claim 4, wherein two shield lifting cylinders (4) are fixedly connected to the side wall of the mounting table (1), and the output ends of the two shield lifting cylinders (4) are fixedly connected with the outer waterproof shield (2).
  6. 6. The wafer back side cleaning apparatus of claim 4, wherein the spin motor (20) is a hollow shaft motor.

Description

Wafer back cleaning device Technical Field The utility model relates to the technical field of semiconductor cleaning, in particular to a wafer back surface cleaning device. Background A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the manufacturing process of the wafer is very complicated and fine. First, it is required to extract high purity silicon from silicon ore and then make it into a cylindrical single crystal silicon ingot. Next, the single crystal silicon ingot is processed into a thin and flat wafer, that is, a wafer by cutting and grinding processes. The wafer manufacturing process comprises the steps of crystal bar growth, crystal bar cutting and detecting, outer diameter grinding, slicing, round edge, surface grinding, etching, defect removing, polishing, cleaning, detecting and the like, wherein the wafer cleaning is a ring which is important in the semiconductor manufacturing process, and the main purpose of the wafer cleaning is to remove particles, organic matters, metal ions and other pollutants on the surface of the wafer so as to ensure the smooth proceeding of the subsequent process and the quality of the final product. In the wafer manufacturing process, the cleaning process runs through the semiconductor manufacturing process because contaminants generated by contact with various organics, particles and metals need to be removed. Firstly, cleaning a single surface of a round wafer, wherein part of pollutants possibly remain to influence the quality of a final product, secondly, cleaning the front surface of the round wafer through a turnover mechanism, and then cleaning the back surface of the round wafer, thereby easily damaging the round wafer and having low working efficiency. Disclosure of utility model The present utility model provides a wafer backside cleaning apparatus to solve the above-mentioned problems in the prior art. In order to achieve the above purpose, the present utility model adopts the following technical scheme: the wafer back surface cleaning device comprises a mounting table, wherein the mounting table comprises a front surface cleaning mechanism, a back surface cleaning mechanism, a waterproof shield mechanism and a spin-drying mechanism; The front and back cleaning mechanism comprises a water inlet pipe, one end of the water inlet pipe is fixedly connected with a three-way head, the other two ends of the three-way head are respectively fixedly connected with an upper liquid outlet pipe and a back liquid outlet pipe, one end of the upper liquid outlet pipe is fixedly connected with a cleaning spray head, and the cleaning spray head is connected to the mounting table through a swing arm mechanism; The waterproof shield mechanism comprises an inner waterproof shield, the inner waterproof shield is fixedly connected to the upper side of the mounting table, and an outer waterproof shield is sleeved on the inner waterproof shield; The spin-drying mechanism comprises a spin-drying motor, the spin-drying motor is fixedly connected to the bottom side wall of the mounting table, an output shaft of the spin-drying motor is fixedly connected with a motor connecting cylinder shaft, the center of the inner waterproof shield is in a tubular shape, the motor connecting cylinder shaft penetrates through the tubular center of the inner waterproof shield, the upper end of the motor connecting cylinder shaft is fixedly connected with a wafer spin-drying head, the wafer spin-drying head is provided with a wafer placing mechanism, and one end of a back drain pipe sequentially penetrates through the spin-drying motor hollow shaft, the motor connecting cylinder shaft and the side wall of the wafer spin-drying head and corresponds to the cleaning nozzle up and down. Preferably, the swing arm mechanism comprises a mounting plate, mounting plate fixed connection is on the bottom lateral wall of mount table, install swing arm motor on the mount table, swing arm motor's output shaft fixedly connected with swing arm pole, the swing arm pole runs through the lateral wall of mount table, the upper end fixedly connected with wash pipe fixed plate of swing arm pole, the one end fixedly connected with shower nozzle fixed plate of wash pipe fixed plate, wash shower nozzle fixed connection is on the shower nozzle fixed plate, one section fixed connection of above drain pipe is on the wash pipe fixed plate. Preferably, the wafer placing mechanism comprises four wafer spin-drying columns, and the four wafer spin-drying columns are fixedly connected to the circumferential side wall of the wafer spin-drying head in an annular array. Preferably, the bottom side wall of the inner waterproof shield is fixedly connected with a liquid discharge pipe. Preferably, two shield lifting cylinders are fixedly connected to the side wall of the mounting table, and the output ends of the two shield lifting cylinders are fixedly connected with the outer waterproof shi