CN-224234125-U - Four-head die bonding equipment

CN224234125UCN 224234125 UCN224234125 UCN 224234125UCN-224234125-U

Abstract

The utility model is applicable to the technical field of semiconductor production, and provides four-head die bonding equipment which comprises a workbench, a product conveying mechanism, a translation adjusting mechanism, two first die bonding heads and two second die bonding heads. Compared with the four-head die bonding equipment in the prior art, when the specification of a product changes and the spacing between bonding pads changes, the first translation part can be driven by the first driving group to move along the second direction so as to change the distance between the two first die bonding heads and the two second die bonding heads, and meanwhile, the second translation part can be driven by the second driving group to move along the first direction so as to adjust the two first die bonding heads, or the second translation part is driven by the second driving group to move along the first direction so as to adjust the spacing between the two second die bonding heads, so that the equipment can be suitable for die bonding production of products with various specifications, and the applicability of the equipment is improved.

Inventors

CHEN ZHUOZHAO
BI JINGXIN
Lan Lisan

Assignees

深圳新益昌科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250421

Claims (10)

1. Four-head die bonding equipment, characterized by comprising: The working table is provided with a first working area and a second working area; the product conveying mechanism is arranged on the workbench, is positioned between the first working area and the second working area and is used for conveying products along a first direction; The translation adjusting mechanisms are respectively arranged in the first working area and the second working area, each translation adjusting mechanism comprises a first translation part, a first driving group, a second translation part and a second driving group, the first translation parts are arranged on the workbench in a sliding mode, the first driving groups are arranged between the workbench and the first translation parts and used for driving the first translation parts to slide back and forth along a second direction, the second direction is arranged at an included angle with the first direction, the second translation parts are arranged on the first translation parts in a sliding mode, the second driving groups are arranged between the first translation parts and the second translation parts, and the second driving groups are used for driving the second translation parts to slide back and forth along the first direction; The first die bonding heads are arranged in the first working area at intervals along the first direction, one of the first die bonding heads is arranged on the first translation part, the other is arranged on the second translation part, and The number of the second die bonding heads is two, the second die bonding heads are both positioned in the second working area, the two second die bonding heads are arranged at intervals along the first direction, one of the second die bonding heads is arranged on the first translation part, and the other of the second die bonding heads is arranged on the second translation part.
2. The four-head die bonding apparatus according to claim 1, wherein a first sliding group is arranged between the first translation part and the workbench, a second sliding group is also arranged between the second translation part and the first translation part, the first sliding group and the second sliding group both comprise sliding guide rails and sliding blocks, and the sliding blocks are arranged on the sliding guide rails and can slide along the length direction of the sliding guide rails.
3. The four-head die bonding apparatus according to claim 2, wherein the first driving unit includes a first connecting block, a first rotating screw and a first power unit, the first rotating screw is rotatably disposed on the workbench along the second direction, the first connecting block is disposed on the first translation portion and is in threaded connection with the first rotating screw, the driving end of the first power unit is connected with the first rotating screw, and the first power unit is used for driving the first rotating screw to rotate around its own axis.
4. The four-head die bonding apparatus of claim 1, wherein two of the first die bonding heads are disposed opposite each other along the first direction, a first die supply group is disposed between the two of the first die bonding heads, the first die supply group is configured to provide wafers to the two of the first die bonding heads, and two of the second die bonding heads are disposed opposite each other along the first direction, a second die supply group is disposed between the two of the second die bonding heads, and the second die supply group is configured to provide wafers to the two of the second die bonding heads.
5. The four-head die bonding apparatus according to claim 4, wherein the first die-supplying unit includes a first feeding mechanism and two first separating units, the first feeding mechanism is disposed on the first translating portion, the two first separating units are respectively disposed on two sides of the first feeding mechanism, one of the first separating units is disposed on the first translating portion, the other first separating unit is disposed on the second translating portion, the first feeding mechanism is used for accommodating and providing a die ring, the first separating units are used for supporting the die ring and separating a wafer from the die ring, and a first conveying mechanism is disposed between the two first separating units and the first feeding mechanism, and is used for conveying the die ring from the first feeding mechanism to the first separating units.
6. The four-head die bonding apparatus of claim 5, wherein the first separation group comprises a wafer ring rotation platform for supporting the wafer ring and a thimble mechanism located below the wafer ring for separating a wafer from the wafer ring.
7. The four-head die bonding apparatus according to claim 6, wherein the wafer ring rotating platform comprises a rotating frame body, a rotating frame support and a wafer ring translation assembly, the rotating frame support is arranged on the wafer ring translation assembly, the wafer ring translation assembly is used for adjusting the position of the rotating frame support in the horizontal direction, and the rotating frame body is rotatably arranged on the rotating frame support and can move along with the rotating frame support, so as to support the wafer ring and adjust the angle of the wafer ring in the horizontal direction through rotation of the rotating frame support.
8. The four-head die bonding apparatus according to claim 5, wherein the first feeding mechanism comprises a crystal ring accommodating bin and a lifting group, a plurality of placing structures for placing crystal rings are arranged in the crystal ring accommodating bin, the placing structures are sequentially arranged along the height direction of the crystal ring accommodating bin, and the lifting group is arranged between the crystal ring accommodating bin and the first translation part and is used for adjusting the height of the crystal ring accommodating bin.
9. The four-head die bonding apparatus of claim 1, wherein the first die bonding head and the second die bonding head each comprise a die bonding support, a die bonding power unit and a swing arm assembly, the die bonding power unit is connected to the die bonding support, the die bonding power unit is used for driving the swing arm assembly to swing, and the swing arm assembly is connected to a driving end of the die bonding power unit for sucking and transporting wafers.
10. The four-head die bonding apparatus according to claim 1, wherein the product transporting mechanism comprises a transporting base, a first transporting portion slidably disposed on the transporting base along the first direction, a second transporting portion slidably disposed on the first transporting portion along the second direction, and a supporting transporting frame disposed on a top surface of the second transporting portion, and the supporting transporting frame is configured to support and adjust a position of the product along the first direction.

Description

Four-head die bonding equipment Technical Field The utility model belongs to the technical field of semiconductor production, and particularly relates to four-head die bonding equipment. Background The die bonder is one of devices for manufacturing semiconductor devices, and is used for connecting a wafer with other components to realize die bonding, so that a multi-head die bonding device can be used for die bonding an oversized substrate for a specific product such as the oversized substrate. However, most of the existing multi-head die bonding equipment can only carry out die bonding processing on products with specific types, and cannot be adjusted when the types of the products are changed (such as the interval between bonding pads on the products is changed), so that the problem of poor applicability of the multi-head die bonding equipment is caused. Disclosure of utility model The utility model aims to provide four-head die bonding equipment, which aims to solve the technical problem that the die bonding equipment in the prior art cannot be adjusted according to products in use and has poor applicability. The utility model is realized in such a way that a four-head die bonding device comprises: The working table is provided with a first working area and a second working area; the product conveying mechanism is arranged on the workbench, is positioned between the first working area and the second working area and is used for conveying products along a first direction; The translation adjusting mechanisms are respectively arranged in the first working area and the second working area, each translation adjusting mechanism comprises a first translation part, a first driving group, a second translation part and a second driving group, the first translation parts are arranged on the workbench in a sliding mode, the first driving groups are arranged between the workbench and the first translation parts and used for driving the first translation parts to slide back and forth along a second direction, the second direction is arranged at an included angle with the first direction, the second translation parts are arranged on the first translation parts in a sliding mode, the second driving groups are arranged between the first translation parts and the second translation parts, and the second driving groups are used for driving the second translation parts to slide back and forth along the first direction; The first die bonding heads are arranged in the first working area at intervals along the first direction, one of the first die bonding heads is arranged on the first translation part, the other is arranged on the second translation part, and The number of the second die bonding heads is two, the second die bonding heads are both positioned in the second working area, the two second die bonding heads are arranged at intervals along the first direction, one of the second die bonding heads is arranged on the first translation part, and the other of the second die bonding heads is arranged on the second translation part. In an alternative embodiment, a first sliding group is arranged between the first translation part and the workbench, a second sliding group is further arranged between the second translation part and the first translation part, the first sliding group and the second sliding group both comprise sliding guide rails and sliding blocks, and the sliding blocks are arranged on the sliding guide rails and can slide along the length directions of the sliding guide rails. In an alternative embodiment, the first driving set includes a first connecting block, a first rotating screw and a first power unit, the first rotating screw is rotatably disposed on the workbench along the second direction, the first connecting block is disposed on the first translation portion and is in threaded connection with the first rotating screw, the driving end of the first power unit is connected with the first rotating screw, and the first power unit is used for driving the first rotating screw to rotate around its own axis. In an alternative embodiment, the two first die bonding heads are oppositely arranged along the first direction, a first die supply group is arranged between the two first die bonding heads, the first die supply group is used for providing wafers for the two first die bonding heads, the two second die bonding heads are oppositely arranged along the first direction, a second die supply group is arranged between the two second die bonding heads, and the second die supply group is used for providing wafers for the two second die bonding heads. In an optional embodiment, the first crystal feeding set includes a first feeding mechanism and two first separation sets, the first feeding mechanism is disposed on the first translation portion, the two first separation sets are respectively located at two sides of the first feeding mechanism, one of the first separation sets is located at the first translation p