CN-224234150-U - Multi-head die bonding equipment

CN224234150UCN 224234150 UCN224234150 UCN 224234150UCN-224234150-U

Abstract

The utility model is applicable to the technical field of semiconductor production, and provides multi-head die bonding equipment which comprises a workbench, a product conveying mechanism, a translation adjusting mechanism, a first die bonding group and a second die bonding group. Compared with the multi-head die bonding equipment in the prior art, the translational adjusting mechanism is arranged between the second die bonding group and the workbench, so that the distance between the second die bonding group and the first die bonding group along the first direction can be adjusted through the translational adjusting mechanism when the size of a product changes. The alternate operation mode can be selected when the spacing between the second die bonding group and the first die bonding group is smaller, and the simultaneous operation mode can be selected when the spacing between the second die bonding group and the first die bonding group is larger, so that the device can select the corresponding operation mode to perform die bonding operation according to the size of the product, and the overall adaptability of the device is improved.

Inventors

CHEN ZHUOZHAO
Lan Lisan
Yan chuxiong
ZHU ZHENDE

Assignees

深圳新益昌科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250331

Claims (10)

1. A multi-headed die bonding apparatus, comprising: the workbench is provided with a first working area and a second working area on the top surface; the product conveying mechanism is arranged on the workbench, is positioned between the first working area and the second working area and is used for conveying products along a first direction; The first die bonding groups and the second die bonding groups are multiple in number and are used for die bonding the product when the product passes through the position where the product is located, the first die bonding groups are arranged in the first working area, the first die bonding groups are sequentially arranged along the first direction, the second die bonding groups are arranged in the second working area, and the second die bonding groups are sequentially arranged along the first direction, and The translation adjustment mechanisms are multiple in number and are respectively arranged between the second die bonding groups and the workbench and used for adjusting the distance between the second die bonding groups and the first die bonding groups along the second direction, and the second direction and the first direction form an included angle.
2. The multi-head die bonding apparatus of claim 1, wherein the translation adjustment mechanism comprises a translation mounting plate and a driving assembly, the translation mounting plate is slidably disposed on a top surface of the workbench, the driving assembly is disposed on the workbench, the driving assembly is used for driving the translation mounting plate to move along the second direction, and a plurality of second die bonding groups are respectively fixed on the translation mounting plate.
3. The multi-head die bonding apparatus according to claim 2, wherein a sliding structure is further provided between the translation mounting plate and the workbench, the sliding structure comprises a sliding guide rail and a moving slide block, the sliding guide rail is arranged on the workbench and is arranged along the second direction, the moving slide block is fixedly arranged on the translation mounting plate, and the moving slide block can slide along the length direction of the sliding guide rail.
4. The multi-head die bonding apparatus according to claim 3, wherein the driving assembly comprises a connecting block, a rotating screw and a power unit, the rotating screw is rotatably arranged on the workbench along the second direction, the connecting block is arranged on the translation mounting plate and is in threaded connection with the rotating screw, and the driving end of the power unit is connected with the rotating screw and is used for driving the rotating screw to rotate.
5. The multi-head die bonding apparatus of claim 2, wherein a fixed support plate is further disposed at the first working area on the top surface of the working table, the fixed support plate is used for mounting and fixing the first die bonding group, and the top surface of the fixed support plate is flush with the top surface of the translation mounting plate.
6. The multi-head die bonding apparatus of claim 1, wherein each of the first die bonding sets comprises a first die bonding mechanism for providing a die ring and separating a wafer from the die ring, the first die bonding mechanism for mounting a wafer to a product, and each of the second die bonding sets comprises a second die bonding mechanism for providing a die ring and separating a wafer from the die ring, and a second die bonding mechanism for mounting a wafer to a product, the plurality of first die bonding sets being disposed in one-to-one opposition to the plurality of second die bonding sets.
7. The multi-head die bonding apparatus of claim 6, wherein the first and second die supply groups each comprise a die ring feeding mechanism for receiving and storing a die ring, a die ring handling mechanism for supporting the die ring, a die ring rotating platform for handling the die ring from the die ring feeding mechanism onto the die ring rotating platform, and a thimble mechanism for separating the wafer from the die ring.
8. The multi-head die bonding apparatus of claim 7, wherein the first die bonding mechanism and the second die bonding mechanism each comprise a die bonding support, a die bonding position module, a die bonding power unit and a swing arm assembly, the die bonding power unit is movably connected to the die bonding support through the die bonding position module, and the swing arm assembly is connected to the driving end of the die bonding power unit for sucking and transporting the wafer.
9. The multi-head die bonding apparatus according to claim 6, wherein the product transporting mechanism comprises a plurality of clamp mechanisms sequentially arranged at intervals along the first direction, wherein each clamp mechanism is located between the first die bonding mechanism and the second die bonding mechanism, and a connecting transporting guide rail is further arranged between two adjacent clamp mechanisms for transporting products from the clamp mechanism to the other clamp mechanism.
10. The multi-head die bonding apparatus according to claim 9, wherein the clamp mechanism comprises a clamp base, a first clamp translation portion and a second clamp translation portion, the clamp base is disposed on the workbench, the first clamp translation portion is slidably disposed on the clamp base along the first direction, the second clamp translation portion is slidably disposed on the first clamp translation portion along the second direction, and a clamping bracket for placing and fixing the product is further disposed on a top surface of the second clamp translation portion.

Description

Multi-head die bonding equipment Technical Field The utility model belongs to the technical field of semiconductor production, and particularly relates to a multi-head die bonding device. Background The die bonder is one of devices for manufacturing semiconductor devices, and is used for connecting a wafer with other components to realize die bonding, so that a multi-head die bonding device can be used for die bonding a specific product such as a direct display board. However, the existing multi-head die bonding equipment can only adopt a single working mode to process products, so that the technical problem of poor applicability of the multi-head die bonding equipment exists. Disclosure of utility model The utility model aims to provide a multi-head die bonding device, which aims to solve the technical problem that the die bonding device in the prior art can only adopt a single working mode when in use and has poor applicability. The utility model is realized in that a multi-head die bonding device comprises: the workbench is provided with a first working area and a second working area on the top surface; the product conveying mechanism is arranged on the workbench, is positioned between the first working area and the second working area and is used for conveying products along a first direction; The first die bonding groups and the second die bonding groups are multiple in number and are used for die bonding the product when the product passes through the position where the product is located, the first die bonding groups are arranged in the first working area, the first die bonding groups are sequentially arranged along the first direction, the second die bonding groups are arranged in the second working area, and the second die bonding groups are sequentially arranged along the first direction, and The translation adjustment mechanisms are multiple in number and are respectively arranged between the second die bonding groups and the workbench and used for adjusting the distance between the second die bonding groups and the first die bonding groups along the second direction, and the second direction and the first direction form an included angle. In an alternative embodiment, the translation adjustment mechanism includes a translation mounting plate and a driving assembly, the translation mounting plate slide set up in the top surface of workstation, the driving assembly set up in the workstation, the driving assembly is used for driving the translation mounting plate is followed the second direction motion, a plurality of the solid brilliant group of second is all fixed in on the translation mounting plate. In an optional embodiment, a sliding structure is further disposed between the translation mounting plate and the workbench, the sliding structure includes a sliding guide rail and a moving slide block, the sliding guide rail is disposed on the workbench and is disposed along the second direction, the moving slide block is fixedly disposed on the translation mounting plate, and the moving slide block can slide along the length direction of the sliding guide rail. In an alternative embodiment, the driving assembly includes a connection block, a rotation screw and a power unit, the rotation screw is rotatably disposed on the workbench along the second direction, the connection block is disposed on the translation mounting plate and is in threaded connection with the rotation screw, and a driving end of the power unit is connected with the rotation screw and is used for driving the rotation screw to rotate. In an alternative embodiment, a fixed support plate is further arranged at the first working area on the top surface of the workbench, the fixed support plate is used for installing and fixing the first die bonding group, and the top surface of the fixed support plate is flush with the top surface of the translation mounting plate. In an alternative embodiment, each of the first die-bonding groups includes a first die-bonding mechanism and a first die-bonding group, the first die-bonding group is used for providing a die ring and separating a wafer from the die ring, the first die-bonding mechanism is used for mounting the wafer on a product, each of the second die-bonding groups includes a second die-bonding mechanism and a second die-bonding group, the second die-bonding mechanism is used for providing a die ring and separating the wafer from the die ring, the second die-bonding mechanism is used for mounting the wafer on the product, and a plurality of the first die-bonding groups and a plurality of the second die-bonding groups are arranged in a one-to-one opposite manner. In an alternative embodiment, the first crystal feeding set and the second crystal feeding set each include a crystal ring feeding mechanism, a crystal ring carrying mechanism, a crystal ring rotating platform and a thimble mechanism, wherein the crystal ring feeding mechanism is used for accommodating and storing a crystal ri