CN-224234143-U - Front-end material box for packaging semiconductor chip

Abstract

The utility model discloses a front-channel material box for packaging a semiconductor chip, which comprises a front-channel material box, support plates and frames, wherein the front-channel material box is internally hollow, a plurality of frames are installed in the front-channel material box through rivets, a plurality of components are installed on each frame, a plurality of support plates are installed in the front-channel material box, the support plates are correspondingly arranged below each frame, and each support plate is supported on one frame. Through the application of the utility model, the front material box for packaging the semiconductor chip is provided, the supporting plates are arranged in the front material box, then the upper end of each supporting plate is correspondingly provided with the frame, each supporting plate can be correspondingly supported below one frame, the supporting effect is achieved on the frame, the frame is prevented from being deformed due to the weight of components in the transferring process, and the service life of the frame is prolonged.

Inventors

• SHEN GUOBING
• ZHU CHAO
• ZHU JI

Assignees

• 尼西半导体科技(上海)有限公司

Dates

Publication Date

20260512

Application Date

20250325

Claims (10)

1. 1. A semiconductor chip package front-end magazine, comprising: Front material box, support plate and frame; the front material box is arranged in a hollow mode; The frames are arranged in the front material box through rivets, and each frame is provided with a plurality of components; The support plates are arranged in the front material box, one support plate is correspondingly arranged below each frame, and each support plate is supported by one frame.
2. 2. The semiconductor chip packaging front-end magazine according to claim 1, wherein a plurality of clamping grooves are formed in two opposite inner walls of the front-end magazine, and the plurality of clamping grooves are formed along the length direction of the front-end magazine.
3. 3. The semiconductor chip packaging front-end magazine according to claim 2, wherein two clamping blocks are arranged at two ends of each supporting plate, and each supporting plate is clamped in the front-end magazine through the clamping block and the clamping groove and fixed through rivets.
4. 4. The semiconductor chip packaging front-end magazine as set forth in claim 1, wherein a plurality of support blocks are provided in the middle of the support plate to protrude upward, and the plurality of support blocks are supported by the frame.
5. 5. The semiconductor chip packaging front-end magazine as defined in claim 4, wherein the support blocks are chamfered at both ends thereof.
6. 6. The semiconductor chip packaging front-end magazine as set forth in claim 1, wherein said support plate is provided with a plurality of kidney-shaped holes.
7. 7. The front-end magazine for packaging semiconductor chips as defined in claim 1, wherein two ends of the front-end magazine are provided with openings, and the interior of the front-end magazine is communicated with the outside through the openings.
8. 8. The semiconductor chip packaging front-end magazine as set forth in claim 7, wherein the front-end magazine is plugged at both ends by an upper cover.
9. 9. The semiconductor chip packaging front-end magazine as set forth in claim 1, wherein the upper end of the front-end magazine is fixedly mounted with a label by rivets.
10. 10. The semiconductor chip packaging front-end magazine according to claim 1, wherein one end of the support plate is provided with two first notches, and the other end of the support plate is provided with a second notch.

Description

Front-end material box for packaging semiconductor chip Technical Field The utility model relates to the related technical fields of semiconductors and the like, in particular to a front-end material box for packaging semiconductor chips. Background At present, a plurality of frames are directly installed in the prior front material box for semiconductor packaging, the frames are used for mounting components, the frames are lighter, after the components are mounted, the frames are bent downwards due to the weight of the components, the frames are easy to deform in the transferring process, and the service life is lower. Disclosure of utility model In view of the above, the present utility model provides a semiconductor chip packaging front-end magazine, comprising: Front material box, support plate and frame; the front material box is arranged in a hollow mode; The frames are arranged in the front material box through rivets, and each frame is provided with a plurality of components; The support plates are arranged in the front material box, one support plate is correspondingly arranged below each frame, and each support plate is supported by one frame. The semiconductor chip packaging front-channel material box is characterized in that a plurality of clamping grooves are formed in two opposite inner walls of the front-channel material box, and the clamping grooves are formed in the length direction of the front-channel material box. The semiconductor chip packaging front-channel material box comprises a plurality of support plates, wherein each support plate is provided with two clamping blocks at two ends, and each support plate is clamped in the front-channel material box through the clamping blocks and the clamping grooves and fixed through rivets. The semiconductor chip packaging front-channel material box is characterized in that a plurality of supporting blocks are arranged in the middle of the supporting plate in an upward protruding mode, and the supporting blocks are supported by the frame. The semiconductor chip packaging front-channel material box is characterized in that the two ends of the supporting block positioned in the middle are chamfered. In the front-path material box for packaging the semiconductor chip, the supporting plate is provided with a plurality of kidney-shaped holes. The semiconductor chip packaging front-channel material box is characterized in that two ends of the front-channel material box are provided with openings, and the inside of the front-channel material box is communicated with the outside through the openings. According to the front-channel material box for packaging the semiconductor chip, the openings at the two ends of the front-channel material box are plugged through the upper cover. The semiconductor chip packaging front-channel material box is characterized in that the upper end of the front-channel material box is fixedly provided with the label through rivets. The semiconductor chip packaging front-channel material box is characterized in that two first notches are formed in one end of the supporting plate, and a second notch is formed in the other end of the supporting plate. Compared with the prior art, the technical scheme has the following positive effects: Through the application of the utility model, the front material box for packaging the semiconductor chip is provided, the supporting plates are arranged in the front material box, then the upper end of each supporting plate is correspondingly provided with the frame, each supporting plate can be correspondingly supported below one frame, the supporting effect is achieved on the frame, the frame is prevented from being deformed due to the weight of components in the transferring process, and the service life of the frame is prolonged. Drawings Fig. 1 is an exploded view of a semiconductor chip package front-end magazine according to the present utility model. Fig. 2 is an assembly view of a semiconductor chip package front-end magazine according to the present utility model. Fig. 3 is a schematic view of a support plate according to the present utility model. 1. Front material box 2, supporting plate 3, frame 4, clamping groove 5, clamping block 6, supporting block 7, waist-shaped hole 8, upper cover 9, component 10, label 11, chamfer 12, first notch 13 and second notch. Detailed Description The utility model is further described below, but is not limited to, with reference to the drawings and detailed description. The structures, proportions, sizes, etc. shown in the drawings herein are shown in detail for purposes of illustration only, and are not intended to limit the scope of the utility model, which is defined in the claims, any structural modification, proportional change or size adjustment should still fall within the scope of the disclosure without affecting the efficacy and achievement of the present utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "