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CN-224234163-U - Compatible electrostatic chuck

CN224234163UCN 224234163 UCN224234163 UCN 224234163UCN-224234163-U

Abstract

The utility model relates to the technical field of semiconductor device manufacturing, in particular to a compatible electrostatic chuck, which comprises a dielectric layer, an electrode conducting layer and a base which are sequentially arranged from top to bottom, wherein a plurality of adsorption components which are sequentially arranged from top to bottom are arranged between the dielectric layer and the electrode conducting layer, each adsorption component comprises an electrode layer, an adsorption conducting layer and a plurality of conducting circuits which are sequentially arranged from top to bottom, each electrode layer comprises a plurality of groups of positive and negative regions, an isolation region is arranged between the positive and negative regions, the upper end of each conducting circuit is electrically connected with the corresponding positive and negative regions through the adsorption conducting layer, and the lower end of each conducting circuit is electrically connected with an external power supply through the plurality of adsorption components, the electrode conducting layer and the base which are sequentially arranged at the lower end of each conducting circuit, or the lower end of each conducting circuit is electrically connected with the external power supply through the electrode conducting layer and the base. The compatible electrostatic chuck changes the adsorption area by controlling the electrification of the positive and negative electrode areas of different areas, and is provided with a plurality of adsorption components for adsorbing wafers with different materials respectively, so that the compatibility is strong.

Inventors

  • CHEN WENJIE
  • CHEN GUANLIANG
  • CHANG XINFENG
  • LI GUOMING

Assignees

  • 广东精瓷新材料有限公司

Dates

Publication Date
20260512
Application Date
20250527

Claims (10)

  1. 1. The compatible electrostatic chuck is characterized by comprising a dielectric layer (1), an electrode conducting layer (2) and a base (3) which are sequentially arranged from top to bottom, wherein a plurality of adsorption assemblies which are sequentially arranged from top to bottom are arranged between the dielectric layer (1) and the electrode conducting layer (2), the adsorption assemblies are respectively used for adsorbing wafers of different materials, each adsorption assembly comprises an electrode layer (7), an adsorption conducting layer (8) and a plurality of conducting lines (9) which are sequentially arranged from top to bottom, the electrode layer (7) comprises a plurality of positive and negative electrode areas which are sequentially arranged on the same horizontal plane, an isolation area (10) is arranged between the positive and negative electrode areas, the upper end of each conducting line (9) is electrically connected with the corresponding positive and negative electrode areas through the adsorption conducting layer (8), and the lower end of each conducting line (9) is electrically connected with the base (3) through the plurality of adsorption assemblies, the electrode conducting layer (2) and the base (3) which are sequentially arranged at the lower end of each conducting line (9) until an external power supply is electrically connected, or the lower end of each conducting line (9) is sequentially electrically connected with the base (3) through the electrode conducting layer (2) and the corresponding electrode layer (3) in sequence.
  2. 2. The electrostatic chuck of claim 1, wherein the plurality of sets of positive and negative regions comprises a central positive and negative region (71) and a plurality of peripheral positive and negative regions (72), the plurality of peripheral positive and negative regions (72) surrounding the central positive and negative region (71), the plurality of peripheral positive and negative regions (72) being spaced apart along a diameter of the electrode layer (7).
  3. 3. The electrostatic compatible chuck of claim 2, wherein said peripheral anode and cathode regions (72) are one of annular or flower-shaped in cross-section.
  4. 4. The compatible electrostatic chuck according to claim 2, wherein the central positive and negative electrode region (71) comprises a first positive electrode (711) and a first negative electrode (712), an isolation region (10) is arranged between the first positive electrode (711) and the first negative electrode (712), the first positive electrode (711) and the first negative electrode (712) are respectively electrically connected with corresponding conducting lines (9), each peripheral positive and negative electrode region (72) comprises a second positive electrode (721) and a second negative electrode (722), an isolation region (10) is arranged between the second positive electrode (721) and the second negative electrode (722), and the second positive electrode (721) and the second negative electrode (722) are respectively electrically connected with corresponding conducting lines (9).
  5. 5. The compatible electrostatic chuck of claim 4, wherein said first positive electrode (711) surrounds a first negative electrode (712), or wherein said first negative electrode (712) surrounds a first positive electrode (711).
  6. 6. The compatible electrostatic chuck of claim 4, wherein said second positive electrode (721) surrounds a second negative electrode (722) or said second negative electrode (722) surrounds a second positive electrode (721).
  7. 7. The compatible electrostatic chuck of claim 4, wherein said first positive electrode (711) and said first negative electrode (712) are axisymmetrically disposed.
  8. 8. The compatible electrostatic chuck of claim 4, wherein said second positive electrode (721) and said second negative electrode (722) are axisymmetrically disposed.
  9. 9. The electrostatic chuck of claim 1, wherein the plurality of adsorption assemblies are a first adsorption assembly (4), a second adsorption assembly (5) and a third adsorption assembly (6) sequentially arranged from top to bottom, and the first adsorption assembly (4), the second adsorption assembly (5) and the third adsorption assembly (6) are used for adsorbing sapphire, silicon carbide and silicon wafers, respectively.
  10. 10. The compatible electrostatic chuck of claim 9, wherein the lower end of the conducting circuit (9) of the first adsorption component (4) is electrically connected to an external power supply through the electrode layer (7) of the second adsorption component (5), the adsorption conducting layer (8) of the second adsorption component (5), the electrode layer (7) of the third adsorption component (6), the adsorption conducting layer (8) of the third adsorption component (6), the electrode conducting layer (2) and the base (3) in sequence, the lower end of the conducting circuit (9) of the second adsorption component (5) is electrically connected to the external power supply through the electrode layer (7) of the third adsorption component (6), the adsorption conducting layer (8) of the third adsorption component (6), the electrode conducting layer (2) and the base (3) in sequence, and the lower end of the conducting circuit (9) of the third adsorption component (6) is electrically connected to the external power supply through the electrode conducting layer (2) and the base (3) in sequence.

Description

Compatible electrostatic chuck Technical Field The utility model relates to the technical field of semiconductor device manufacturing, in particular to a compatible electrostatic chuck. Background An electrostatic chuck is a device widely used in the semiconductor field, and is mainly used for fixing and adsorbing wafers to be processed. The electrostatic chuck realizes non-contact clamping, reduces particle pollution, can provide uniform adsorption force, is suitable for high-precision processing, and can work in special environments such as vacuum, plasma and the like. The prior art discloses application number 201821195261.3 electrostatic chuck and reaction chamber, including base 30, set up the zone of heating 20 on base 30 and set up the adsorbed layer 10 on zone of heating 20, be provided with the adsorption electrode in the adsorbed layer 10, through applying direct current voltage to the adsorption electrode, can produce electrostatic adsorption power between adsorption electrode and wafer to can realize fixing the wafer, after the technology is ended, apply the reverse voltage that the size is the same to the adsorption electrode, in order to remove the absorption to the wafer. Therefore, the existing electrostatic chuck is fixed in adsorption area, is difficult to adsorb wafers with different sizes and shapes, is mainly only provided with one adsorption layer, is difficult to be applied to wafers with different materials, is small in application range, and does not have compatibility. Disclosure of Invention In order to overcome the defects and shortcomings in the prior art, the utility model aims to provide a compatible electrostatic chuck which is characterized in that positive and negative electrode areas in different areas are connected through a control switch to generate static electricity, so that the adsorption area is changed to adsorb wafers with different sizes and shapes, and a plurality of adsorption assemblies for adsorbing wafers with different materials are arranged, so that the compatible electrostatic chuck is wide in application range and strong in compatibility. In order to solve the technical problems, the utility model adopts the following technical scheme: The utility model provides a compatible electrostatic chuck, includes dielectric layer, electrode conduction layer and the base that from last to being equipped with down in proper order, be equipped with a plurality of adsorption components that set gradually from last to being equipped with down between dielectric layer and the electrode conduction layer, a plurality of adsorption components are used for adsorbing the wafer of different materials respectively, every adsorption components all includes electrode layer, adsorption conduction layer and a plurality of conduction circuit that are located same horizontal plane from last to being equipped with down in proper order, electrode layer includes the positive and negative polar region that the multiunit is located same horizontal plane, be equipped with the isolation zone between the positive and negative polar region, the upper end of conduction circuit is connected with corresponding positive and negative polar region electricity through adsorption conduction layer, the lower extreme of conduction circuit is connected through a plurality of adsorption components, electrode conduction layer and the base that are located this conduction circuit lower extreme until external power supply electricity in proper order, perhaps the lower extreme of conduction circuit is connected through electrode conduction layer and base until external power supply electricity in proper order. Further, the positive and negative electrode areas comprise a central positive and negative electrode area and a plurality of peripheral positive and negative electrode areas, the peripheral positive and negative electrode areas encircle the central positive and negative electrode area, and the peripheral positive and negative electrode areas are arranged at intervals along the diameter direction of the electrode layer. Further, the cross section of the peripheral positive and negative electrode areas is one of annular or flower-shaped. Further, the central positive and negative electrode areas comprise a first positive electrode and a first negative electrode, an isolation area is arranged between the first positive electrode and the first negative electrode, the first positive electrode and the first negative electrode are respectively and electrically connected with corresponding conducting circuits, each peripheral positive and negative electrode area comprises a second positive electrode and a second negative electrode, an isolation area is arranged between the second positive electrode and the second negative electrode, and the second positive electrode and the second negative electrode are respectively and electrically connected with corresponding conducting circuits. Further, the first positi