Search

CN-224234136-U - Bonding apparatus and bonding system

CN224234136UCN 224234136 UCN224234136 UCN 224234136UCN-224234136-U

Abstract

The utility model discloses bonding equipment and a bonding system, and belongs to the technical field of semiconductor material processing equipment. The bonding apparatus includes a carrier, a retaining assembly, and a calibration assembly. The carrier is used for carrying the semiconductor material. The holding assembly comprises a containing piece and a holding tool, wherein the containing piece is used for storing the holding tool, the containing piece is directly or indirectly connected to the bearing piece, the containing piece is arranged on the periphery side of the bearing piece, and the holding tool is used for picking up and holding semiconductor materials. The calibration assembly is arranged on the periphery of the bearing piece and comprises a detection piece, a control piece and a calibration mark, and the calibration assembly is configured to detect the position information of the calibration mark held by the holding tool by the detection piece and adjust the pose of the holding tool by the control piece so that the positions of the holding tool and the preset area are opposite. The utility model can improve the bonding precision.

Inventors

  • Ju Jiawang
  • CAO NINGFEI
  • GAO ZHIWEI
  • MU FENGWEN
  • GUO CHAO
  • TAN XIANGHU
  • LIU FUCHAO

Assignees

  • 天津中科晶禾电子科技有限责任公司

Dates

Publication Date
20260512
Application Date
20250530

Claims (11)

  1. 1. A bonding apparatus, comprising: a carrier (10) for carrying the semiconductor material; The holding assembly (20) comprises a containing piece (21) and a holding tool (22), wherein the containing piece (21) is used for storing the holding tool (22), the containing piece (21) is directly or indirectly connected to the bearing piece (10), the containing piece (21) is arranged on the periphery of the bearing piece (10), and the holding tool (22) is used for picking up and holding semiconductor materials; The calibration assembly (30) is arranged on the periphery of the bearing piece (10), the calibration assembly (30) comprises a detection piece (31), a control piece and a calibration mark, and the calibration assembly (30) is configured to detect the calibration mark position information held by the holding tool (22) through the detection piece (31) and adjust the pose of the holding tool (22) through the control piece so that the positions of the holding tool (22) and a preset area are opposite.
  2. 2. The bonding apparatus of claim 1, wherein the calibration assembly (30) comprises a first calibration piece (32), the calibration mark comprises a first calibration mark, the first calibration mark is provided on the first calibration piece (32), and the first calibration piece (32) is configured to pick up the first calibration piece (32) by the holding fixture (22) so that the detection piece (31) detects the position information of the first calibration mark.
  3. 3. The bonding apparatus according to claim 2, wherein the calibration assembly (30) further comprises a second calibration piece (33), the calibration mark further comprising a second calibration mark, the second calibration mark being provided to the second calibration piece (33), the second calibration piece (33) being provided to the carrier (10), the first calibration piece (32) being located on a side of the second calibration piece (33) facing away from the carrier (10); The calibration assembly (30) is configured such that the detection member (31) detects position information of the first calibration mark and the second calibration mark held by the holding fixture (22) and adjusts the pose of the holding fixture (22) through the control member so that the holding fixture (22) is opposite to a preset position.
  4. 4. A bonding apparatus according to claim 3, wherein the calibration assembly (30) further comprises a first adsorption channel (34) and a second adsorption channel (35), the second adsorption channel (35) being adapted to adsorb a second calibration member (33), the second calibration member (33) being provided with a relief structure (331), the first adsorption channel (34) adsorbing the first calibration member (32) through the relief structure (331).
  5. 5. The bonding apparatus according to claim 1, wherein the carrier (10) includes a mounting portion (11) and a carrying portion (12) of an integral structure, the mounting portion (11) being provided on a peripheral side of the carrying portion (12), the holding member (20) being provided on the mounting portion (11).
  6. 6. The bonding apparatus according to claim 1, further comprising a connection assembly (40), the connection assembly (40) comprising a first connection end (D1) and a second connection end (D2), the first connection end (D1) being connected to a side of the carrier (10) facing away from the carrier semiconductor material, the second connection end (D2) being connected to a side of the receptacle (21) facing away from the holding fixture (22).
  7. 7. The bonding apparatus according to claim 6, wherein the connection assembly (40) comprises a movable member (41) and a bracket (42), the movable member (41) comprises the first connection end (D1), the bracket (42) comprises the second connection end (D2), the movable member (41) is connected to the bracket (42), and the movable member (41) is movably disposed with respect to the bracket (42).
  8. 8. The bonding apparatus according to claim 1, further comprising a positioning member (50), the carrier (10) comprising a carrier portion (12), the carrier portion (12) being configured to carry semiconductor material, the positioning member (50) being disposed on a peripheral side of the carrier portion (12), the positioning member (50) being configured to define a pose of the semiconductor material.
  9. 9. Bonding apparatus according to claim 8, characterized in that the semiconductor material comprises a wafer, the edge of which exceeds the carrier (12), the positioning member (50) being arranged movably with respect to the carrier (10) in the thickness direction of the carrier (10) for lifting the wafer.
  10. 10. The bonding apparatus of claim 1, wherein the carrier (10) further comprises a placement area (60), the placement area (60) being configured to place an abnormal part during bonding, the abnormal part comprising a holding fixture (22) for an abnormal pose.
  11. 11. A bonding system, comprising: Bonding apparatus (1) according to any one of claims 1 to 10, and -A pressing device (2), said pressing device (2) being able to take said holding fixture (22) for bonding semiconductor material.

Description

Bonding apparatus and bonding system Technical Field The utility model relates to the technical field of semiconductor material processing equipment, in particular to bonding equipment and a bonding system. Background In the semiconductor bonding process, bonding of different specifications of materials such as wafers, heterogeneous chips and the like is required to adopt a pressing head with matched sizes so as to ensure that bonding interface pressure is uniformly distributed. In the traditional technology, various pressure heads are required to be configured aiming at different bonding scenes and are stored on an independent storage rack in a concentrated mode. The storage rack and the bonding station are two stations which are independent and separately arranged. When the pressure heads are switched, the pressurizing device needs to get and change the pressure heads from the storage rack to the bonding station, so that the idle time of the equipment is increased, and the production efficiency is limited. In addition, frequent long-distance movement aggravates allowance accumulation errors of mechanical motion systems (such as sliding rails and transmission mechanisms), such as mechanical clearances and positioning drift, so that the alignment precision of the pressure head and the bonding platform is gradually reduced, and bonding alignment quality and product yield are directly affected. This section provides background information related to the application, which is not necessarily prior art. Disclosure of utility model The utility model aims to provide a bonding device and a bonding system, which can improve bonding precision. In order to achieve the above object, the following technical scheme is provided: A bonding apparatus, comprising: A carrier for carrying the semiconductor material; The holding assembly comprises a containing piece and a holding tool, wherein the containing piece is used for storing the holding tool, the containing piece is directly or indirectly connected to the bearing piece, the containing piece is arranged on the periphery of the bearing piece, and the holding tool is used for picking up and holding semiconductor materials; The calibration assembly is arranged on the periphery of the bearing piece and comprises a detection piece, a control piece and a calibration mark, and the calibration assembly is configured to detect the calibration mark position information held by the holding tool by the detection piece and adjust the pose of the holding tool by the control piece so that the positions of the holding tool and a preset area are opposite. As an alternative to the bonding apparatus, the calibration assembly includes a first calibration piece, the calibration mark includes a first calibration mark, the first calibration mark is disposed on the first calibration piece, and the first calibration piece is configured to be picked up by the holding fixture so that the detection piece detects the positional information of the first calibration mark. As an alternative of the bonding device, the calibration assembly further includes a second calibration member, the calibration mark further includes a second calibration mark, the second calibration mark is disposed on the second calibration member, the second calibration member is disposed on the carrier, and the first calibration member is located on a side of the second calibration member facing away from the carrier; The calibration assembly is configured to detect position information of the first calibration mark and the second calibration mark held by the holding tool by the detection member and adjust the pose of the holding tool by the control member so that the holding tool is opposite to a preset position. As an alternative scheme of the bonding device, the calibration assembly further comprises a first adsorption channel and a second adsorption channel, the second adsorption channel is used for adsorbing a second calibration piece, the second calibration piece is provided with an avoidance structure, and the first adsorption channel adsorbs the first calibration piece through the avoidance structure. As an alternative to the bonding apparatus, the carrier includes a mounting portion and a carrier portion of an integral structure, the mounting portion being provided on a peripheral side of the carrier portion, and the holding member being provided on the mounting portion. As an alternative scheme of the bonding equipment, the bonding equipment further comprises a connecting assembly, wherein the connecting assembly comprises a first connecting end and a second connecting end, the first connecting end is connected with one side of the bearing piece, which is back to the bearing semiconductor material, and the second connecting end is connected with one side of the containing piece, which is back to the storage tool. As an alternative to the bonding apparatus, the connection assembly includes a movable member including th