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CN-224234142-U - Storage device

CN224234142UCN 224234142 UCN224234142 UCN 224234142UCN-224234142-U

Abstract

The utility model discloses storage equipment which comprises a storage area, a transmission area, a gas filtering system and a return air system. The receiving area is used for receiving the semiconductor elements, and the transmission area and the receiving area are independent in space and can be selectively communicated. The transfer area is used for receiving one of the semiconductor devices from the outside to the storage area or transmitting one of the semiconductor devices from the storage area to the outside. The air filtering system is used for providing clean air, and the air return system is connected to the air filtering system, so that the clean air can form an air circulation loop in the storage area and the transfer area respectively.

Inventors

  • CHEN MINGSHENG

Assignees

  • 特铨股份有限公司

Dates

Publication Date
20260512
Application Date
20250305
Priority Date
20240826

Claims (8)

  1. 1. A storage apparatus for accommodating a plurality of semiconductor elements, characterized by comprising: a receiving area for receiving the plurality of semiconductor devices; A transfer region spatially independent from but selectively communicable with each of the receiving regions, the transfer region being configured to receive one of the plurality of semiconductor devices from outside to the receiving region or to transfer one of the plurality of semiconductor devices from the receiving region to outside; A gas filtering system for providing a clean gas, and And the air return system is connected with the air filtering system through air, so that the clean air can form an air circulation loop in the storage area and the transfer area respectively.
  2. 2. The storage apparatus of claim 1, further comprising a processing region selectively communicating with the transfer region for performing a semiconductor process on one of the plurality of semiconductor devices.
  3. 3. The storage apparatus of claim 1, wherein the return air system comprises a first return air subsystem disposed within the receiving area and having a mesh plate and at least one first return air channel disposed at a bottom of the receiving area, the at least one first return air channel being connected to the air filtering system for allowing the clean air to form a first air circulation loop within the receiving area.
  4. 4. The storage apparatus of claim 1, wherein the return air system comprises a second return air subsystem disposed within the transfer area and having a mesh plate disposed at a bottom of the transfer area and at least one second return air channel connected to the air filtration system for allowing the clean air to form a second air circulation loop within the transfer area.
  5. 5. The storage apparatus of claim 2, wherein the return air system comprises a third return air subsystem disposed within the processing region and having a mesh plate and at least one third return air channel disposed at the bottom of the processing region, the at least one third return air channel being connected to the gas filtration system for allowing the clean gas to form a third gas circulation loop within the processing region.
  6. 6. A storage apparatus according to claim 3 wherein the gas filtration system comprises a first gas filtration unit, gas connected to the first return air passage, for providing the clean gas to the first gas circulation circuit within the receiving area.
  7. 7. The storage apparatus of claim 4, wherein the gas filtration system comprises a second gas filtration unit, gas coupled to the second return air channel, for providing the clean gas to the second gas circulation loop within the transfer zone.
  8. 8. The storage apparatus of claim 5, wherein the gas filtration system comprises a third gas filtration unit, gas coupled to the third return air channel, for providing the clean gas to the third gas circulation loop within the processing region.

Description

Storage device Technical Field The utility model relates to storage equipment, which is used for effectively improving the cleanliness of a storage space of semiconductor elements so as to reduce the pollution of the semiconductor elements in the storage process, and can be used for directly storing bare semiconductor elements and increase the storage capacity of the storage equipment. Background The application level of the semiconductor element not only extends over smart phones, automobiles and networks used by folk life, but also becomes a key application foundation of a plurality of science and technology industries along with the development of 5G communication, AI intelligent science and technology and IOT (internet of things), so that people can obtain richer and more convenient life. Under the influence of technological development, the circuit pattern line diameter of semiconductor devices has been developed from the early micron level to the nanometer level, and in order to cope with the pollution of the semiconductor devices (such as photomask, wafer, liquid crystal panel, optical filter, etc. outgassing) caused by fine particles (particles) of dust, etc. in the processing environment and the harmful gases (Outgassing) released in the process, the pollution countermeasure in the storage, transportation or process has become more strict. In order to maintain the cleanliness of the process, the conventional method is to design a clean room, mainly adopt an Air Flow to form a closed environment, use an Air filter Unit (FAN FILTER Unit, FFU) to generate clean Air to take away the dirty Air in the original environment, and filter the dirty Air by a filter screen to achieve the environment conforming to the dust-free level. Taking a photomask as an example, the photomask is used to transfer a circuit pattern to the surface of a wafer through a photolithography process. When a photomask used for transferring a circuit pattern is defective, the circuit pattern is broken, shorted, or distorted due to the miniaturization of the circuit pattern. It is known that the defects of the photomask are caused by surface contamination, such as accumulation of particles, chemical substances or gas free molecules existing in the environment, and the defects of adhering particles, haze, and the like on the surface of the photomask are caused, so that in order to maintain the clean quality of the surface of the photomask, the photomask is generally stored in a component container during storage or transmission, such as a SEMI standard photomask transmission box [ RETICLE SMIF Pod, RSP ], an ultraviolet photomask transmission box [ EUV Pod ], and the like, and in the storage, the component container containing the semiconductor components is placed in a storage device [ stock ], however, the volume of the component container is far larger than that of the contained semiconductor components, such as the general volume of the photomask transmission box is about 3-10 times larger, so that the capacity of the storage device is greatly reduced, the occupied volume of the storage device is increased, more storage devices are required to be prepared, and in order to maintain the environment inside each component container, the component containers are generally designed to be provided in the storage device, and the storage device and the inflation system is more complicated in manufacturing and the inflation system is more complicated, and the inflation system is more polluted, and the manufacturing and the inflation system is more polluted and the maintenance of the inflation system is more complicated. In other words, the conventional storage apparatus is not directly used for storing semiconductor devices, which has the problems of complex structure and large volume, and increases the manufacturing and maintenance costs, so how to solve the problems is expected by operators and users, and the utility model is also intended to be studied and solved. In view of the above drawbacks, the present inventors considered to have a need for correction, and have kept the best design concept by taking into account years of experience in related technologies and product design and manufacturing, and have made research and improvement for the above drawbacks, and have succeeded in developing a storage device through continuous efforts, so as to overcome the trouble and inconvenience caused by the inability of the existing storage device to directly store semiconductor devices. Disclosure of utility model It is therefore a primary object of the present utility model to provide a storage apparatus that can improve the cleanliness of the interior of the storage apparatus and can be maintained effectively for direct storage of semiconductor devices without contamination. It is still another object of the present utility model to provide a storage apparatus that can increase the storage capacity of semiconductor devices of the storage apparat