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CN-224234157-U - Wafer picking and placing mechanism

CN224234157UCN 224234157 UCN224234157 UCN 224234157UCN-224234157-U

Abstract

The application discloses a wafer taking and placing mechanism which comprises a shell, a large arm rotating mechanism and a small arm rotating mechanism, wherein a servo driving mechanism is arranged at the upper end of the shell, the large arm rotating mechanism is arranged at the outer side of the servo driving mechanism, the large arm rotating mechanism comprises a large arm body, a large arm shaft collar, a first rotating shaft and a transmission assembly, and the large arm body is arranged at the outer side of the upper end of the shell. The application belongs to the technical field of wafer picking and placing, and aims to solve the problem that the functions of stretching and retracting of a mechanical arm and movement of fingers with the same included angle relative to a large arm body all the time cannot be realized in the prior art, so that the conveying precision cannot be ensured. Meanwhile, the stable transmission effect of the transmission mechanism is poor. The mechanical arm has the technical effects that the functions that the mechanical arm can not stretch and retract and the fingers can not move at the same included angle relative to the large arm body all the time are solved, and therefore the conveying precision can not be ensured. Meanwhile, the stable transmission effect of the transmission mechanism is poor.

Inventors

  • WANG XIANGYANG

Assignees

  • 王向阳

Dates

Publication Date
20260512
Application Date
20250529

Claims (6)

  1. 1. The wafer taking and placing mechanism comprises a shell (1), a large arm rotating mechanism and a small arm rotating mechanism, and is characterized in that a servo driving mechanism is arranged at the upper end of the shell (1), and the large arm rotating mechanism is arranged at the outer side of the servo driving mechanism; The large arm rotating mechanism comprises a large arm body (7), a large arm shaft ring (8), a first rotating shaft (9) and a transmission assembly, wherein the large arm body (7) is arranged on the outer side of the upper end of the shell (1), the large arm shaft ring (8) is arranged in the large arm body (7), and the first rotating shaft (9) penetrates through the inner part of the upper end of the large arm body (7); the outer side of the upper end of the large arm rotating mechanism is provided with a small arm rotating mechanism, and the outer side of the upper end of the small arm rotating mechanism is provided with a wafer finger mechanism.
  2. 2. The wafer picking and placing mechanism according to claim 1, wherein the servo driving mechanism comprises a servo motor (2), a speed reducer (3), a transmission assembly and a transmission shaft (6), the servo motor (2) is installed in the shell (1), the speed reducer (3) is arranged on the outer side of the upper end of the servo motor (2), the output end of the speed reducer (3) is connected with the transmission assembly, and the transmission shaft (6) is installed at the upper end of the rear side of the transmission assembly.
  3. 3. The wafer picking and placing mechanism according to claim 2, wherein the transmission assembly comprises a synchronous pulley (4) and a synchronous transmission belt (5), the synchronous pulley (4) is mounted at the output end of the speed reducer (3), and the synchronous transmission belt (5) is arranged on the outer side of the synchronous pulley (4).
  4. 4. The wafer picking and placing mechanism according to claim 1, wherein the small arm rotating mechanism comprises a small arm body (10) and a transmission assembly, the small arm body (10) is arranged on the outer side of the upper end of the large arm body (7), the transmission assembly is installed in the small arm body (10), and the upper end of the first rotating shaft (9) extends to the inside of the small arm body (10).
  5. 5. The wafer picking and placing mechanism according to claim 1, wherein the wafer finger mechanism comprises a second rotating shaft (11), a finger mounting piece (12), a pipe joint (13) and a finger picking and placing clamp (14), the second rotating shaft (11) is installed inside the upper end of the forearm body (10) in a penetrating mode, and the second rotating shaft (11) is connected with a transmission assembly in the forearm body (10).
  6. 6. The wafer picking and placing mechanism according to claim 5, wherein a finger mounting member (12) is mounted on the outer side of the upper end of the forearm body (10), a pipe joint (13) is arranged on the outer side of the upper end of the finger mounting member (12), and a finger picking and placing clamp (14) located above the forearm body (10) is arranged on the outer side of the front end of the finger mounting member (12).

Description

Wafer picking and placing mechanism Technical Field The application relates to the technical field of wafer picking and placing, in particular to a wafer picking and placing mechanism. Background With the development of the domestic semiconductor industry, higher requirements are put on the processing technology of wafer processing. The wafer taking and placing is an indispensable link in the full-automatic wafer edging and chamfering process, and takes out the wafer conveyed by the customer site crown block to the next processing link, and simultaneously takes the task of placing the wafer processed by the chamfering machine back to the clamping plug and conveying the wafer to the designated position through the crown block. Therefore, the precision and the stability of the wafer picking and placing mechanism play a key role in the running process of the equipment. However, most of the wafer picking and placing mechanisms at present cannot realize the functions of stretching and retracting the mechanical arm and moving the fingers at the same included angle relative to the large arm body all the time, so that the conveying precision cannot be ensured. Meanwhile, the stable transmission effect of the transmission mechanism is poor. Disclosure of utility model Therefore, the application provides a wafer picking and placing mechanism, which aims to solve the problem that the existing functions of stretching and retracting of a mechanical arm and movement of fingers with the same included angle relative to a large arm body can not be realized all the time, so that the conveying precision can not be ensured. Meanwhile, the stable transmission effect of the transmission mechanism is poor. In order to achieve the above object, the present application provides the following technical solutions: The wafer taking and placing mechanism comprises a shell, a large arm rotating mechanism and a small arm rotating mechanism, wherein a servo driving mechanism is arranged at the upper end of the shell, and the large arm rotating mechanism is arranged at the outer side of the servo driving mechanism; The large arm rotating mechanism comprises a large arm body, a large arm shaft collar, a first rotating shaft and a transmission assembly, wherein the large arm body is arranged at the outer side of the upper end of the shell, the large arm shaft collar is arranged in the large arm body, and the first rotating shaft penetrates through the inner part of the upper end of the large arm body; the outer side of the upper end of the large arm rotating mechanism is provided with a small arm rotating mechanism, and the outer side of the upper end of the small arm rotating mechanism is provided with a wafer finger mechanism. Further, servo drive mechanism includes servo motor, speed reducer, drive assembly and transmission shaft, servo motor installs in the inside of shell, and servo motor's upper end outside is provided with the speed reducer, the output of speed reducer is connected with drive assembly, drive shaft is installed to drive assembly's rear side upper end. Further, the transmission assembly comprises a synchronous pulley and a synchronous transmission belt, wherein the synchronous pulley is arranged at the output end of the speed reducer, and the synchronous transmission belt is arranged on the outer side of the synchronous pulley. Further, the forearm rotary mechanism comprises a forearm body and a transmission assembly, wherein the forearm body is arranged on the outer side of the upper end of the big arm body, the transmission assembly is arranged in the forearm body, and the upper end of the first rotary shaft extends to the inside of the forearm body. Further, the wafer finger mechanism comprises a second rotating shaft, a finger mounting piece, a pipe joint and a finger picking and placing clamp, wherein the second rotating shaft is installed inside the upper end of the small arm body in a penetrating mode, and the second rotating shaft is connected with a transmission assembly in the small arm body. Further, the finger mounting piece is installed in the upper end outside of forearm body, and the upper end outside of finger mounting piece is provided with the coupling, the front end outside of finger mounting piece is provided with the finger that is located forearm body top and gets to put the clamp. Compared with the prior art, the application has at least the following beneficial effects: 1. The upper end of the shell is provided with a servo driving mechanism, the outer side of the servo driving mechanism is provided with a large arm rotating mechanism, the outer side of the upper end of the large arm rotating mechanism is provided with a small arm rotating mechanism, and the outer side of the upper end of the small arm rotating mechanism is provided with a wafer finger mechanism, so that the whole structure is compact in design, the minimum space limit of a customer is met, and the wafer carrying is better realiz