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CN-224234161-U - Chip positioning device for wire bonding machine

CN224234161UCN 224234161 UCN224234161 UCN 224234161UCN-224234161-U

Abstract

The utility model relates to the technical field of chip production, in particular to a chip positioning device for a wire bonding machine, which is arranged on a processing table, wherein an upper mounting seat is arranged at the rear side of the top end of the outer wall of the processing table, a wire processor is arranged on the upper mounting seat, a placing component for positioning and placing a chip is arranged at the top end of the outer wall of the processing table and below the wire processor, the placing component comprises a chip positioning frame, and a movable clamping seat and a chip positioning seat for clamping the chip are arranged at two sides of the inner wall of the chip positioning frame.

Inventors

  • Luo Jiehe
  • FENG YI
  • MA WEIBAO
  • XIAO ZHENMING

Assignees

  • 广东协铖微电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (9)

  1. 1. The chip positioning device for the wire bonding machine is characterized by being arranged on a processing table (100), wherein an upper mounting seat (110) is arranged on the rear side of the top end of the outer wall of the processing table (100), a wire processor (120) is arranged on the upper mounting seat (110), and a placing component for positioning and placing a chip is arranged below the wire processor (120) and on the top end of the outer wall of the processing table (100); The placing component comprises a chip positioning frame (200), the chip positioning frame (200) is installed at the top end of the outer wall of the processing table (100), and movable clamping bases (220) and chip positioning bases (230) for clamping chips are arranged on two sides of the inner wall of the chip positioning frame (200).
  2. 2. The chip positioning device for a wire bonding machine according to claim 1, wherein the movable clamping seat (220) and the chip positioning seat (230) are of a two-stage structure, the two chip positioning seats (230) are arranged on opposite sides of the two movable clamping seats (220), and chip clamping grooves (231) for clamping the outer ends of chips are formed in opposite sides of the two chip positioning seats (230).
  3. 3. The chip positioning device for a wire bonding machine according to claim 2, wherein the inner walls of the chip clamping grooves (231) are respectively fixed with a protection pad for protecting chip clamping, and one end of the chip positioning seat (230) close to the movable clamping seat (220) is respectively fixed with a connecting plug (232).
  4. 4. The chip positioning device for a wire bonding machine according to claim 3, wherein the plurality of connecting plugs (232) are uniformly arranged in a strip array, and the movable clamping seat (220) is close to one end of the chip positioning seat (230) and is provided with connecting slots (240) at positions corresponding to the connecting plugs (232).
  5. 5. The chip positioning device for a wire bonding machine according to claim 4, wherein the outer walls of the connecting plugs (232) are slidably connected with the inner walls of the corresponding connecting slots (240), and the outer walls of the chip positioning seat (230) are fixedly provided with magnetic insertion shafts (233) on the front side and the rear side of the connecting plugs (232).
  6. 6. The chip positioning device for a wire bonding machine according to claim 5, wherein the outer wall side ends of the movable clamping seat (220) are provided with magnetic insertion holes (241) at positions corresponding to the magnetic insertion shafts (233), and the outer walls of the magnetic insertion shafts (233) are in magnetic insertion connection with the inner walls of the magnetic insertion holes (241).
  7. 7. The chip positioning device for the wire bonding machine of claim 5, wherein the outer wall top end of the movable clamping seat (220) and the position corresponding to the connecting slot (240) are provided with positioning slots (242), the bottom ends of the positioning slots (242) are communicated with the inner wall top end of the connecting slot (240), the outer wall top end of the connecting plug (232) and the position corresponding to the positioning slots (242) are provided with fixing slots, and the inner wall top ends of the positioning slots (242) are fixedly connected with anti-falling plug blocks (243) for fixing the connecting plug (232) and the connecting slot (240).
  8. 8. The chip positioning device for the wire bonding machine according to claim 1, wherein guide sliding blocks (221) are fixed at the front end and the rear end of the outer wall of the movable clamping seat (220), the front end and the rear end of the inner wall of the chip positioning frame (200) are in sliding connection with the outer wall of the guide sliding blocks (221) through strip-shaped sliding grooves, guide sliding rods (223) are fixed at the positions, corresponding to the front end guide sliding blocks (221), of the two sides of the inner wall of the chip positioning frame (200), and the outer wall of the guide sliding blocks (221) is in sliding connection with the outer wall of the guide sliding rods (223) through holes.
  9. 9. The chip positioning device for the wire bonding machine of claim 8, wherein the inner wall of the chip positioning frame (200) is rotatably connected with a bidirectional screw (222) through a bearing seat at a position corresponding to the guide sliding block (221) at the rear end, the guide sliding block (221) at the rear end is in threaded connection with two sides of the outer wall of the bidirectional screw (222) through a screw hole, and a driving motor (210) for driving the bidirectional screw (222) to rotate forward and backward is fixed on one side of the outer wall of the chip positioning frame (200).

Description

Chip positioning device for wire bonding machine Technical Field The utility model relates to the technical field of chip production, in particular to a chip positioning device for a wire bonding machine. Background A chip wire bonding machine is a device used in semiconductor manufacturing to electrically connect an integrated circuit chip (IC) to a package substrate. Such machines play a critical role in microelectronic packaging technology. When the chip is subjected to wire bonding, the chip is required to be placed on the corresponding circuit board, and then the circuit board is clamped, so that the chip can be fixed on the bonding machine, subsequent processing operation of the chip is facilitated for personnel, the personnel are required to ensure that the positions of the chip are consistent when the chip is continuously produced, the personnel can continuously process the chip, the shape and the size of each circuit board are different according to the use and the design of the chip, and therefore the traditional clamping and positioning device cannot accurately clamp and position the circuit board when aiming at different circuit boards, and certain defects exist. In summary, it is necessary to provide a chip positioning device for a wire bonding machine. Disclosure of utility model Therefore, the utility model provides a chip positioning device for a wire bonding machine, which aims to solve the problem that the existing clamping and positioning device cannot accurately clamp and position different circuit boards when the shape and the size of each circuit board are different according to the use and the design of each circuit board. In order to achieve the above purpose, the utility model provides a chip positioning device for a wire bonding machine, which is arranged on a processing table, wherein an upper mounting seat is arranged at the rear side of the top end of the outer wall of the processing table, a wire processor is arranged on the upper mounting seat, and a placing component for positioning and placing a chip is arranged at the top end of the outer wall of the processing table and below the wire processor; the placing component comprises a chip positioning frame, the chip positioning frame is installed at the top end of the outer wall of the processing table, and a movable clamping seat and a chip positioning seat for clamping a chip are arranged on two sides of the inner wall of the chip positioning frame. Preferably, the movable clamping seat and the chip positioning seat are of two-section structure, the two chip positioning seats are arranged on two opposite sides of the movable clamping seat, and the two opposite sides of the chip positioning seats are provided with chip clamping grooves for clamping the outer ends of chips. Preferably, the inner wall of the chip clamping groove is fixed with a protection pad for protecting the chip clamping, and one end of the chip positioning seat, which is close to the movable clamping seat, is fixed with a connecting plug. Preferably, the plurality of connecting plugs are uniformly arranged in a strip array mode, and the positions of the movable clamping seat, which are close to one end of the chip positioning seat and correspond to the connecting plugs, are provided with connecting slots. Preferably, the outer wall of the connecting plug block is in sliding connection with the inner wall of the connecting slot at the corresponding position, and the magnetic attraction plug shafts are fixed on the outer wall of the chip positioning seat and positioned on the front side and the rear side of the connecting plug block. Preferably, the outer wall side end of the movable clamping seat and the position corresponding to the magnetic attraction inserting shaft are provided with magnetic attraction inserting holes, and the outer wall of the magnetic attraction inserting shaft is in magnetic attraction inserting connection with the inner wall of the magnetic attraction inserting hole. Preferably, the outer wall top of the movable clamping seat and the position corresponding to the connecting slot are provided with positioning slots, the bottom ends of the positioning slots are communicated with the inner wall top of the connecting slot, the outer wall top of the connecting plug block and the position corresponding to the positioning slot are provided with fixing slots, and the inner wall top of the positioning slot is fixedly connected with an anti-drop plug block for fixing the connecting plug block with the connecting slot. Preferably, the outer wall front and back ends of the movable clamping seat are all fixed with guide sliding blocks, the inner wall front and back ends of the chip positioning frame are all in sliding connection with the outer wall of the guide sliding blocks through a strip-shaped sliding groove, guide sliding rods are fixed at positions, corresponding to the front end guide sliding blocks, on two sides of the inner wall of the