CN-224234164-U - Fixation clamp with adjustable fork arm for semiconductor packaging

CN224234164UCN 224234164 UCN224234164 UCN 224234164UCN-224234164-U

Abstract

The utility model is mainly used in the back section packaging process of a semiconductor chip, and relates to a fixing clamp for packaging a semiconductor with an adjustable fork arm, which comprises a first clamping arm, a second clamping arm and an elastic piece, wherein the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutually clamping the end parts of the first clamping arm and the second clamping arm; the first clamping arm is provided with a hinge part, the hinge part is rotationally connected with the first fork arm and the second fork arm, and an included angle between the first fork arm and the second fork arm is adjusted through the hinge part; the ends of the first fork arm and the second fork arm are respectively provided with a fixing part, the position of the second clamping arm opposite to the fixing part is provided with a clamping plane, and the semiconductor to be packaged is clamped through the fixing part and the clamping plane. The fixing clamp is used for replacing pressing blocks and screw jacking, a complex jig and clamp are not required to be ordered according to the chip size, and in addition, the semiconductor to be packaged can be uniformly pressed by the multi-strand fork arms or can be clamped simultaneously.

Inventors

XIE JIAN
LIU JIANPING

Assignees

东莞市海亿精密机械有限公司

Dates

Publication Date: 20260512
Application Date: 20241224

Claims (8)

1. The fixing clamp for semiconductor packaging with the adjustable fork arms comprises a first clamping arm, a second clamping arm and an elastic piece, and is characterized in that the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutually clamping the end parts of the first clamping arm and the second clamping arm; The first clamping arm is provided with a hinge part, the hinge part is rotationally connected with the first fork arm and the second fork arm, and the included angle between the first fork arm and the second fork arm is adjusted through the hinge part; The semiconductor packaging device comprises a first fork arm, a second fork arm, a first clamping arm and a second clamping arm, wherein the ends of the first fork arm and the second fork arm are respectively provided with a fixing part, a clamping plane is arranged at the position, opposite to the fixing part, of the second clamping arm, and a semiconductor to be packaged is clamped through the fixing part and the clamping plane.
2. The clip of claim 1, wherein the second clamping arm is T-shaped and includes a main arm and the clamping plane, the clamping plane having a width greater than the main arm.
3. A mounting clip for semiconductor packages having adjustable prongs according to any of claims 1 to 2, wherein the mounting portion is provided with a flexible pad on the face contacting the semiconductor to be packaged.
4. A clip for semiconductor packages having adjustable prongs as defined in claim 3, wherein the securing portion is U-shaped in configuration.
5. The clip for semiconductor package having an adjustable fork according to claim 1, wherein the other ends of the first and second clip arms are provided with a biasing portion, and the fork of the first clip arm is separated from the second clip arm after the biasing portion is biased.
6. The clip for semiconductor packages having adjustable prongs of claim 1, wherein the resilient member is a torsion spring.
7. A mounting clip for semiconductor packages having adjustable prongs as defined in claim 1, wherein, the elastic piece is detachably connected with the first clamping arm or the second clamping arm.
8. The clip for semiconductor packages having an adjustable yoke according to claim 1, wherein a fixing lug for fixing the elastic member is provided at a position where the first and second clamp arms are mounted with the elastic member.

Description

Fixation clamp with adjustable fork arm for semiconductor packaging Technical Field The utility model relates to a semiconductor packaging technology, which is mainly applied to a back end packaging link of a semiconductor packaging process, in particular to a fixing tool used in a sealing or capping process in the semiconductor packaging process. Background The gold-tin seal welding or gold-tin seal cap process is generally applied to a back-end packaging link of a semiconductor packaging process, particularly in a sealing or cap (LID ATTACH) process, and is mainly used for ensuring the air tightness and stability of a chip after packaging, preventing external moisture or other pollutants from entering the package body, and protecting the functions and performances of the chip. In a general gold-tin seal welding process, a gravity block is designed according to the appearance of a chip to apply pressure, the periphery of the gravity block is locked by a cover plate, and meanwhile, enough pressure is needed to be applied above the cover plate to avoid the defects of solder hollowness or solder overflow and the like formed at a welding interface, but along with the melting of a soldering lug, screws for fixing the cover plate can loosen to cause uneven stress, thereby affecting the flow of solder and causing the problems of solder surface hollowness or solder overflow and the like. In addition, because the gravity block and the jig for placing the chip are required to be prepared according to the size of the chip, the chips with different sizes are required to have the corresponding jig and the gravity block, and the cost is high. Therefore, in order to solve the above problems, a simple and convenient technical solution is required. Disclosure of utility model In order to solve the above problems, the utility model provides a fixing clamp for packaging a semiconductor with an adjustable fork arm, which comprises a first clamping arm, a second clamping arm and an elastic piece, and is characterized in that the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutually clamping the end parts of the first clamping arm and the second clamping arm, the first clamping arm is provided with a hinge part, the hinge part is rotationally connected with the first fork arm and the second fork arm, an included angle between the first fork arm and the second fork arm is adjusted through the hinge part, the end parts of the first fork arm and the second fork arm are respectively provided with a fixing part, and a clamping plane is arranged at a position opposite to the fixing part of the second clamping arm and clamps the semiconductor to be packaged through the fixing part and the clamping plane. Further, the second clamping arm is T-shaped and comprises a main force arm and a clamping plane, and the width of the clamping plane is larger than that of the main force arm. Further, a flexible pad is provided on a surface of the fixing portion, which contacts the semiconductor to be packaged. Further, the fixing part is of a U-shaped structure. Further, the other ends of the first clamping arm and the second clamping arm are provided with force application parts, and after the force application parts are applied with force, the fork arms of the first clamping arm are separated from the second clamping arm. Further, the elastic member is a torsion spring. Further, the elastic member is detachably connected with the first clamping arm or the second clamping arm. Furthermore, fixing lugs are arranged at the positions where the elastic pieces are arranged on the first clamping arms and the second clamping arms, and the fixing lugs are used for fixing the elastic pieces. The utility model has the beneficial effects that: 1. The fixing clamp is used for replacing pressing blocks and screw jacking, a complex jig and a clamp are not required to be made according to the chip size, and the chip cover plate can have constant clamping force through the fixing clamp. 2. The clamping position can be adjusted according to the size of the semiconductor to be packaged by utilizing the adjustable fork arm, so that the stress of the semiconductor to be packaged is uniform, or a plurality of semiconductors to be packaged can be clamped at the same time. 3. The elastic pieces are detachably connected, the elastic pieces with different elasticity can be replaced according to the clamping force, and meanwhile, the elastic pieces with aging or elastic fatigue can be replaced conveniently. Drawings In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained accordi