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CN-224234158-U - Prevent chip transportation carrier band structure of ESD damage

CN224234158UCN 224234158 UCN224234158 UCN 224234158UCN-224234158-U

Abstract

The utility model relates to the technical field of chip transportation carrier tapes, and particularly discloses an ESD damage prevention chip transportation carrier tape structure which comprises a transportation carrier tape body and clamping grooves, wherein the clamping grooves are formed in two sides of the surface of the transportation carrier tape body, a cover plate is slidably arranged in each clamping groove, an adsorption film is arranged in the center of the surface of the cover plate, a groove is formed in the transportation carrier tape body, an upper sliding groove is formed in the bottom of the inner side of the groove, an upper sliding block is slidably connected to the surface of the upper sliding groove, a lower sliding groove is formed in the bottom surface of the transportation carrier tape body, a lower sliding block is slidably connected to the surface of the lower sliding groove, a conductive plate is fixedly arranged on one side of the surface of the lower sliding block, and a grounding head is fixedly arranged at the bottom of the conductive plate.

Inventors

  • ZHOU JUN
  • PENG YAOHUI
  • FU YICHENG
  • SONG XUHUI

Assignees

  • 深圳市瑞强通信有限公司

Dates

Publication Date
20260512
Application Date
20250606

Claims (7)

  1. 1. The utility model provides a prevent chip transportation carrier band structure of ESD damage, includes transportation carrier band body (100) and draw-in groove (200), wherein draw-in groove (200) are seted up in transportation carrier band body (100) surface both sides, draw-in groove (200) inside slidable mounting has covering plate (201), covering plate (201) surface central point puts and is provided with adsorption film (202), transportation carrier band body (100) inside has seted up recess (101), upper chute (204) have been seted up to recess (101) inboard bottom, upper chute (204) surface sliding connection has upper slider (205), lower chute (206) have been seted up on transportation carrier band body (100) bottom surface, lower chute (206) surface sliding connection has lower slider (207), lower slider (207) surface one side fixed mounting has conducting plate (208), conducting plate (208) bottom fixed mounting has earthing terminal (209).
  2. 2. The ESD damage prevention chip carrier tape structure of claim 1, wherein the surface of the recess (101) is provided with a receiving groove (203).
  3. 3. The ESD damage prevention chip carrier tape structure of claim 1, wherein the guide rails (102) are fixedly installed on two sides above the carrier tape body (100).
  4. 4. The ESD damage prevention chip carrier tape structure of claim 2, wherein the accommodating groove (203) is uniformly formed on the surface of the groove (101), and the upper sliding groove (204) and the lower sliding groove (206) are symmetrically distributed at the upper end and the lower end of the surface of the accommodating groove (203).
  5. 5. The ESD damage prevention chip carrier tape structure of claim 1, wherein the cover plates (201) are symmetrically distributed on two sides above the accommodating groove (203), vertically correspond to the accommodating groove (203), and are slidably clamped above the accommodating groove (203) through the clamping groove (200).
  6. 6. The ESD damage prevention chip carrier tape structure of claim 1, wherein the upper chute (204) and the lower chute (206) vertically correspond, and the upper slider (205) and the lower slider (207) are synchronously slidingly adjusted through the upper chute (204) and the lower chute (206), and drive the conductive plate (208) and the grounding head (209) to be synchronously slidingly adjusted with the cover plate (201).
  7. 7. The ESD damage prevention chip carrier tape structure of claim 1, wherein the bottom of the adsorption film (202) and the center of the surface of the accommodating groove (203) are vertically corresponding.

Description

Prevent chip transportation carrier band structure of ESD damage Technical Field The utility model relates to the technical field of chip transportation carrier tapes, in particular to a chip transportation carrier tape structure capable of preventing ESD damage. Background Today, the semiconductor industry is developing vigorously, and the chip is used as a core component of various electronic devices, and the links of production, packaging and transportation are of great importance. However, during chip transportation, the problem of electrostatic discharge (ESD) damage has been a serious challenge for the industry. The design of the cover structure of the traditional carrier tape is also insufficient. Currently, many carrier tapes are designed by simple adhesive or press-fit covering, and a plurality of steps are required to be manually performed, so that the covering mode of the carrier tape is not tight enough in the operation process, and impurities such as dust and moisture are easy to enter due to vibration and friction in the transportation process, so that not only is the problem of electrostatic adsorption possibly caused, but also physical pollution and corrosion are caused to a chip, and the performance of the chip is affected. Disclosure of utility model The utility model aims to provide a chip transportation carrier band structure capable of preventing ESD damage, which solves the problems that impurities such as dust, moisture and the like are easy to enter due to vibration and friction in the transportation process, the problem of electrostatic adsorption is possibly caused, physical pollution and corrosion are caused to a chip, and the performance of the chip is influenced. In order to achieve the purpose, the chip transportation carrier belt structure capable of preventing ESD damage comprises a transportation carrier belt body and clamping grooves, wherein the clamping grooves are formed in two sides of the surface of the transportation carrier belt body, a cover plate is slidably arranged in each clamping groove, an adsorption film is arranged in the center of the surface of the cover plate, a groove is formed in the transportation carrier belt body, an upper sliding groove is formed in the bottom of the inner side of the groove, an upper sliding block is slidably connected to the surface of the upper sliding groove, a lower sliding groove is formed in the surface of the bottom of the transportation carrier belt body, a lower sliding block is slidably connected to the surface of the lower sliding groove, a conducting plate is fixedly arranged on one side of the surface of the lower sliding block, and a grounding head is fixedly arranged on the bottom of the conducting plate. Wherein, the holding groove is offered on recess surface. Wherein, guide rails are fixedly arranged on two sides above the transportation carrier belt body. Wherein, the holding tank is evenly offered on the recess surface, and goes up spout and lower spout symmetric distribution in both ends about the holding tank surface. Wherein, the cover plate is symmetrically distributed on two sides above the accommodating groove, vertically corresponds to the accommodating groove, and is slidably clamped above the accommodating groove through the clamping groove. The upper sliding groove and the lower sliding groove vertically correspond, and the upper sliding block and the lower sliding block are synchronously adjusted in a sliding manner through the upper sliding groove and the lower sliding groove and drive the conductive plate and the grounding head to be synchronously adjusted in a sliding manner with the covering plate. Wherein, the bottom of the adsorption film corresponds to the center of the surface of the containing groove. The utility model has at least the following beneficial effects: 1. Through the static electricity lead-out structure that lower spout, slider, current conducting plate and earthing terminal are constituteed down, can in time lead out and release the static electricity that produces to the earth in the transportation. The design is adjusted to synchronous sliding of last spout, last slider and lower spout, lower slider for the current-conducting plate can be all the time with the cover plate synchronous motion, no matter the cover plate is in what kind of position, can both guarantee the validity of static derivation, compares traditional carrier band passive antistatic mode, greatly reduced the chip because of the impaired risk of electrostatic discharge. 2. The guide rail above the transport carrier band body, the clamping grooves on two sides of the surface, the grooves in the transport carrier band body and the grooves in the transport carrier band body are matched with each other, static protection and chip protection are achieved, and meanwhile the stability of the whole structure of the transport carrier band is enhanced. The guide rail can assist the carrier tape to stably transmit on th