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CN-224234135-U - Automatic film laminating mechanism for wafer

CN224234135UCN 224234135 UCN224234135 UCN 224234135UCN-224234135-U

Abstract

The utility model provides an automatic wafer film laminating mechanism, which relates to the technical field of film laminating mechanisms and comprises a film laminating box, wherein a film releasing mechanism is arranged in the film laminating box, a protective film is arranged in the film releasing mechanism, a film pasting circular cutting mechanism is arranged on the inner top wall of the film laminating box, and a blowing mechanism is arranged on the inner side wall of the film laminating box; the utility model has the advantages that when the movable plate moves downwards, the bottommost end of the semicircular air bag is preferentially contacted with the protective film, the protective film is firstly adhered to the center position of the wafer, the contact area between the protective film and the wafer is continuously increased along with the downward movement of the semicircular air bag, so that bubbles generated when the protective film is adhered to the wafer are reduced, when the movable plate moves downwards, the pressing plate is driven to push the movable rod and the semicircular block to move downwards, the cam rod is driven to rotate and continuously drive the piston plate to reciprocate, when the piston plate moves, the air flow in the hollow plate is continuously pushed into the air nozzle, and then the surface of the wafer is purged by the air flow sprayed by the air nozzle.

Inventors

  • WANG XINGHUA
  • XU LELE
  • LI MENGCHAO

Assignees

  • 苏州河图电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250530

Claims (8)

  1. 1. An automatic wafer film coating mechanism comprises a film coating box (1), and is characterized in that, A film release mechanism (2) is arranged in the film coating box (1), a protective film (3) is arranged in the film release mechanism (2), a film pasting circular cutting mechanism (4) is arranged on the inner top wall of the film coating box (1), a purging mechanism (5) is arranged on the inner side wall of the film coating box (1), and a placing plate (6) is movably inserted in the front side of the film coating box (1); The film pasting circular cutting mechanism (4) is used for pasting a protective film (3) on a wafer and is used for circular cutting the protective film (3), and the blowing mechanism (5) is used for blowing the surface of the wafer.
  2. 2. The automatic wafer film laminating mechanism according to claim 1, wherein the film releasing mechanism (2) comprises a winding drum (21) and a releasing drum (22), the winding drum (21) and the releasing drum (22) are symmetrically arranged on the inner wall of the film laminating box (1), round rods (23) are rotatably arranged in the winding drum (21) and the releasing drum (22), two ends of the protective film (3) are respectively wound on the two round rods (23), a motor is arranged in the winding drum (21), and a rotating shaft of the motor is fixedly connected with one end of each round rod (23).
  3. 3. The automatic wafer film coating mechanism according to claim 2, wherein openings (24) for passing through the protective film (3) are formed in the winding drum (21) and the unwinding drum (22).
  4. 4. The automatic wafer laminating mechanism according to claim 1, wherein the film laminating circular cutting mechanism (4) comprises an electric push rod (41) and a movable plate (42), the electric push rod (41) is fixedly arranged on the inner top wall of the film laminating box (1), the movable plate (42) is fixedly arranged at the extending end of the electric push rod (41), a circular cutter (43) is fixedly arranged on the bottom surface of the movable plate (42), and a pressing plate (44) is fixedly arranged on the top surface of the movable plate (42).
  5. 5. The automatic wafer film coating mechanism according to claim 4, wherein the bottom surface of the movable plate (42) is provided with a groove (45), the inner wall of the groove (45) is movably provided with a circular plate (46), the circular plate (46) is connected with the inner wall of the groove (45) by arranging a first spring (47), and the bottom surface of the circular plate (46) is fixedly provided with a semicircular air bag (48).
  6. 6. The automatic wafer film laminating mechanism according to claim 5, wherein the purging mechanism (5) comprises a hollow plate (51) and a cam rod (52), the hollow plate (51) is fixedly arranged on the inner side wall of the film laminating box (1), the cam rod (52) is rotatably arranged in the hollow plate (51), two piston plates (53) are symmetrically arranged on the inner wall of the hollow plate (51), one surface of each piston plate (53) is in sliding butt joint with the outer wall of the cam rod (52), the other end of each piston plate (53) is connected with the inner wall of the hollow plate (51) through a second spring (54), and a plurality of air nozzles (55) are fixedly spliced on one side of the hollow plate (51) facing the placing plate (6).
  7. 7. The automatic wafer film laminating mechanism according to claim 6, wherein a spiral groove (56) is formed in the cam rod (52) in a penetrating mode, a movable rod (57) is movably inserted into the inner wall of the spiral groove (56), a semicircular block (58) is fixedly arranged at one end, inserted into the spiral groove (56), of the movable rod (57), the semicircular block (58) is in sliding fit with the inner wall of the spiral groove (56), the movable rod (57) is connected with the top surface of the hollow plate (51) through a third spring (59) in a sleeved mode, and the position of the movable rod (57) corresponds to the position of the pressing plate (44).
  8. 8. The automatic wafer film coating mechanism according to claim 6, wherein the left and right sides of the hollow plate (51) are provided with electrostatic dust collection plates (7).

Description

Automatic film laminating mechanism for wafer Technical Field The utility model relates to the technical field of film coating mechanisms, in particular to an automatic wafer film coating mechanism. Background With the rapid development of semiconductor technology, wafers are used as core components of integrated circuits, and each link in the manufacturing process is important. Wafer coating is an important step for protecting the wafer and enhancing the functionality of the wafer, the quality and the efficiency of the wafer coating directly affect the performance and the market competitiveness of the final product, and in order to reduce the possibility of damaging the surface of the wafer in the conveying process, a coating mechanism is required to cover one side of the surface of the wafer with a protective film. In the prior art, when a film coating mechanism is used for coating a wafer, a protective film is attached to the wafer through a pressing block, however, when the pressing block pushes the protective film to attach to the wafer, air flow at the center of the protective film and the wafer is easy to remain between the protective film and the wafer, so that the problem of generating air bubbles when the wafer is coated is easy to cause. The utility model provides an automatic wafer film coating mechanism which is used for solving the problem that when a film coating mechanism is used for coating a wafer, a protective film is attached to the wafer through a pressing block, however, when the pressing block pushes the protective film to attach to the wafer, air flow at the center of the protective film and the wafer is easy to remain between the protective film and the wafer, so that air bubbles are easy to be generated when the wafer is coated. Disclosure of utility model The utility model aims to solve the problems that in the prior art, when a film coating mechanism is used for coating a wafer, a protective film is attached to the wafer through a pressing block, however, when the pressing block pushes the protective film to attach to the wafer, air flow at the central part of the protective film and the wafer is easy to remain between the protective film and the wafer, and thus air bubbles are easy to be generated when the wafer is coated. Based on the technical thought, the technical scheme adopted by the utility model is as follows: the automatic wafer film laminating mechanism comprises a film laminating box, wherein a film releasing mechanism is arranged in the film laminating box, a protective film is arranged in the film releasing mechanism, a film pasting circular cutting mechanism is arranged on the inner top wall of the film laminating box, a blowing mechanism is arranged on the inner side wall of the film laminating box, and a placing plate is movably inserted on the front side of the film laminating box; the film pasting and circular cutting mechanism is used for pasting a protective film on a wafer and circular cutting the protective film, and the blowing mechanism is used for blowing the surface of the wafer. Further limiting the technical scheme, the film release mechanism comprises a winding drum and a releasing drum, the winding drum and the releasing drum are symmetrically arranged on the inner wall of the film covering box, round rods are rotatably arranged in the winding drum and the releasing drum, two ends of the protective film are respectively wound on the two round rods, a motor is arranged in the winding drum, and a rotating shaft of the motor is fixedly connected with one end of each round rod. Further limiting the technical scheme, openings for the passage of the protective film are formed in the winding drum and the unwinding drum. To the further limitation of above-mentioned technical scheme, pad pasting circular cutting mechanism includes electric putter and fly leaf, electric putter is fixed to be set up at the interior roof of tectorial membrane case, the fly leaf is fixed to be set up at electric putter's the end that stretches out, the fixed annular cutter that is provided with in bottom surface of fly leaf, the fixed clamp plate that is provided with in top surface of fly leaf. Further limiting the technical scheme, the bottom surface of the movable plate is provided with a groove, the inner wall of the groove is movably provided with a circular plate, the circular plate is connected with the inner wall of the groove through a first spring, and the bottom surface of the circular plate is fixedly provided with a semicircular air bag. To the further limitation of above-mentioned technical scheme, purge mechanism includes hollow slab and cam lever, the fixed inside wall that sets up at the tectorial membrane case of hollow slab, the cam lever rotates and sets up in hollow slab, the inner wall symmetry of hollow slab is provided with two piston boards, the one side of piston board and the outer wall sliding butt of cam lever, the other end of piston board is connec