CN-224234145-U - Bearing device and semiconductor process chamber
Abstract
The utility model discloses a bearing device and a semiconductor process chamber, wherein the bearing device (01) comprises a plurality of bearing boats (10) which are stacked in sequence, at least one of two adjacent bearing boats (10) is provided with a spacing component (16), the two adjacent bearing boats (10) are supported and matched through at least two spacing components (16) and are distributed at intervals through the at least two spacing components (16), and the at least two spacing components (16) are distributed at intervals. The technical scheme can solve the problem that the bearing boats in the background art are stacked and supported through the mounting seats, so that the uniformity of the semiconductor sheet process is poor.
Inventors
- YU PENG
- YAN ZHISHUN
- ZHAO FUPING
- HAN TIANQI
- ZHOU ZHENXI
- HU ZICHEN
- LI BUZHONG
Assignees
- 北京北方华创微电子装备有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20250415
Claims (15)
- 1. The bearing device is characterized by comprising a plurality of bearing boats (10) which are stacked in sequence, wherein at least one of two adjacent bearing boats (10) is provided with spacing parts (16), the two adjacent bearing boats (10) are supported and matched through at least two spacing parts (16) and are distributed at intervals through the at least two spacing parts (16), and the at least two spacing parts (16) are distributed at intervals.
- 2. The carrying device according to claim 1, characterized in that the spacer member (16) is an insulating member, adjacent two of the carrying boats (10) being insulated by the spacer member (16).
- 3. The carrying device according to claim 2, wherein the carrying boat (10) located at the lowest position among the plurality of carrying boats (10) is provided with conductive boat feet (18), the conductive boat feet (18) are used for accessing radio frequency, the rear ends of the carrying boats (10) except the carrying boat (10) located at the lowest position among the plurality of carrying boats (10) are provided with radio frequency jacks, and the front ends of the carrying boats (10) and the rear ends of the carrying boats (10) are two ends of the carrying boats (10) distributed along the length direction thereof.
- 4. The carrier according to claim 1, wherein the spacer members (16) are arranged in a plurality of groups in the longitudinal direction of the carrier boat (10), each group of the spacer members (16) comprising at least two of the spacer members (16), each group of the spacer members (16) being arranged at intervals in the width direction of the carrier boat (10).
- 5. The carrier device according to claim 1, characterized in that the spacer part (16) to which one of the two adjacent carrier boats (10) is connected is provided with a plug-in groove (1211) and the other is provided with a plug-in projection (1212), by means of which plug-in projection (1212) the two adjacent carrier boats (10) are plugged into the plug-in groove (1211) for a positioning fit.
- 6. The carrier device according to claim 5, characterized in that two adjacent carrier boats (10) are positioned in engagement by one-to-one mating of a plurality of the mating projections (1212) with a plurality of the mating grooves (1211).
- 7. The carrier according to claim 5, wherein the insertion groove (1211) is a through groove penetrating along the length direction of the carrier boat (10), or the insertion groove (1211) is a closed groove formed by connecting a plurality of groove inner walls end to end.
- 8. The carrier device according to claim 1, wherein each carrier boat (10) comprises a plurality of boat sheets (11) and a plurality of conductive structures (12), and in each carrier boat (10), one of two adjacent boat sheets (11) is an odd number boat sheet (101) and the other is an even number boat sheet (102); All the odd boat pieces (101) and all the even boat pieces (102) in each bearing boat (10) are respectively electrically connected through the corresponding conductive structures (12); The at least two spacer members (16) are supported between the conductive structures (12) of adjacent two of the load boats (10).
- 9. The carrying device according to claim 8, wherein the conductive structure (12) comprises a first sub-conductive structure (103) and a second sub-conductive structure (104), wherein: In the conductive structures (12) connecting the odd number of boat pieces (101), the first sub-conductive structure (103) is electrically connected with all the odd number of boat pieces (101) at the bottom of the first end of the bearing boat (10), the second sub-conductive structure (104) is electrically connected with all the odd number of boat pieces (101) at the top of the second end of the bearing boat (10), in the conductive structures (12) connecting the even number of boat pieces (102), the first sub-conductive structure (103) is electrically connected with all the even number of boat pieces (102) at the bottom of the second end of the bearing boat (10), and the second sub-conductive structure (104) is electrically connected with all the even number of boat pieces (102) at the top of the first end of the bearing boat (10); The first end of the bearing boat (10) and the second end of the bearing boat (10) are two ends of the bearing boat (10) distributed along the length direction, and in two adjacent bearing boats (10), the at least two spacing parts (16) are supported between the first sub conductive structures (103) of the bearing boat (10) above and the second sub conductive structures (104) of the bearing boat (10) below.
- 10. The carrying device according to claim 9, wherein a first boat ear (111) protruding in the length direction is electrically connected to a bottom of the odd boat piece (101) located at a first end of the carrying boat (10) and a bottom of the even boat piece (102) located at a second end of the carrying boat (10), and a second boat ear (112) protruding in the length direction is electrically connected to a top of the odd boat piece (101) located at the first end of the carrying boat (10) and a top of the even boat piece (102) located at the second end of the carrying boat (10); The first boat ear (111) is electrically connected with the corresponding first sub-conductive structure (103), and the second boat ear (112) is electrically connected with the corresponding second sub-conductive structure (104).
- 11. The carrying device according to claim 10, wherein the first sub-conductive structure (103) comprises a plurality of first electrical connection blocks (113) distributed in a row and respectively clamped between the first boat ears (111) corresponding to the odd boat pieces (101) or between the first boat ears (111) corresponding to the even boat pieces (102).
- 12. The carrying device according to claim 10, characterized in that in two adjacent carrying boats (10), the top edge of the second boat ear (112) in the carrying boat (10) below is flush with the top edges of the odd boat pieces (101) and the even boat pieces (102).
- 13. The carrier device according to claim 12, wherein the second sub-conductive structure (104) comprises a plurality of second electrical connection blocks (114) distributed in a row and respectively clamped between the second boat ears (112) corresponding to the odd boat pieces (101) or between the second boat ears (112) corresponding to the even boat pieces (102), wherein in two adjacent carrier boats (10), the second electrical connection blocks (114) in the lower carrier boat (10) are not lower than the top edges of the odd boat pieces (101) and the even boat pieces (102) of the lower carrier boat (10).
- 14. The carrying device according to claim 8, characterized in that the spacer member (16) comprises a spacer body (161) and a connecting protrusion (162), a first end of the connecting protrusion (162) being fixedly connected to the spacer body (161), a second end of the connecting protrusion (162) being inserted into the conductive structure (12) of the carrying boat (10).
- 15. A semiconductor process chamber, characterized by comprising a chamber body (02) and a carrier device (01) according to any of claims 1-14, the chamber body (02) being provided with a process space (021), the carrier device (01) being provided in the process space (021).
Description
Bearing device and semiconductor process chamber Technical Field The application belongs to the technical field of semiconductor process equipment, and particularly relates to a bearing device and a semiconductor process chamber. Background Chemical vapor deposition equipment is equipment for realizing chemical vapor deposition process and plays an important role in the semiconductor process. In a particular process, semiconductor wafers are placed on a carrier boat and moved into and out of a process space with the carrier boat. Taking the production of solar cells as an example, a silicon wafer (i.e., a specific semiconductor wafer) for manufacturing solar cells is placed on a carrier boat to deposit a silicon nitride film layer in a process space of a chemical vapor deposition apparatus along with the carrier boat, and the silicon nitride film layer can reduce reflection, so as to achieve the purpose of improving the photoelectric conversion efficiency of the solar cells. In order to increase process throughput, the related art chemical vapor deposition process is expected to be able to carry more semiconductor wafers at a time by increasing the size of the carrier boat, but has limited effectiveness. The related art also relates to a method for stacking the carrying boats to increase the number of semiconductor sheets carried by each process, but the carrying boats are provided with mounting seats therebetween to realize support, and the mounting seats can obstruct the flow of process gas between the carrying boats to affect the uniformity of the process, so that the process effect of the semiconductor sheets is poor. Disclosure of utility model The utility model discloses a bearing device and a semiconductor process chamber, which are used for solving the problem that poor uniformity of a semiconductor sheet process can be caused by stacking and supporting bearing boats through mounting seats in the background art. In order to solve the technical problems, the application provides the following technical scheme: In a first aspect, an embodiment of the present utility model discloses a carrier device, where the disclosed carrier device includes a plurality of carrier boats stacked in sequence, at least one of two adjacent carrier boats is provided with a spacer member, the two adjacent carrier boats are supported and matched by at least two spacer members and are distributed at intervals by the at least two spacer members, and the at least two spacer members are distributed at intervals. In a second aspect, an embodiment of the present utility model discloses a semiconductor process chamber, where the disclosed semiconductor process chamber includes a chamber body and a carrying device according to the first aspect, the chamber body is provided with a process space, and the carrying device is disposed in the process space. The bearing device disclosed by the embodiment of the utility model has the following technical effects: According to the carrying device disclosed by the embodiment of the utility model, the structure is designed, so that two adjacent carrying boats in the carrying device are separated by at least two spacing parts which are distributed at intervals, and the process gas in the gap between the two adjacent carrying boats can flow between the spacing parts which are distributed at intervals in the process, so that the flow capacity of the process gas in the carrying device can be improved, the process gas flow field in the carrying device is more uniform, and the process uniformity of the semiconductor wafers loaded in the carrying device is better. Drawings Fig. 1 is a schematic structural diagram of a carrying device according to an embodiment of the present utility model; FIG. 2 is a schematic view of a part of another carrying device according to an embodiment of the present utility model; FIG. 3 is a schematic view of the structure of FIG. 1 from another perspective; FIG. 4 is a schematic view of a portion of a semiconductor process chamber according to an embodiment of the present utility model; FIG. 5 is a schematic view of a portion of a semiconductor process chamber according to an embodiment of the present utility model; fig. 6 to 9 are schematic exploded views of partial structures of different structures of the carrying device. Reference numerals illustrate: 01-carrier, 10-carrier boat, 11-boat sheet, 12-conductive structure, 13-sheet slot, 14-first connection structure, 15-second connection structure, 16-spacer member, 161-spacer body, 162-connection boss, 17-insulating boat foot, 18-conductive boat foot, 101-odd boat sheet, 102-even boat sheet, 103-first sub-conductive structure, 104-second sub-conductive structure, 111-first boat ear, 112-second boat ear, 113-first connection block, 114-second connection block, 1211-socket slot, 1212-socket boss, third sub-conductive structure, and fourth sub-conductive structure, 02-Chamber body, 021-process space, 022-front electrode,