CN-224234155-U - Conveying mechanism and Miniled die bonding production line

Abstract

The utility model discloses a conveying mechanism and Miniled die bonding production line, and belongs to the technical field of die bonding equipment. The conveying mechanism comprises at least two fixed linear feeding assemblies arranged at intervals, rotary linear feeding assemblies positioned between two adjacent fixed linear feeding assemblies, and a rotary lifting driving mechanism for driving the rotary linear feeding assemblies to rotate and lift relative to the fixed linear feeding assemblies, wherein the fixed linear feeding assemblies comprise at least three layers of fixed conveying devices, and the rotary linear feeding assemblies comprise at least two layers of dispatching conveying devices which are arranged from top to bottom. The conveying mechanism and Miniled die bonding production line provided by the utility model can effectively solve the problems of poor flexibility in expansion and lower production efficiency of the conventional Miniled die bonding production line.

Inventors

• QIU GUOLIANG
• SONG XIANJIU
• YANG JIANG
• Lu Guanhuan

Assignees

• 东莞市凯格精机股份有限公司

Dates

Publication Date

20260512

Application Date

20250516

Claims (9)

1. 1. The conveying mechanism is characterized by comprising at least two fixed linear feeding assemblies arranged at intervals, a rotary linear feeding assembly (103) arranged between two adjacent fixed linear feeding assemblies, and a rotary lifting driving mechanism (104) for driving the rotary linear feeding assembly (103) to rotate and lift relative to the fixed linear feeding assemblies; Wherein, the The fixed linear feeding assembly comprises at least three layers of fixed conveying devices which are arranged from top to bottom, and the rotary linear feeding assembly (103) comprises at least two layers of scheduling conveying devices which are arranged from top to bottom; the rotation lifting driving mechanism (104) For driving the rotary linear feeding assemblies (103) to rotate to be parallel to the feeding direction of each fixed linear feeding assembly so as to carry out material transfer operation between the fixed linear feeding assemblies and the rotary linear feeding assemblies (103), And the rotary linear feeding assembly (103) is driven to rotate to be perpendicular to the feeding direction of each fixed linear feeding assembly, so that material transfer operation between the rotary linear feeding assembly (103) and the die bonding platform is performed.
2. 2. The conveyor mechanism of claim 1, wherein the number of fixed conveyors is three and the number of scheduled conveyors is two.
3. 3. The transport mechanism according to claim 2, wherein, When the uppermost fixed conveyor is flush with the uppermost dispatch conveyor, the lowermost fixed conveyor is flush with the lowermost dispatch conveyor.
4. 4. A conveyor mechanism as in claim 2 wherein the spacing distance between adjacent ones of the fixed conveyors is equal.
5. 5. The conveyor mechanism of claim 1, wherein each conveyor is a conveyor belt or a set of feed rolls.
6. 6. The conveyor mechanism of claim 1, wherein both the stationary linear feed assembly and the rotary linear feed assembly (103) include a conveyor mount (105) for mounting and securing each of the conveyors, and a mount traversing direct drive mechanism (106) located at a bottom of the conveyor mount (105); the driving direction of the fixed frame transverse direct driving mechanism (106) is perpendicular to the feeding direction of the fixed linear feeding assembly.
7. 7. The transport mechanism according to claim 1, wherein, The rotational lifting drive mechanism (104) includes: The driving end of the rotary driving mechanism (1041) is connected with the rotary linear feeding assembly (103) and is used for driving the rotary linear feeding assembly (103) to rotate around a vertical axis; The lifting direct-drive mechanism (1042), the driving end of the lifting direct-drive mechanism (1042) is connected with the rotary driving mechanism (1041), and is used for driving the rotary driving mechanism (1041) to drive the rotary linear feeding assembly (103) to move up and down along the vertical direction, so that each dispatching conveying device moves to be flush with the corresponding fixed conveying device under different working conditions.
8. 8. Miniled die bonding production line, which is characterized by comprising: the transfer mechanism (1) of any one of claims 1-7, the transfer mechanism (1) being for transporting a stent; Each R die bonding device is correspondingly provided with one rotary linear feeding assembly (103), and each R die bonding device is used for performing R chip die bonding operation of part of die bonding acupuncture points of the bracket; Each G die bonding device is correspondingly provided with one rotary linear feeding assembly (103), and each R die bonding device is used for performing G die bonding operation on part of R chips of the bracket; And each B die bonding device is correspondingly provided with one rotary linear feeding assembly (103), and each B die bonding device is used for carrying out B die bonding operation on part of the G die of the bracket.
9. 9. The Miniled die bonding line according to claim 8, wherein, And the upstream of each G die bonding device is provided with one R die bonding device, and the downstream of each G die bonding device is provided with one B die bonding device so as to form a continuous RGB (red, green and blue) arrangement structure.

Description

Conveying mechanism and Miniled die bonding production line Technical Field The utility model relates to the technical field of die bonding equipment, in particular to a conveying mechanism and Miniled die bonding production line. Background When RGB die bonding is performed, the R chip must be die bonded first, then the G chip must be die bonded, and finally the B chip must be die bonded. The conventional Miniled die bonding production line generally comprises: A conveying mechanism for conveying the stent; The R die bonding devices are sequentially arranged along the conveying mechanism, and each R die bonding device is used for performing R chip die bonding operation on part of die bonding acupuncture points of the bracket; The G die bonding devices are positioned at the downstream of all the R die bonding devices and are sequentially arranged along the conveying mechanism, and each R die bonding device is used for performing G chip die bonding operation on part of R chips of the bracket; And the B die bonding devices are positioned at the downstream of all the G die bonding devices and are sequentially arranged along the conveying mechanism, and each B die bonding device is used for performing B chip die bonding operation on part of the G chips of the bracket. Referring to fig. 1, taking the number of the R die bonding apparatus, the G die bonding apparatus, and the B die bonding apparatus as two examples, the conventional Miniled die bonding process flow is as follows: ① The conveying mechanism 1 conveys an all-empty bracket without any chip die bonding to the first R die bonding equipment 2, and after the first R die bonding equipment 2 performs the R chip die bonding operation of half die bonding points of the bracket, the bracket is conveyed back to the conveying mechanism 1; ② The conveying mechanism 1 conveys the bracket with half of the die bond points of the R chips to the second R die bond equipment 3, and the second R die bond equipment 3 conveys the bracket back to the conveying mechanism 1 after performing the die bond operation of the R chips of the other half of the die bond points of the bracket; ③ The conveying mechanism 1 conveys the bracket with the R chip die bonding completed to the first G die bonding equipment 4, and the first G die bonding equipment 4 conveys the bracket back to the conveying mechanism 1 after carrying out the G chip die bonding operation on half of the R chips of the bracket; ④ The conveying mechanism 1 conveys the bracket with the G chip die bonding on one half of the R chips to the second G die bonding equipment 5, and the second G die bonding equipment 5 conveys the bracket back to the conveying mechanism 1 after performing the G chip die bonding operation on the other half of the R chips of the bracket; ⑤ The conveying mechanism 1 conveys the bracket with the G chip die bonding completed to the first B die bonding equipment 6, and the first B die bonding equipment 6 conveys the bracket back to the conveying mechanism 1 after performing the B chip die bonding operation on half of the G chips of the bracket; ⑥ The conveying mechanism 1 conveys the bracket with the B chip die bonding on half of the G chips to the second B die bonding equipment 7, and after the second B die bonding equipment 7 performs the B chip die bonding operation on the other half of the G chips of the bracket, the bracket is conveyed back to the conveying mechanism 1; ⑦ So far, the RGB die bonding operation of all die bonding points on the bracket is completed, and the conveying mechanism 1 conveys the bracket with the RGB die bonding operation completed to a downstream process. The above-described process has the following problems: ① The die bonding order of the R-G-B is not adjustable, so that after the die bonding equipment B, the die bonding equipment R or the die bonding equipment G cannot be arranged, for example, if the number of the die bonding equipment R, the die bonding equipment G and the die bonding equipment B of the conventional Miniled die bonding production line is two, namely the specific die bonding equipment arrangement mode is R-R-G-G-B-B; if the capacity is required to be expanded, the number of the R die bonding equipment, the G die bonding equipment and the B die bonding equipment is expanded to three, namely, when the expected die bonding equipment is arranged in the mode of R-R-R-G-G-B-B-B, a group of R die bonding equipment, G die bonding equipment and B die bonding equipment cannot be simply added behind the original R-R-G-G-B-B die bonding production line, but the whole original R-R-G-G-B-B die bonding production line can only be completely disassembled, and a group of R die bonding equipment, G die bonding equipment and B die bonding equipment can be reinserted; this results in poor flexibility of the whole production line and higher subsequent upgrade expansion cost; ② Theoretically, if the time for taking the bracket from the conveying mechanism 1 by all the