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CN-224234165-U - Tray for carrying wafer

CN224234165UCN 224234165 UCN224234165 UCN 224234165UCN-224234165-U

Abstract

The application provides a tray for bearing wafers, and relates to the technical field of semiconductor manufacturing. The wafer cleaning device is characterized by comprising a bearing seat, a protective cover and a cleaning mechanism, wherein the bearing seat is provided with a bearing part and is used for supporting a wafer, the protective cover is buckled on the bearing seat, a containing space for containing the edge of the wafer is formed between the protective cover and the bearing part, and when plasma is adopted for cleaning the surface of the wafer, the protective cover is used for shielding the edge of the wafer. The tray for carrying the wafer can prevent the protective film from being damaged in the plasma cleaning process, thereby avoiding plating on the back surface, obviously improving the yield and the reliability of the single-sided chemical plating wafer, and reducing the plating defect on the back surface caused by falling of the protective film.

Inventors

  • LI KAI
  • LIU MENGTING

Assignees

  • 芯恩（青岛）集成电路有限公司

Dates

Publication Date
20260512
Application Date
20250411

Claims (10)

  1. 1. A tray for carrying wafers, comprising: the bearing seat is provided with a bearing part and is used for supporting the wafer; The protective cover is buckled on the bearing seat, and a containing space for containing the edge of the wafer is formed between the protective cover and the bearing part; when the surface of the wafer is cleaned by adopting plasma, the protective cover is used for shielding the edge of the wafer.
  2. 2. The tray for carrying wafers according to claim 1, wherein the carrier comprises: A base; The outer ring baffle is arranged on the base, and the inner diameter of the outer ring baffle is larger than the diameter of the wafer; The inner bearing ring is arranged on the base, the inner bearing ring and the outer ring baffle are concentrically arranged, the inner diameter of the inner bearing ring is smaller than the diameter of the wafer, and the outer diameter of the inner bearing ring is smaller than or equal to the inner diameter of the outer ring baffle.
  3. 3. The tray for carrying wafers according to claim 2, wherein the outer ring baffle is provided with a plurality of wafer taking grooves, the wafer taking grooves penetrate through the inner side wall and the outer side wall of the outer ring baffle, the bottom wall of the wafer taking grooves is located between the top surface of the inner carrying ring and the base, and the height of the inner carrying ring is greater than 10mm.
  4. 4. A tray for carrying wafers according to claim 2 wherein the height of the outer ring baffle is more than 5mm higher than the height of the inner carrier ring and/or the thickness of the base is greater than 5mm.
  5. 5. The tray for carrying wafers according to claim 2, wherein the inner diameter of the outer ring baffle is 2mm to 4mm larger than the diameter of the wafer.
  6. 6. The tray for carrying wafers according to claim 2, wherein the inner diameter of the inner carrier ring is 4mm to 8mm smaller than the diameter of the wafer.
  7. 7. A tray for carrying wafers as claimed in claim 3, wherein the protective cover comprises: the outer layer support ring is used for being covered on the outer ring baffle; The inner protection ring is arranged concentrically with the outer support ring, the outer support ring is fixed on the inner protection ring, the outer side wall of the inner protection ring is fixedly connected with the inner side wall of the outer support ring, and the inner diameter of the inner protection ring is smaller than the diameter of the wafer and is used for shielding the edge of the wafer.
  8. 8. The tray for carrying wafers according to claim 7, wherein the protective cover further comprises a plurality of clamping protrusions embedded on the outer-layer supporting ring and arranged in one-to-one correspondence with the sheet taking grooves, the clamping protrusions are matched with the sheet taking grooves to position the outer-layer supporting ring, and the height of the clamping protrusions is identical with that of the outer-ring baffle.
  9. 9. The tray for carrying wafers according to claim 7, wherein the inner diameter of the inner guard ring is 4mm to 6mm smaller than the diameter of the wafer.
  10. 10. The tray for carrying wafers according to claim 7, wherein a distance between a face of the inner guard ring facing the wafer and a surface of the wafer is 1mm to 2mm.

Description

Tray for carrying wafer Technical Field The application relates to the technical field of semiconductor manufacturing, in particular to a tray for bearing wafers. Background In the process of semiconductor manufacturing, a single-sided chemical plating process is a common technique for forming a conductive or protective film layer on one side of a wafer, while the other side needs to be kept in a non-plated state. To achieve this, a protective film is typically applied to the back side of the wafer to prevent the back side from being plated with a metal layer during the electroless plating process. Before chemical plating, the surface of the wafer needs to be subjected to plasma cleaning to remove dirt and impurities on the surface, so that the surface activity is improved, and the uniformity and the adhesive force of the chemical plating layer are ensured. However, when the wafer surface is subjected to plasma cleaning, the protective film is exposed to a plasma environment, and since the protective film is generally made of an organic material, high-energy particles of the plasma attack the protective film, resulting in a decrease in the bonding force with the wafer back surface. In the subsequent chemical plating process, the protective film is easy to fall off, so that the back of the wafer is plated with a metal layer, and the yield and reliability of the product are affected. Disclosure of utility model The application mainly provides a tray for bearing wafers, which is used for solving the problem that a protective film on the back of the wafer is easy to fall off. The technical scheme adopted for solving the technical problems is as follows: The application provides a tray for carrying wafers, which comprises a carrying seat, a protective cover and a tray, wherein the carrying seat is provided with a carrying part and is used for supporting the wafers, the protective cover is buckled on the carrying seat, a containing space for containing the edges of the wafers is formed between the protective cover and the carrying part, and when plasma is adopted for cleaning the surfaces of the wafers, the protective cover is used for shielding the edges of the wafers. The bearing seat comprises a base, an outer ring baffle plate and an inner bearing ring, wherein the outer ring baffle plate is arranged on the base, the inner diameter of the outer ring baffle plate is larger than the diameter of a wafer, the inner bearing ring is the bearing part and is arranged on the base, the inner bearing ring and the outer ring baffle plate are arranged concentrically, the inner diameter of the inner bearing ring is smaller than the diameter of the wafer, and the outer diameter of the inner bearing ring is smaller than or equal to the inner diameter of the outer ring baffle plate. Optionally, a plurality of piece grooves of getting have been seted up on the outer loop baffle, get the piece groove and link up the inside wall and the lateral wall of outer loop baffle, just get the diapire in piece groove be located interior carrier ring's top surface with between the base, interior carrier ring's height is greater than 10mm. Optionally, the height of the outer ring baffle is more than 5mm higher than the height of the inner bearing ring, and/or the thickness of the base is greater than 5mm. Optionally, the inner diameter of the outer ring baffle is 2 mm-4 mm larger than the diameter of the wafer. Optionally, the inner diameter of the inner bearing ring is 4 mm-8 mm smaller than the diameter of the wafer. Optionally, the protective cover comprises an outer layer supporting ring and an inner layer protecting ring, wherein the outer layer supporting ring is used for being arranged on the outer ring baffle in a covering mode and fixing the inner layer protecting ring, the inner layer protecting ring is arranged concentrically with the outer layer supporting ring, the outer side wall of the inner layer protecting ring is fixedly connected with the inner side wall of the outer layer supporting ring, and the inner diameter of the inner layer protecting ring is smaller than the diameter of the wafer and is used for shielding the edge of the wafer. Optionally, the visor still includes a plurality of card protruding, the card protruding inlays and establishes on the outer support ring, and with get the piece groove one-to-one setting, the card protruding with get the cooperation of piece groove, in order to right outer support ring location, the card protruding highly with the height of outer loop baffle is unanimous. Optionally, the inner diameter of the inner protection ring is 4 mm-6 mm smaller than the diameter of the wafer. Optionally, a distance between one surface of the inner protection ring facing the wafer and the surface of the wafer is 1 mm-2 mm. The tray for carrying the wafer has the beneficial effects that the wafer is placed on the carrying seat, the protective cover is buckled on the carrying seat to shield the edge of