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CN-224234130-U - Chip thermal packaging equipment with temperature feedback control

CN224234130UCN 224234130 UCN224234130 UCN 224234130UCN-224234130-U

Abstract

The utility model relates to the technical field of chip thermal sealing, and discloses a chip thermal sealing device with temperature feedback control, which comprises a thermal sealing box body, an electric push rod and an auxiliary sealing device consisting of a lifting piece, an auxiliary piece and a carrier plate, wherein the electric push rod is arranged at the top end of the thermal sealing box body and is connected with the top of the thermal sealing box body in a matched manner through an adapting bolt, the auxiliary sealing device is arranged in the thermal sealing box body, the auxiliary deblocking device is characterized in that the main body is a lifting part, an auxiliary part and a carrying plate are arranged inside the lifting part, the top end of the auxiliary part is correspondingly welded with the output push rod of the electric push rod, a group of chip bodies which are distributed at equal intervals are arranged inside the carrying plate, the chip thermal deblocking device is simple in structure, and the auxiliary deblocking device is matched to realize large-batch accurate thermal deblocking treatment, so that the working efficiency is greatly improved.

Inventors

  • SUN XIAOBO

Assignees

  • 开芯半导体(深圳)有限公司

Dates

Publication Date
20260512
Application Date
20250507

Claims (6)

  1. 1. The chip thermal sealing equipment with the temperature feedback control comprises a thermal sealing box body (1) and an electric push rod (2), and an auxiliary sealing device consisting of a lifting piece (3), an auxiliary piece (4) and a carrying plate (6), and is characterized in that the electric push rod (2) is arranged at the top end of the thermal sealing box body (1), the electric push rod (2) is connected with the top of the thermal sealing box body (1) in a matched mode through an adaptive bolt, the auxiliary sealing device is arranged inside the thermal sealing box body (1), the auxiliary sealing device body is the lifting piece (3), the auxiliary piece (4) and the carrying plate (6) are arranged inside the lifting piece (3), the top end of the auxiliary piece (4) corresponds to the output push rod of the electric push rod (2) to be welded, and a group of chip bodies (7) which are distributed at equal intervals are arranged inside the carrying plate (6).
  2. 2. The chip thermal sealing equipment with temperature feedback control according to claim 1, wherein a heating table (8) is arranged at the bottom end inside the thermal sealing box body (1), two sliding grooves I (10) which are in axisymmetric distribution are formed in two opposite side walls inside the thermal sealing box body (1), a matching hole I (9) is formed in the center of the top end of the thermal sealing box body (1), four connecting holes which are in axisymmetric distribution are formed in the periphery of the matching hole I (9), the connecting holes are connected with an electric push rod (2) in a matching mode through matching bolts, a control device (5) is arranged on the side wall of the thermal sealing box body (1), and a rectangular opening is formed in the top end of the side wall of the thermal sealing box body (1) corresponding to the control device (5), and penetrates through the thermal sealing box body (1).
  3. 3. The chip thermal sealing device with temperature feedback control according to claim 1, wherein the lifting piece (3) is of an inverted U-shaped structure, the center of the top end of the lifting piece (3) is provided with a second matching hole (12), the second matching hole (12) corresponds to the first matching hole (9), two sliding blocks (11) which are axially symmetrically distributed are arranged on two opposite side walls outside the lifting piece (3), the first sliding blocks (11) are correspondingly connected with the first sliding grooves (10) in a sliding fit manner, the three sliding grooves (14) are formed in two opposite side walls inside the lifting piece (3), fixing grooves (15) are formed in two ends of the three sliding grooves (14), the second sliding grooves (13) are formed in the middle position of the three sliding grooves (14), and the second sliding grooves (13) are vertically distributed with the three sliding grooves (14).
  4. 4. The chip thermal packaging equipment with temperature feedback control as claimed in claim 1, wherein the main body of the auxiliary piece (4) is a rectangular plate, two sliding blocks (16) which are axially symmetrically distributed are arranged at the centers of two opposite side walls of the auxiliary piece (4), the sliding blocks (16) are correspondingly connected with the sliding grooves (13) in a sliding fit manner, a group of inner cavities (17) which are equidistantly distributed are formed at the bottom end of the auxiliary piece (4), the inner cavities (17) are provided with elastic pieces (18), and the bottom ends of the elastic pieces (18) are correspondingly attached to the top of the chip body (7).
  5. 5. The chip thermal packaging device with temperature feedback control as set forth in claim 2, wherein the output push rod of the electric push rod (2) correspondingly passes through the first matching hole (9) and the second matching hole (12), and the bottom end of the output push rod of the electric push rod (2) is correspondingly welded with the center of the top end of the auxiliary piece (4).
  6. 6. The chip thermal sealing device with temperature feedback control according to claim 1, wherein two sliding blocks (19) which are axially symmetrically distributed are arranged on two opposite side walls of the carrying plate (6), the sliding blocks (19) are correspondingly connected with the sliding grooves (14) in a sliding fit manner, the sliding blocks (19) are correspondingly connected with the bottoms of the fixing grooves (15) in a clamping manner, a group of chip placing grooves (20) which are equidistantly distributed are formed in the end face of the carrying plate (6), chip bodies (7) are correspondingly placed in the chip placing grooves (20), a temperature sensor (21) is arranged in the center of the end face of the carrying plate (6), and the bottom end of the carrying plate (6) is correspondingly attached to the top end face of the heating table (8).

Description

Chip thermal packaging equipment with temperature feedback control Technical Field The utility model relates to the technical field of chip thermal sealing, in particular to chip thermal sealing equipment with temperature feedback control. Background In the links of research and development, production, fault detection and the like of semiconductor chips, the thermal sealing operation of the chips is extremely critical, the integration level of the chips is continuously improved along with the rapid development of semiconductor technology, the internal structure is more complex, and the requirements on thermal sealing equipment are also more severe. On the one hand, the temperature control precision is lower, the strict requirements of different chips on the deblocking temperature are difficult to meet, the optimal deblocking temperature range of different types of chips is narrow due to the difference of chip manufacturing processes, the traditional equipment cannot accurately regulate and control the temperature, the internal circuit of the chips is damaged due to overheating in the deblocking process easily, or packaging materials cannot be effectively removed due to insufficient temperature, the deblocking effect is influenced, on the other hand, an effective temperature feedback mechanism is lacked, the traditional equipment cannot monitor the temperature change in the deblocking process of the chips in real time, heating parameters cannot be timely adjusted, the stability and reliability of the deblocking process are poor, the yield of products is difficult to guarantee, in addition, along with the rapid development of the chip industry, higher requirements are also provided for the deblocking efficiency of the chips, the conventional equipment is slow in deblocking speed, the requirements of large-scale production and rapid detection cannot be met, the development of the chip industry is severely restricted, and therefore, the chip thermal deblocking equipment with the temperature feedback control is provided. Disclosure of utility model (One) solving the technical problems Aiming at the defects of the prior art, the utility model provides chip thermal packaging equipment with temperature feedback control, which solves the problems. (II) technical scheme In order to achieve the above purpose, the chip thermal sealing equipment with the temperature feedback control comprises a thermal sealing box body, an electric push rod and an auxiliary sealing device consisting of a lifting piece, an auxiliary piece and a carrying plate, wherein the electric push rod is arranged at the top end of the thermal sealing box body, the electric push rod is connected with the top of the thermal sealing box body in a matched mode through an adapting bolt, the auxiliary sealing device is arranged in the thermal sealing box body, the auxiliary sealing device is mainly composed of the lifting piece, the auxiliary piece and the carrying plate are arranged in the lifting piece, the top end of the auxiliary piece is correspondingly welded with the output push rod of the electric push rod, and a group of chip bodies distributed at equal intervals are arranged in the carrying plate. Preferably, the inside bottom of pyrolysis sealing box is equipped with the heating platform, and pyrolysis sealing box inside two relative lateral walls have all been seted up and are two spout one of axisymmetric distribution, and the mating holes one has been seted up at pyrolysis sealing box top end center, and four connecting holes that are axisymmetric distribution have been seted up around the mating holes, this connecting hole is connected with electric putter cooperation through the adaptation bolt, and pyrolysis sealing box lateral wall is equipped with controlling means, and pyrolysis sealing box corresponds controlling means's lateral wall top end and has been seted up the rectangle mouth, this rectangle mouth runs through pyrolysis sealing box. Preferably, the lifting part is of an inverted U-shaped structure, a second matching hole is formed in the center of the top end of the lifting part, the second matching hole corresponds to the first matching hole, two sliding blocks which are axially symmetrically distributed are arranged on two opposite side walls of the outer portion of the lifting part, the first sliding blocks are correspondingly connected with the first sliding grooves in a sliding fit mode, three sliding grooves are formed in two opposite side walls of the inner portion of the lifting part, fixing grooves are formed in two ends of the three sliding grooves, the second sliding grooves are formed in the middle of the three sliding grooves, and the second sliding grooves are vertically distributed with the three sliding grooves. Preferably, the auxiliary member main part is a rectangle plate, and two opposite side wall centers of auxiliary member are equipped with the slider second that is axisymmetric distribution, and slider