CN-224234140-U - Semiconductor component press-fitting device

Abstract

The utility model belongs to the technical field of semiconductor component assembly, and particularly relates to a semiconductor component press-fitting device; this step is through setting up removal screw rod, the push pedal, pressure equipment subassembly, splint and gear, it is to aim at the push pedal to drive the semiconductor module that needs pressure equipment through the conveyer belt subassembly, rotate through the gear, make both sides splint rotate to carry out spacing placed in the middle to the semiconductor module, it is movable to drive the push pedal through moving the screw rod rotation, make the push pedal promote the semiconductor module and remove, it is tight fixed to carry out clamp to semiconductor module through the push pedal cooperation fixed plate, the pressure equipment subassembly is moved by pneumatic cylinder and clamp plate subassembly, thereby make the pressure equipment subassembly can carry out pressure equipment to the semiconductor module, after the pressure equipment finishes, drive the fly leaf through first pneumatic cylinder and remove, make the fly leaf promote the semiconductor module after the pressure equipment to the conveyer belt subassembly upside, with it continue to remove, make the semiconductor module go up the unloading more convenient, the convenience of device use has been improved.

Inventors

• ZHU CHUNYU
• ZHANG ZIQIAN

Assignees

• 睿成创新(成都)电子技术有限公司

Dates

Publication Date

20260512

Application Date

20250610

Claims (6)

1. 1. The semiconductor component press-fitting device comprises a base (1), and is characterized in that a conveyor belt component (2) is arranged on the inner side of the base (1), a first motor (3) is fixedly connected to the outer side of the base (1), a movable screw (4) is fixedly connected to the output end of the first motor (3), a push plate (5) is connected to the outer side of the movable screw (4) in a threaded manner, a limit rod (101) is connected to the inner side of the push plate (5) in a sliding manner, the limit rod (101) is fixedly connected with the base (1), a fixed plate (6) is fixedly connected to the upper side of the base (1), the fixed plate (6) and the push plate (5) are matched for use, a press-fitting component (7) is arranged on the outer side of the fixed plate (6), a clamping plate (8) is rotatably connected to the outer side of the push plate (5), a movable rod (9) is fixedly connected to the outer side of the movable rod (9), gears (10) and the movable rod (9) are rotatably connected to the base (1), a fixed plate (10) and a second gear (11) are fixedly meshed with one side of the motor (10), the novel air conditioner is characterized in that a first air cylinder (12) is fixedly connected to the outer side of the base (1), and a movable plate (13) is fixedly connected to the output end of the first air cylinder (12).
2. 2. The device for press fitting the semiconductor assembly according to claim 1, wherein the baffle plate (14) is fixedly connected to the outer side of the base (1), a movable screw rod (15) is connected to the outer side of the base (1) in a threaded manner, a limiting plate (16) is rotatably connected to one end of the movable screw rod (15), and the limiting plate (16) is matched with the conveyor belt assembly (2).
3. 3. The device for press-fitting semiconductor components according to claim 2, wherein a limiting rod (17) is fixedly connected to the outer side of the base (1), and the limiting rod (17) is slidably connected with the limiting plate (16).
4. 4. The device for press-fitting semiconductor components of claim 3, wherein the inner side of the baffle plate (14) is slidably connected with a moving plate (18), the outer side of the base (1) is fixedly connected with a second cylinder (19), and the output ends of the moving plate (18) and the second cylinder (19) are fixedly connected.
5. 5. The device for press-fitting semiconductor packages according to claim 4, wherein the limiting plate (20) is fixedly connected to the outer side of the base (1), and the limiting plate (20) is matched with the gear (10).
6. 6. The device for press-fitting semiconductor components of claim 5, wherein the mounting plate (21) is fixedly connected to the outer side of the base (1), and the friction block (22) is fixedly connected to the outer side of the mounting plate (21).

Description

Semiconductor component press-fitting device Technical Field The utility model relates to the technical field of semiconductor component assembly, in particular to a semiconductor component press-fitting device. Background Semiconductor components are the core of modern electronics, covering a wide range of components from basic discrete devices to complex integrated circuits, playing a key role in the fields of communications, computing, consumer electronics, industrial control, and new energy, and often requiring press-fitting assembly of individual components using a bottom press-fitting apparatus when the semiconductor components are being processed. The conventional partial semiconductor component press-fitting device is not provided with a workpiece conveying mechanism, so that a user is required to manually place and take down the semiconductor workpiece, the press-fitting device is inconvenient to use, and therefore, the semiconductor component press-fitting device is provided for solving the problems. Disclosure of utility model In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved. The technical scheme includes that the semiconductor component press-fitting device comprises a base, wherein a conveyor belt component is arranged on the inner side of the base, a first motor is fixedly connected to the outer side of the base, a movable screw is fixedly connected to the output end of the first motor, a push plate is fixedly connected to the outer side of the movable screw in a threaded manner, a limit rod is slidably connected to the inner side of the push plate, the limit rod is fixedly connected with the base, a fixed plate is fixedly connected to the upper side of the base, the fixed plate and the push plate are matched for use, a press-fitting component is arranged on the outer side of the fixed plate, a clamping plate is rotatably connected to the outer side of the push plate, a movable rod is slidably connected to the inner side of the clamping plate, a gear is fixedly connected to the outer side of the movable rod, the gear and the movable rod are rotatably connected with the base, the gears are meshed with each other, a second motor is fixedly connected to the outer side of the base, one side of the gear is fixedly connected with the output end of the second motor, the outer side of the base is fixedly connected with a first cylinder, and the output end of the first cylinder is fixedly connected with a movable plate; the step comprises arranging a moving screw, a push plate, a press-fitting assembly, clamping plates and gears, driving the semiconductor assembly to be press-fitted to the push plate through a conveyor belt assembly, rotating the gears to enable the clamping plates on two sides to rotate to center and limit the semiconductor assembly, driving the push plate to move through the rotation of the moving screw, driving the semiconductor assembly to move by the push plate, clamping and fixing the semiconductor assembly through the push plate and a fixing plate, driving the pressing plate to move by a hydraulic cylinder and a pressing plate assembly through the hydraulic cylinder, thereby enabling the press-fitting assembly to press-fit the semiconductor assembly, driving the movable plate to move through a first cylinder after the press-fitting is completed, the movable plate is used for pushing the pressed semiconductor assembly to the upper side of the conveyor belt assembly so as to continuously move the conveyor belt assembly, so that the semiconductor assembly is more convenient to load and unload, and the convenience of using the device is improved. The step is that the baffle plate, the movable screw rod and the limiting plate are arranged before the semiconductor component is conveyed, the limiting plate is firstly held tightly, then the movable screw rod is rotated, and the movable screw rod drives the limiting plate to be close to the baffle plate through the threaded connection of the movable screw rod and the base, so that the moving track of the conveyed semiconductor is further limited, the movement of the semiconductor before the pressing is more stable and the deviation is not easy to occur, and the use stability of the device is improved. The limiting rod is arranged on the outer side of the base, the limiting rod is connected with the limiting plate in a sliding mode, when the limiting plate moves, the limiting rod is limited through the base, and then the limiting plate is limited, so that the movement of the limiting plate is more stable, and the use stability of the device is improved. The movable plate and the second cylinder are arranged, when one semiconductor component is pressed, the movable plate is driven to move through the second cylinder, and the subsequent semiconductor component is blocked through the movable plate, so that the subsequent semiconductor component is stopped by bein