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CN-224234123-U - Wafer processing apparatus

CN224234123UCN 224234123 UCN224234123 UCN 224234123UCN-224234123-U

Abstract

The utility model provides wafer processing equipment which comprises a process chamber, a heating device, a cooling device and a control device, wherein a processing space for processing a wafer is formed in the process chamber, the heating device is arranged in the process chamber and used for increasing the temperature of the processing space, the cooling device is arranged in the process chamber and used for reducing the temperature of the processing space, and the control device is electrically connected with the heating device and the cooling device respectively and is configured to control the cooling device according to the temperature of the processing space or the power of the heating device. According to the wafer processing equipment provided by the utility model, the process chamber is arranged to process the wafer, the cooling device is arranged to cool the process chamber, and when the power of the heating device is too high or the temperature in the process chamber is too high, the cooling device can be used for rapidly cooling the process chamber, so that the temperature of the process chamber can be in a normal range, and the wafer processing process can be normally carried out.

Inventors

  • Guo Tiaoyuan

Assignees

  • 成都高真科技有限公司

Dates

Publication Date
20260512
Application Date
20250418

Claims (10)

  1. 1. A wafer processing apparatus, comprising: a process chamber in which a processing space for performing a process on a wafer is formed; the heating device is arranged in the process chamber and used for increasing the temperature of the processing space; a cooling device disposed in the process chamber for reducing a temperature of the process space; and a control device electrically connected to the heating device and the cooling device, respectively, and configured to control the cooling device according to a temperature of the processing space or a power of the heating device.
  2. 2. The wafer processing apparatus of claim 1, wherein the process chamber comprises a top wall, a bottom wall, and a peripheral wall, the top wall being disposed opposite the bottom wall in a first direction, the peripheral wall being annular in shape, and two ends of the peripheral wall being connected to the top wall and the bottom wall, respectively, in the first direction, the top wall, the bottom wall, and the peripheral wall forming the processing space therebetween, the heating device and the cooling device being disposed in the peripheral wall.
  3. 3. The wafer processing apparatus according to claim 2, wherein the cooling device has a cooling passage through which a cooling liquid flows, the control device includes a controller and a control valve provided in the cooling passage, and the controller is electrically connected to the heating device and the control valve, respectively, and is configured to adjust opening and closing and opening of the control valve.
  4. 4. The wafer processing apparatus according to claim 3, wherein the cooling device includes at least one cooling tube provided to the peripheral wall and extending in a direction surrounding the processing space, the cooling tube having the cooling passage formed therein.
  5. 5. The wafer processing apparatus according to claim 4, wherein the number of the cooling pipes and the number of the control valves are plural, and the control valves are provided to at least two of the cooling pipes.
  6. 6. The wafer processing apparatus of claim 5, wherein the number of cooling tubes is less than 1000, and a plurality of the cooling tubes are spaced apart along the first direction.
  7. 7. The wafer processing apparatus according to claim 6, wherein at least two of the cooling pipes are different in diameter among all of the cooling pipes.
  8. 8. The wafer processing apparatus of claim 7, wherein the diameter of the cooling tube increases in sequence along the first direction.
  9. 9. The wafer processing apparatus of claim 4, wherein the cooling tube has a diameter between one quarter inch and one inch; and/or the cooling tube has an extension length of between 1 meter and 2 meters.
  10. 10. The wafer processing apparatus according to any one of claims 2 to 9, wherein the heating means comprises at least one heating tube provided to the peripheral wall and extending in a direction surrounding the processing space.

Description

Wafer processing apparatus Technical Field The utility model relates to the technical field of wafers, in particular to wafer processing equipment. Background This section provides merely background information related to the present disclosure and is not necessarily prior art. Heaters are commonly used in wafer processing to regulate the wall temperature of the process chamber, but their primary purpose is to heat. If a plasma is generated within the process chamber, additional heat will be generated within the process chamber. At this time, the wall temperature is higher than the preset temperature due to the heat conducted by the plasma. To control the rising wall temperature, the heater power is turned off or the power level of the heater is lowered to control the wall temperature. However, if the speed of controlling the heater is too slow at this time, various problems may occur, such as poor thickness uniformity of the wafer or excessive thickness, due to the rise of the chamber wall temperature. Disclosure of utility model The utility model aims to at least solve the technical problem that the temperature control speed of the existing wafer processing equipment is low. The aim is achieved by the following technical scheme: The present utility model provides a wafer processing apparatus including: a process chamber in which a processing space for performing a process on a wafer is formed; the heating device is arranged in the process chamber and used for increasing the temperature of the processing space; a cooling device disposed in the process chamber for reducing a temperature of the process space; and a control device electrically connected to the heating device and the cooling device, respectively, and configured to control the cooling device according to a temperature of the processing space or a power of the heating device. According to the wafer processing equipment provided by the utility model, the process chamber is arranged to process the wafer, the cooling device is arranged to cool the process chamber, and when the power of the heating device is too high or the temperature in the process chamber is too high, the cooling device can be used for rapidly cooling the process chamber, so that the temperature of the process chamber can be in a normal range, and the wafer processing process can be normally carried out. In addition, the wafer processing apparatus according to the present utility model may further have the following additional technical features: In some embodiments of the present utility model, the process chamber includes a top wall, a bottom wall, and a peripheral wall, the top wall is disposed opposite to the bottom wall along a first direction, the peripheral wall is annular, two ends of the peripheral wall are respectively connected to the top wall and the bottom wall along the first direction, the processing space is formed among the top wall, the bottom wall, and the peripheral wall, and the heating device and the cooling device are both disposed on the peripheral wall. In some embodiments of the present utility model, the cooling device has a cooling channel through which a cooling liquid flows, and the control device includes a controller and a control valve, the control valve is provided in the cooling channel, and the controller is electrically connected to the heating device and the control valve, respectively, and is used for adjusting opening and closing of the control valve. In some embodiments of the utility model, the cooling device comprises at least one cooling tube provided to the peripheral wall and extending in a direction surrounding the processing space, the cooling tube having the cooling passage formed therein. In some embodiments of the present utility model, the number of the cooling pipes and the number of the control valves are multiple, and at least two of the cooling pipes are provided with the control valves. In some embodiments of the utility model, the number of cooling tubes is less than 1000, and a plurality of the cooling tubes are spaced apart along the first direction. In some embodiments of the utility model, at least two of the cooling tubes are different in diameter throughout the cooling tubes. In some embodiments of the utility model, the diameter of the cooling tube increases sequentially in the first direction. In some embodiments of the utility model, the cooling tube has a diameter between one quarter inch and one inch; and/or the cooling tube has an extension length of between 1 meter and 2 meters. In some embodiments of the utility model, the heating means comprises at least one heating tube arranged to the peripheral wall and extending in a direction surrounding the treatment space. Drawings Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred