Search

CN-224234166-U - Can overturn workstation and die bonder

CN224234166UCN 224234166 UCN224234166 UCN 224234166UCN-224234166-U

Abstract

The application relates to the technical field of die bonders, and discloses a reversible workbench and a die bonder, which are used for assisting the die bonder to finish wafer adhesion of a tube seat in a material tray, and comprise the following steps: the overturning clamping table comprises bearing seats arranged on two sides of a bottom plate, a rotating shaft is connected to the inside of the bearing seats through bearings, cushion blocks are arranged outside the rotating shaft, a vacuum plate is arranged outside the cushion blocks, connecting seats are arranged on the same side of one end of the vacuum plate, which is far away from the cushion blocks, a track and a third cylinder are arranged on the bottom plate, a sliding block is slidably arranged on the track, a tube seat is fixed through a workbench, the workbench can be overturned to enable the tube seat to incline, the inclined surface of the tube seat is horizontal relative to the horizontal surface, and then a chip is fixed on the inclined surface of the tube seat.

Inventors

  • WU YUNSONG
  • Zhan Xiaoduan
  • WU YUNQI
  • Gan Junhuang
  • CHEN GUOJIAN

Assignees

  • 深圳市大成自动化设备有限公司

Dates

Publication Date
20260512
Application Date
20250421

Claims (10)

  1. 1. The utility model provides a can overturn workbench for assisting the die bonder accomplish the wafer adhesion of tray (4) inside tube socket (41), its characterized in that includes upset clamp (3), upset clamp (3) are including locating bearing frame (311) of bottom plate (31) both sides, be connected with pivot (312) through the bearing in bearing frame (311), pivot (312) peripheral hardware cushion (313), cushion (313) outside is equipped with vacuum plate (32), vacuum plate (32) keep away from the one end homonymy of cushion (313) is equipped with connecting seat (342), be equipped with track (36) and third cylinder (33) on bottom plate (31), be equipped with slider (35) on the track (36) slidably, one side that slider (35) are close to vacuum plate (32) is equipped with connecting block (34), connecting block (34) and connecting seat (342) constitute the linkage pair through connecting rod (341); When the wafers are pasted, the third air cylinder (33) drives the connecting block (34) to drive the connecting seat (342) to move, so that the vacuum plate (32) rotates through the rotating shaft (312) to drive the inclined surface (411) of the inner tube seat (41) of the charging tray (4) to be parallel to the horizontal plane, and the wafer pasting is completed.
  2. 2. The reversible table according to claim 1, wherein the two ends of the connecting rod (341) are pivotally connected to the connecting block (34) and the connecting seat (342) by means of a pivot pin, respectively, to form a hinge structure, so that the displacement of the connecting block (34) can be converted into a synchronous displacement movement of the connecting seat (342).
  3. 3. The reversible table of claim 1, further comprising: the inclined block (1), the said inclined block (1) is installed on die bonder; and the XY axis module (2) is arranged on the inclined surface of the inclined block (1) and used for driving the overturning clamping table (3) to generate transverse and longitudinal compound displacement movement in the plane.
  4. 4. The turnover workbench according to claim 1, wherein side baffles (321) are arranged on two sides of the vacuum plate (32), a chute (322) is formed in at least one side baffle (321), a first air cylinder (323) is arranged on the same side of the vacuum plate (32), a top block (324) is arranged at the output end of the first air cylinder (323), the top block (324) is slidably connected in the chute (322), and the top block (324) is used for limiting the material tray (4).
  5. 5. The reversible workbench according to claim 1, wherein at least one second cylinder (325) is arranged on both sides of the vacuum plate (32), a pressing block (326) is arranged at the output end of the second cylinder (325), and the pressing block (326) is used for limiting the charging tray (4).
  6. 6. The reversible workbench according to claim 1, wherein a limiting block (327) is arranged on one side of the vacuum plate (32) away from the inlet and outlet of the tray (4), and at least one limiting block (327) is arranged for limiting the tray (4).
  7. 7. The reversible table according to claim 1, wherein the base plate (31) is provided with two adjustment blocks (361), and the adjustment blocks (361) are used for limiting the movement stroke of the connecting block (34).
  8. 8. The reversible table according to claim 7, wherein the adjustment block (361) is detachably connected to the base plate (31), and the movement stroke of the connection block (34) is changed with the adjustment after the adjustment block (361) is positionally adjusted.
  9. 9. The reversible table according to claim 1, wherein the vacuum plate (32) is externally connected to an interface (37) for negative pressure equipment.
  10. 10. A die bonder, which is characterized by comprising a loading and unloading mechanism (50), an auxiliary loading and unloading mechanism (60), a detection mechanism (70), a thimble mechanism (80), a die-picking workbench (90), a portal frame (100), a die-bonding detection mechanism (110), a dispensing mechanism (120), a die-picking mechanism (130), a die-picking detection mechanism (140) and the reversible workbench according to any one of claims 1-9; The loading and unloading mechanism (50) is used for bearing and adjusting the position of the material tray (4); the auxiliary feeding and discharging mechanism (60) is used for driving the material tray (4) to be led in and led out of the vacuum plate (32); The detecting mechanism (70) is used for detecting whether the wafer position after the wafer is picked by the wafer picking mechanism (130) is accurate; The thimble mechanism (80) is used for adjusting the position of the wafer; The wafer taking workbench (90) is used for bearing and adjusting the position of the wafer; The portal frame (100) is used for loading a die bonding detection mechanism (110), a dispensing mechanism (120), a die picking mechanism (130) and a die picking detection mechanism (140); The die bonding detection mechanism (110) is used for detecting whether the position of the wafer adhered to the tube seat (41) is accurate or not; The dispensing mechanism (120) is used for dispensing the inclined surface (411) of the tube seat (41); the crystal taking mechanism (130) is used for taking the wafer from the crystal taking workbench (90); The wafer taking detection mechanism (140) is used for detecting whether the wafer taking mechanism (130) takes wafers from the wafer taking workbench (90) accurately or not.

Description

Can overturn workstation and die bonder Technical Field The application belongs to the technical field of die bonders, and relates to a reversible workbench and a die bonder. Background In the field of semiconductor package manufacturing, a die bonder is used as one of core devices for bonding a wafer to a specified position of a tube seat with high precision, and the positioning precision directly affects the electrical performance and reliability of a packaged device. Along with the development of packaging technology to high-density and three-dimensional integration, the complexity of the tube seat structure is remarkably improved, for example, a part of the tube seat surface is designed with a specific inclined plane, and the inclined plane needs to be ensured to be strictly in a horizontal state in the die bonding process so as to avoid die bonding deviation or subsequent packaging process failure caused by angle deviation. When the traditional workbench is used, the custom fixture is required to be frequently replaced or the calibration is repeated depending on experience of an operator, so that the equipment preparation time is prolonged, and the production efficiency is reduced. Therefore, how to provide a reversible workbench and a die bonder, which can fix a tube seat and tilt the tube seat to finish wafer bonding is a technical problem to be solved. Disclosure of utility model In order to overcome the problems in the related art, the application aims to provide a reversible workbench and a die bonder, which can fix a tube seat and tilt the tube seat by turning over so as to finish wafer bonding. The application is realized by the following technical scheme. According to the technical scheme, the turnover workbench is used for assisting a die bonder in completing wafer adhesion of a tube seat in a material tray and comprises a turnover clamping table, wherein the turnover clamping table comprises bearing seats arranged on two sides of a bottom plate, a rotating shaft is connected inside the bearing seats through bearings, a cushion block is arranged outside the rotating shaft, a vacuum plate is arranged outside the cushion block, a connecting seat is arranged on the same side of one end of the vacuum plate far away from the cushion block, a track and a third cylinder are arranged on the bottom plate, a sliding block is slidably arranged on the track, a connecting block is arranged on one side, close to the vacuum plate, of the sliding block, and the connecting block and the connecting seat form a linkage pair through a connecting rod; When the wafers are pasted, the third air cylinder drives the connecting block to drive the connecting seat to move, so that the vacuum plate rotates through the rotating shaft, and the inclined surface of the inner tube seat of the charging tray is driven to be parallel to the horizontal plane, and the wafers are pasted. According to the technical scheme, the pipe seat is fixed through the workbench, the workbench can be overturned to enable the pipe seat to incline, the inclined surface of the pipe seat is horizontal relative to the horizontal plane, and then the chip is fixed on the inclined surface of the pipe seat. The utility model is further arranged that the two ends of the connecting rod are respectively pivoted with the connecting block and the connecting seat through the rotary pin to form a hinge structure, so that the displacement of the connecting block can be converted into synchronous displacement movement of the connecting seat. The utility model is further arranged to further comprise: the inclined block is arranged on the die bonder; And the XY axis module is arranged on the inclined surface of the inclined block and used for driving the overturning clamping table to generate transverse and longitudinal compound displacement movement in the plane. The utility model is further characterized in that two sides of the vacuum plate are provided with side baffles, at least one side baffle is provided with a chute, the same side of the vacuum plate is provided with a first cylinder, the output end of the first cylinder is provided with a top block, the top block is slidably connected in the chute, and the top block is used for limiting the material tray. The utility model is further arranged that at least one second cylinder is arranged on two sides of the vacuum plate, a pressing block is arranged at the output end of the second cylinder, and the pressing block is used for limiting the material tray. The utility model is further arranged that a limiting block is arranged on one side, away from the inlet and the outlet of the material tray, of the vacuum plate, and at least one limiting block is arranged for limiting the material tray. The utility model is further characterized in that the bottom plate is provided with two adjusting blocks for limiting the moving travel of the connecting block. The utility model is further characterized in that the adjust