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CN-224234134-U - Cleaning mechanism on wafer chamfering equipment

CN224234134UCN 224234134 UCN224234134 UCN 224234134UCN-224234134-U

Abstract

The utility model discloses a cleaning mechanism on wafer chamfering equipment, which comprises a cleaning tank, a wafer adsorption rotating mechanism, a cleaning nozzle mechanism, a hairbrush cleaning mechanism and a wafer lifting mechanism, wherein the cleaning tank is arranged on the wafer chamfering equipment, the wafer adsorption rotating mechanism is arranged on the cleaning tank, and the wafer adsorption rotating mechanism comprises a vacuum adsorption component for adsorbing a wafer and a driving module for driving the wafer to rotate. According to the design scheme provided by the utility model, through the brush cleaning mechanism and the cleaning nozzle mechanisms arranged at a plurality of positions, the multi-dimensional cleaning of the edges and the surfaces of the wafer after chamfering can be realized, and meanwhile, the wafer lifting mechanism is additionally arranged, so that the area after the wafer is lifted and adsorbed by the sucker can be cleaned for the second time, the cleaning blind area is avoided, and meanwhile, the problem of residual cleaning liquid after the cleaning on the existing equipment is solved through the dual functions of spin-drying and blowing.

Inventors

  • CHEN ZHANGLIANG
  • ZHANG JUNQING

Assignees

  • 上海盈盛通半导体设备有限公司

Dates

Publication Date
20260512
Application Date
20250528

Claims (9)

  1. 1. The utility model provides a wiper mechanism on wafer chamfering equipment which characterized in that includes: The cleaning tank is arranged on the wafer chamfering equipment; the wafer adsorption rotating mechanism is arranged on the cleaning tank and comprises a vacuum adsorption component for adsorbing the wafer and a driving module for driving the wafer to rotate; the cleaning nozzle mechanism is arranged on the cleaning tank and is configured to spray water to clean and spray air to dry towards the upper wall surface and the lower wall surface of the wafer respectively; The brush cleaning mechanism is arranged on the cleaning tank and comprises a brush assembly capable of being attached to the upper wall surface, the lower wall surface and the outer edge of the wafer and a swinging cylinder capable of driving the brush assembly to swing in a reciprocating manner; The wafer lifting mechanism is arranged on the cleaning tank and is used for carrying the wafer out of the wafer adsorption rotating mechanism; When the wafer adsorption rotating mechanism drives the wafer to rotate, the cleaning nozzle mechanism and the brush cleaning mechanism carry out all-round cleaning operation on the wafer.
  2. 2. The cleaning mechanism for a wafer chamfering apparatus as set forth in claim 1, wherein said vacuum chuck comprises a vacuum chuck and a vacuum module connected to the vacuum chuck, wherein a suction end of the vacuum chuck is disposed upward and located at a center of said cleaning tank, a fixing plate for fixing the vacuum chuck to said cleaning tank is further disposed on said vacuum module, and an output end of said driving module is connected to said vacuum module.
  3. 3. The cleaning mechanism for a wafer chamfering apparatus as set forth in claim 1, wherein said cleaning nozzle mechanism comprises a fixed base disposed on said cleaning tank, an upper air blowing joint and an upper water spraying joint are disposed on both sides of an upper end of said fixed base, and a lower air blowing joint and a lower water spraying joint are disposed on both sides of a lower end of said fixed base.
  4. 4. The cleaning mechanism for a wafer chamfering apparatus as set forth in claim 3, wherein said upper air-blowing joint and said lower air-blowing joint are connected with an external air supply module, said upper water-spraying joint and said lower water-spraying joint are connected with an external water supply module, and said upper air-blowing joint and said upper water-spraying joint are detachably provided with an air-spraying pipe and a water-spraying pipe respectively facing the upper wall surface of said wafer, and said lower air-blowing joint and said lower water-spraying joint are detachably provided with an air-spraying pipe and a water-spraying pipe respectively facing the lower wall surface of said wafer.
  5. 5. The cleaning mechanism for a wafer chamfering tool as recited in claim 1, wherein said brush assembly comprises a brush assembly comprising an upper brush, an edge brush and a lower brush that are detachable in sequence, said upper brush, edge brush and said lower brush enclosing a U-shaped brushing space.
  6. 6. The cleaning mechanism of a wafer chamfering apparatus as set forth in claim 5, wherein the top of the upper brush is connected to the output end of the oscillating cylinder via a connecting rod, and the length of the lower brush is smaller than the length of the upper brush.
  7. 7. The cleaning mechanism for a wafer chamfering tool as recited in claim 1, wherein said wafer lifting mechanism comprises a lift cylinder, a second swing cylinder and a second vacuum chuck, said second swing cylinder is mounted at a lift end of said lift cylinder, and a swing end of said second swing cylinder is connected to said second vacuum chuck by a connecting arm.
  8. 8. The cleaning mechanism for a wafer bevel apparatus of claim 7 wherein said brush cleaning mechanism, said cleaning nozzle mechanism and said cleaning tank are all located in the path of said wafer lift mechanism.
  9. 9. The cleaning mechanism for a wafer chamfering tool as recited in claim 1, wherein a plurality of said cleaning nozzle mechanisms are disposed in spaced relation on said cleaning bowl.

Description

Cleaning mechanism on wafer chamfering equipment Technical Field The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a cleaning mechanism on wafer chamfering equipment. Background In the semiconductor wafer processing flow, the chamfering process is used for removing sharp edges and corners of the wafer edge, preventing edge chipping and optimizing the suitability of the subsequent packaging process. And in the chamfering process, silicon scraps, grinding fluid residues, metal ions and other pollutants generated by wafer grinding need to be removed through a cleaning mechanism. The existing cleaning mechanism mainly cleans in a scrubbing mode, in the cleaning process, an edge cleaning blind area exists, so that the wafer is not thoroughly cleaned, and then the wafer is subjected to residual defect of cleaning liquid after cleaning, so that the quality of a subsequent finished product of the wafer is affected, and the improvement space is still provided. Disclosure of utility model The utility model aims to solve the problems, and provides a cleaning mechanism on wafer chamfering equipment. The wafer cleaning mechanism comprises a cleaning tank, a wafer adsorption rotating mechanism, a cleaning nozzle mechanism, a brush cleaning mechanism and a wafer lifting mechanism, wherein the cleaning tank is arranged on the wafer chamfering device, the wafer adsorption rotating mechanism is arranged on the cleaning tank and comprises a vacuum adsorption component for adsorbing a wafer and a driving module for driving the wafer to rotate, the cleaning nozzle mechanism is arranged on the cleaning tank and is configured to spray water and spray air towards the upper wall surface and the lower wall surface of the wafer respectively for drying, the brush cleaning mechanism is arranged on the cleaning tank and comprises a brush component which can be attached to the upper wall surface and the lower wall surface of the wafer and an outer edge of the wafer and a swinging cylinder which can drive the brush component to swing reciprocally, the wafer lifting mechanism is arranged on the cleaning tank and is used for moving the wafer out of the wafer adsorption rotating mechanism, and the cleaning nozzle mechanism and the brush cleaning mechanism are all-round in operation when the wafer adsorption rotating mechanism drives the wafer adsorption rotating mechanism to rotate. In a preferred embodiment, the vacuum adsorption assembly comprises a vacuum chuck and a vacuum module communicated with the vacuum chuck, wherein the adsorption end of the vacuum chuck is upwards arranged and positioned at the central position of the cleaning tank, a fixing plate used for being fixed on the cleaning tank is further arranged on the vacuum module, and the output end of the driving module is connected with the vacuum module. In a preferred embodiment, the cleaning nozzle mechanism comprises a fixing seat arranged on the cleaning tank, an upper blowing joint and an upper water spraying joint are respectively arranged on two sides of the upper end of the fixing seat, and a lower blowing joint and a lower water spraying joint are respectively arranged on two sides of the lower end of the fixing seat. In a preferred embodiment, the upper blowing joint and the lower blowing joint are connected with an external air supply module, the upper water spraying joint and the lower water spraying joint are connected with an external water supply module, the upper blowing joint and the upper water spraying joint are respectively detachably provided with a gas spraying pipe and a water spraying pipe which face the upper wall surface of the wafer, and the lower blowing joint and the lower water spraying joint are respectively detachably provided with a gas spraying pipe and a water spraying pipe which face the lower wall surface of the wafer. In a preferred embodiment, the brush assembly comprises a brush assembly comprising an upper brush, an edge brush and a lower brush which are detachable in sequence, wherein the upper brush, the edge brush and the lower brush form a U-shaped brushing space. In a preferred embodiment, the top of the upper brush is connected to the output end of the oscillating cylinder through a connecting rod, and the length of the lower brush is smaller than that of the upper brush. In a preferred embodiment, the wafer lifting mechanism includes a lifting cylinder, a second swing cylinder and a second vacuum chuck, wherein the second swing cylinder is mounted at a lifting end of the lifting cylinder, and a swing end of the second swing cylinder is connected with the second vacuum chuck through a connecting arm. In a preferred embodiment, the brush cleaning mechanism, the cleaning nozzle mechanism and the cleaning tank are all located in the path of movement of the wafer lift mechanism. In a preferred embodiment, the cleaning nozzle mechanisms are multiple and distributed on