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CN-224234162-U - Integrated circuit chip aggregation device

CN224234162UCN 224234162 UCN224234162 UCN 224234162UCN-224234162-U

Abstract

The utility model discloses an integrated circuit chip polymerization device, in particular to the technical field of chip polymerization devices, which comprises a processing table and test equipment, wherein the processing table is provided with a mounting groove at the top, two conveyor belts are fixedly arranged in the mounting groove, a plurality of partition plates distributed at equal intervals are fixedly arranged on the outer wall surfaces of the two conveyor belts, the integrated circuit chip is placed between two adjacent partition plates, a blanking groove is arranged on one side of the top of the processing table, a baffle is arranged at the top of the blanking groove, and connecting plates are fixedly arranged on the outer walls of the front side and the rear side of the baffle. According to the utility model, two integrated circuit chips are synchronously conveyed by the two conveyor belts, and the chips are respectively pushed by the two feeding plates to carry out polymerization operation, so that the polymerization efficiency of the integrated circuit chips can be effectively improved, and the chips are limited and fixed by the baffle plate and the blanking plate, so that positioning deviation of the two chips in the polymerization process can be effectively avoided, and the polymerization precision and effect of the chips are obviously improved.

Inventors

  • ZHANG HONGMEI
  • ZHANG HONGYE
  • DAI JIANNAN

Assignees

  • 峰雨光电科技(上海)有限公司

Dates

Publication Date
20260512
Application Date
20250611

Claims (6)

  1. 1. The integrated circuit chip aggregation device comprises a processing table (1) and test equipment (2) and is used for testing integrated circuit chips, and is characterized in that an installation groove (3) is formed in the top of the processing table (1), two conveyor belts (4) are fixedly arranged in the installation groove (3), a plurality of partition boards (5) distributed at equal intervals are fixedly arranged on the outer wall surfaces of the two conveyor belts (4), and the integrated circuit chips are placed between the two adjacent partition boards (5); The automatic feeding device is characterized in that a blanking groove (6) is formed in one side of the top of the processing table (1), a baffle (7) is arranged at the top of the blanking groove (6), connecting plates (8) are fixedly arranged on the outer walls of the front side and the rear side of the baffle (7), first electric push rods (9) are fixedly arranged at the bottom ends of the two connecting plates (8), and a feeding mechanism (10) is arranged at the top of the processing table (1).
  2. 2. The integrated circuit chip aggregation device according to claim 1, wherein the front side and the rear side of the top of the processing table (1) are provided with fixing grooves (11), and the two first electric push rods (9) are respectively fixed in the two fixing grooves (11).
  3. 3. The integrated circuit chip aggregation device according to claim 1, wherein the feeding mechanism (10) comprises a blanking plate (101) and two feeding plates (102), the outer walls of the blanking plate (101) and the two feeding plates (102) are respectively connected with a second electric push rod (103), and a plurality of second electric push rods (103) are respectively detachably mounted on the top of the processing table (1).
  4. 4. The integrated circuit chip aggregation device according to claim 1, wherein a support (12) is detachably fixed to the top of the processing table (1), a third electric push rod (13) is fixedly penetrated through the top of the support (12), and the bottom end of a piston rod of the third electric push rod (13) is connected with the testing equipment (2).
  5. 5. The integrated circuit chip aggregation device according to claim 1, wherein positioning rods (14) are fixedly arranged on the front side and the rear side of the top of the blanking groove (6), positioning holes (15) corresponding to the positioning rods (14) are formed in the bottom of the baffle plate (7), and the top ends of the positioning rods (14) penetrate through the positioning holes (15).
  6. 6. The integrated circuit chip aggregation device according to claim 1, wherein the driving roller (16) and the driven roller (17) are rotatably arranged in the mounting groove (3), the two conveyor belts (4) are sleeved on the driving roller (16) and the driven roller (17), a motor (18) is fixedly arranged at the rear end of the processing table (1), and the motor (18) is connected with the rear end of the driving roller (16) through a coupler.

Description

Integrated circuit chip aggregation device Technical Field The utility model relates to the technical field of chip aggregation devices, in particular to an integrated circuit chip aggregation device. Background Integrated circuit chips are the core and foundation of modern electronics technology that integrate multiple electronic components in a miniaturized fashion on a piece of silicon or other semiconductor material. The integrated circuit chip comprises a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one electronic element of a protective ring. The integration makes the circuit function more abundant and complex, and simultaneously reduces the volume, improves the reliability and reduces the cost. With the high-speed development of integrated circuit design level and process, the requirement for multi-chip integrated circuits is increasing. In actual production of integrated circuit chips, it is sometimes necessary to use two kinds of integrated circuit chips in combination, which requires inter-chip interconnection testing for a set of paired integrated circuit chips. For example, in an integrated circuit chip aggregation device with the publication number of CN217158145U in the prior art, two integrated circuit chips are aggregated to a test position on an integrated circuit chip test bench through a first aggregation cylinder and a second aggregation cylinder, so that the two integrated circuit chips can be conveniently tested by using integrated circuit chip test equipment subsequently, and the efficiency of performing interconnection test on a group of paired integrated circuit chips is remarkably improved. However, when the integrated circuit chip is conveyed into the test channel, the blocking piece is not arranged in the blanking channel, so that the integrated circuit chip is easy to deviate in the blanking channel, and the subsequent polymerization effect and the test work are affected. Based on the above, the utility model provides an integrated circuit chip aggregation device with accurate positioning. Disclosure of utility model In order to overcome the defects in the prior art, the utility model provides the integrated circuit chip aggregation device, which synchronously conveys two integrated circuit chips through two conveyor belts, and utilizes two feeding plates to respectively push the chips for aggregation operation, so that the aggregation efficiency of the integrated circuit chips can be effectively improved, and the chips are limited and fixed through the baffle plate and the blanking plate, so that positioning deviation of the two chips in the aggregation process can be effectively avoided, and the aggregation precision and effect of the chips are obviously improved, and the problems in the background technology are solved. In order to achieve the purpose, the integrated circuit chip aggregation device comprises a processing table and test equipment, wherein the processing table is provided with an installation groove at the top, two conveyor belts are fixedly arranged in the installation groove, a plurality of partition plates distributed at equal intervals are fixedly arranged on the outer wall surfaces of the two conveyor belts, the integrated circuit chip is placed between the two adjacent partition plates, a blanking groove is arranged on one side of the top of the processing table, a baffle is arranged on the top of the blanking groove, connecting plates are fixedly arranged on the outer walls of the front side and the rear side of the baffle, first electric push rods are fixedly arranged at the bottom ends of the two connecting plates, and a feeding mechanism is arranged at the top of the processing table. In a preferred embodiment, the front side and the rear side of the top of the processing bench are both provided with fixing grooves, the two first electric push rods are respectively fixed in the two fixing grooves, and the fixing grooves are provided for installing the first electric push rods, so that the stability of the first electric push rods can be improved. In a preferred embodiment, the feeding mechanism comprises a blanking plate and two feeding plates, the outer walls of the blanking plate and the two feeding plates are connected with second electric pushing rods, the second electric pushing rods are detachably mounted on the top of the processing table, and the blanking plate and the feeding plates are driven to automatically move by the aid of the second electric pushing rods, so that the aggregation detection efficiency of the integrated circuit chips can be improved. In a preferred embodiment, the processing bench top is detachably fixed with a support, the support top is fixedly penetrated with a third electric push rod, the bottom end of a piston rod of the third electric push rod is connected with the testing equipment, and the testing equipment is driven to automatically lift by the third electric push rod,