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CN-224234149-U - Blanking transfer device of degumming machine

CN224234149UCN 224234149 UCN224234149 UCN 224234149UCN-224234149-U

Abstract

The utility model provides a blanking transfer device of a degumming machine, and aims to solve the problems of low efficiency and high misoperation rate of the prior art that manual transfer and integer type degumming are adopted for silicon wafer stack treatment after blanking of the degumming machine. The utility model mainly comprises a blanking platform, a transferring manipulator, a degumming machine discharging water tank, a feeding line and a processing workbench, wherein the six-axis manipulator is used for transferring a silicon wafer stack, a silicon wafer shovel at the free end of a tail axis of the six-axis manipulator is integrated with a cyclone nozzle, a bucket and a clamping function, the processing workbench is integrated with shaping and photoresist removing functions of the silicon wafer stack, and the six-axis manipulator, the processing workbench, the feeding line and the discharging water tank in a field are cooperatively matched, so that the transfer, shaping and photoresist removing treatment of the silicon wafer can be automatically completed, the production efficiency is improved, and the manual intervention is reduced. Meanwhile, in the treatment process of the silicon wafer stack, the flexible cushion block and the correction sponge roller are adopted, so that the surface damage of the silicon wafer is avoided.

Inventors

  • CHEN SHIQIANG
  • TAO LING

Assignees

  • 无锡市道盈科技有限公司

Dates

Publication Date
20260512
Application Date
20250306

Claims (7)

  1. 1. The discharging and transferring device of the degumming machine is characterized by comprising a discharging platform, wherein a transferring manipulator (1), a discharging water tank (2) of the degumming machine, a feeding line (3) and a processing workbench (4) are arranged in the discharging platform, the transferring manipulator (1) is configured to scoop a silicon wafer stack from the discharging water tank (2) of the degumming machine, transfer the silicon wafer stack into the processing workbench (4), and transfer the processed silicon wafer stack into an empty box of the feeding line (3) for next procedure; The silicon wafer stacking device is characterized in that a clamp used for clamping a silicon wafer stack is arranged at the tail end of the free end of the transferring manipulator (1), the clamp comprises a flange plate (5) arranged at the tail end of a joint of the transferring manipulator (1), a silicon wafer shovel (6) is arranged on one side below the flange plate (5) in a lifting mode, the section of the silicon wafer shovel (6) is L-shaped, and a nozzle (7) is further arranged on one side, adjacent to the silicon wafer shovel (6), of the flange plate (5); Still arranged chucking mechanism (8) on silicon chip shovel (6), chucking mechanism (8) are including two sets of chucking cylinders (81) of relative setting, the stroke of chucking cylinder (81) sets up relatively, the drive end of chucking cylinder (81) is provided with chucking plate (82), two sets of chucking plate (82) keep away from each other under the relative stroke of chucking cylinder (81) or are close to, chucking cylinder (81) are arranged on the vertical shovel face of silicon chip shovel (6).
  2. 2. The blanking transfer device of the degumming machine according to claim 1, wherein the transfer manipulator (1) is a six-axis manipulator.
  3. 3. The blanking transfer apparatus of a degumming machine as set forth in claim 1, wherein the processing table (4) comprises two mold cavities (41), and a shaping mechanism for shaping a silicon wafer stack and a photoresist removing mechanism for removing photoresist from the silicon wafer stack are respectively arranged in each mold cavity (41).
  4. 4. The blanking transfer apparatus of a degumming machine as set forth in claim 3, wherein the shaping mechanism comprises a pushing cylinder (42), a wheel set mounting frame (43) is arranged at the driving end of the pushing cylinder (42), and correction sponge rollers (44) capable of freely rolling are symmetrically arranged on the wheel set mounting frame (43).
  5. 5. The feeding and transferring device of the degumming machine according to claim 3, wherein the degumming mechanism comprises at least two groups of clamping assemblies arranged on the front side, the back side or the left side and the right side in the corresponding cavity (41), and further comprises a degumming unit arranged above the corresponding cavity (41).
  6. 6. The blanking transfer apparatus of a degumming machine as set forth in claim 5, wherein the clamping assembly comprises a clamping cylinder (45) fixedly arranged on the wall surface of the cavity (41), a supporting frame (49) is arranged at the driving end of the clamping cylinder (45), and a flexible cushion block (46) is fixedly arranged on the supporting frame (49).
  7. 7. The discharging and transferring device of the degumming machine according to claim 5, wherein the degumming unit comprises a degumming cylinder (47) arranged on one side above the cavity (41), the travel range of the degumming cylinder (47) covers the upper surface of the silicon wafer stack, a degumming wheel frame (48) is arranged at the driving end of the degumming cylinder (47), and a degumming brush roller (50) is arranged on a main shaft of the degumming wheel frame (48).

Description

Blanking transfer device of degumming machine Technical Field The utility model relates to the technical field of silicon wafer production, in particular to a blanking transfer device of a degumming machine. Background After the degumming of the silicon wafer degumming machine is completed, the silicon wafer is required to be taken out in batches, arranged and degummed (residual glue remained on the surface of a silicon wafer stack), and then is put into a feeding box of an inserting machine to enter the next procedure; The existing degumming machine is mainly used for discharging, manual conveying is adopted, repeated conveying times are high, and the consumed time is long. And moreover, operators at the discharging post of the degumming machine need to wear thick rubber gloves for a long time, and misoperation is easy to occur to cause loss during the long-time operation, so that an automatic device is needed to be added between the next procedures of connection for the silicon wafer stack degummed by the off-line machine to replace manual discharging, transferring and preprocessing. Disclosure of utility model Aiming at the defects in the prior art, the application provides a blanking transfer device of a degumming machine, which can automatically finish transfer, shaping and photoresist removing treatment of silicon wafers, improve production efficiency and reduce manual intervention. The technical scheme adopted for solving the technical problems is as follows: The utility model provides a degummed machine unloading transfer device, its includes the unloading platform, be provided with in the unloading platform and transport manipulator, degummed machine ejection of compact basin, material loading line and processing table, transport the manipulator and be configured to from the silicon chip heap of shoveling out in the degummed machine ejection of compact basin, and will the silicon chip heap is transported in the processing table, again with the silicon chip heap after handling transport to the empty box of material loading line in carry out the next process. Further, the transfer manipulator is a six-axis manipulator. Further, the free end of the transfer manipulator is provided with a clamp for clamping a silicon wafer stack, the clamp comprises a flange plate arranged at the tail end of a joint of the transfer manipulator, a silicon wafer shovel is arranged on one side below the flange plate in a lifting mode, the section of the silicon wafer shovel is L-shaped, and a nozzle is further arranged on one side, adjacent to the silicon wafer shovel, of the flange plate. Further, the upper part of the silicon slice shovel is also provided with a clamping mechanism, the clamping mechanism comprises two groups of clamping air cylinders which are oppositely arranged, the strokes of the clamping air cylinders are oppositely arranged, the driving ends of the clamping air cylinders are provided with clamping plates, the two groups of clamping plates are mutually far away from or close to each other under the relative strokes of the clamping air cylinders, and the clamping air cylinders are arranged on the vertical shovel surface of the silicon slice shovel. Further, the processing workbench comprises three cavities, and a shaping mechanism for shaping the silicon wafer stack and a photoresist removing mechanism for photoresist removing of the silicon wafer stack are respectively arranged in each cavity. Further, the shaping mechanism comprises a pushing cylinder, a driving end of the pushing cylinder is provided with a wheel set mounting frame, and correction sponge rollers capable of freely rolling are symmetrically arranged on the wheel set mounting frame. Further, the photoresist removing mechanism comprises two groups of clamping assemblies arranged at least at the front side, the back side or the left side and the right side in the corresponding cavity, and further comprises a photoresist removing unit arranged above the corresponding cavity. Further, the clamping assembly comprises a clamping cylinder fixedly arranged on the wall surface of the cavity, a supporting frame is arranged at the driving end of the clamping cylinder, and a flexible cushion block is fixedly arranged on the supporting frame. Further, the photoresist removing unit comprises a photoresist removing cylinder arranged on one side above the cavity, the travel range of the photoresist removing cylinder covers the upper surface of the silicon wafer stack, a photoresist removing wheel frame is arranged at the driving end of the photoresist removing cylinder, and a photoresist removing brush roller is arranged on a main shaft of the photoresist removing wheel frame. The beneficial effects of the utility model are as follows: Compared with the prior art, the silicon wafer stack transfer device has the advantages that the six-axis mechanical arm is used for transferring the silicon wafer stack, the silicon wafer shovel at the free end of th