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CN-224234168-U - Wafer feeding device

CN224234168UCN 224234168 UCN224234168 UCN 224234168UCN-224234168-U

Abstract

The utility model discloses a wafer feeding device, and belongs to the technical field of semiconductor production equipment. The device comprises a frame, a first storage rack, a material taking mechanism and a material tray conveying system. The material disc conveying system comprises a plate turnover mechanism and a wafer conveying manipulator, wherein the plate turnover mechanism is controlled by a servo motor to realize 180-degree accurate turnover and automatic turnover of the material disc, and the manipulator is combined with a visual positioning system to accurately load the wafer into the positioning circular groove of the material disc. The utility model solves the problems of low feeding efficiency, easy damage, poor compatibility and the like of the traditional wafer through whole bin material taking, multi-station cooperation and automatic carrying, has the characteristics of high efficiency, high precision, high compatibility, high space utilization rate and the like, and remarkably improves the yield and the productivity of semiconductor production.

Inventors

  • XIA WEIWEI
  • PAN QIN

Assignees

  • 鑫睿炜半导体科技(苏州)有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (10)

  1. 1. The wafer feeding device is characterized by comprising a frame (10), wherein at least one first storage rack (11) is arranged on the frame (10), a plurality of bins (12) are arranged on the first storage rack (11), and a plurality of wafers are placed in each bin (12); A material taking mechanism (20) is arranged on the frame (10), and the material taking mechanism (20) is used for taking out all wafers placed in a single bin (12) at one time and carrying the wafers to a material taking station; The material taking mechanism (20) comprises a material taking frame (21), the material taking frame comprises a plurality of paddles (22) which are uniformly arranged up and down, a limiting block (23) is connected between the two paddles (22), and the limiting block (23) is used for separating two adjacent paddles (22) and positioning wafers; The wafer picking device is characterized in that the poking sheets (22) are further provided with suckers, the suckers are used for adsorbing the wafers when the material taking mechanism (20) carries the wafers, and the suckers of the poking sheets (22) are connected through negative pressure air pipes.
  2. 2. The wafer feeding device according to claim 1, wherein the bin (12) is of a vertically-distributed U-shaped opening structure, a plurality of partition grooves which are arranged up and down are uniformly distributed on the inner wall of the bin (12), the partition grooves are used for inserting wafers, and the distance between the partition grooves is matched with the thickness of the wafers.
  3. 3. A wafer feeder according to claim 2, wherein a plurality of bins (12) on the first storage rack (11) are opened inwards, a space between two bins (12) arranged opposite to the openings is provided with a space avoidance channel for movement of the material taking rack (21), and the width of the space avoidance channel is larger than the transverse movement stroke of the material taking rack.
  4. 4. A wafer feeder according to any one of claims 1-3, wherein the take-off mechanism (20) further comprises a first drive mechanism for driving the take-off rack (21) horizontally in the X-axis and Y-axis directions and in a lifting motion.
  5. 5. A wafer feeding device according to claim 4, wherein two second material storage frames (13) are arranged on the frame (10) in opposite directions, the second material storage frames (13) are used for placing wafer trays (14), and a plurality of positioning round grooves for placing wafers are arranged on the wafer trays (14).
  6. 6. A wafer feeder according to claim 5, characterized in that a tray handling mechanism (15) is further arranged between the two second storage racks (13), the tray handling mechanism (15) being configured to handle empty wafer trays (14) on the second storage racks (13) to the loading station and to return the wafer trays (14) loaded with wafers to the second storage racks (13).
  7. 7. A wafer feed device according to claim 6, characterized in that the tray handling mechanism (15) comprises a flap mechanism (16), the flap of the flap mechanism (16) being arranged to be turned horizontally 180 ° for handling the wafer trays (14) of the second magazine (13) on both sides.
  8. 8. A wafer feeder according to claim 7, characterized in that the tray handling mechanism (15) further comprises a second drive mechanism for driving the flap mechanism (16) horizontally along the X-axis and in a lifting motion.
  9. 9. A wafer feeding device according to claim 8, wherein a wafer handling manipulator (17) is further arranged between the two second storage frames (13), and the wafer handling manipulator (17) is used for handling the wafer on the material taking frame (21) into the positioning round groove on the wafer tray (14).
  10. 10. The wafer feeding device according to claim 9, wherein the wafer handling manipulator (17) is provided with an arc clamping jaw, the bottom of the arc clamping jaw is provided with a plurality of anti-slip limiting posts, and the anti-slip limiting posts are used for sequentially clamping wafers on the material taking frame (21) from top to bottom.

Description

Wafer feeding device Technical Field The application belongs to the technical field of semiconductor production equipment, and particularly relates to a wafer feeding device. Background In the wafer processing process, the traditional mode of manually or singly-arm manipulators for carrying wafers one by one is low in efficiency, and the surfaces of the wafers are easily scratched or broken due to improper operation. The existing storage device adopts a horizontal stacking structure, so that a material box needs to be moved frequently, and quick transfer and accurate positioning of the whole bin of wafers are difficult to realize. In addition, in the transfer process of wafers from the storage rack to the trays, the existing equipment is difficult to adapt to compatibility requirements of the trays with different specifications, and the tray replacement process is complex, so that production efficiency is affected. Disclosure of utility model The utility model aims to solve the technical problems in the prior art, thereby providing a wafer feeding device of a wafer feeding device, aiming at solving at least one of the technical problems through the cooperative operation of a multi-station cooperative material storage rack, a whole bin material taking mechanism and a material tray automatic conveying system. The technical scheme adopted for solving the technical problems is as follows: The wafer feeding device comprises a rack, wherein at least one first storage rack is arranged on the rack, a plurality of bins are arranged on the first storage rack, and a plurality of wafers are placed in a single bin; The machine frame is provided with a material taking mechanism which is used for taking out all the wafers placed in the single bin at one time and carrying the wafers to a material taking station; The material taking mechanism comprises a material taking frame, the material taking frame comprises a plurality of paddles which are uniformly arranged up and down, a limiting block is connected between the two paddles, and the limiting block is used for separating two adjacent paddles and positioning a wafer; The wafer picking device is characterized in that the poking sheets are further provided with suction discs, the suction discs are used for sucking wafers when the material taking mechanism conveys the wafers, and the suction discs of the poking sheets are connected through negative pressure air pipes. Preferably, in the wafer feeding device, the bin is of a vertically distributed U-shaped opening structure, a plurality of partition grooves which are arranged up and down are uniformly distributed on the inner wall of the bin, the partition grooves are used for inserting wafers, and the distance between the partition grooves is matched with the thickness of the wafers. Preferably, in the wafer feeding device of the present utility model, a plurality of bin openings on the first storage rack are inward, a space between the bins arranged at two opposite openings is provided with a space avoidance channel for moving the material taking rack, and the width of the space avoidance channel is larger than the transverse moving stroke of the material taking rack. Preferably, the wafer feeding device of the present utility model further includes a first driving mechanism, where the first driving mechanism is used to drive the material taking rack to move horizontally along the X-axis and the Y-axis directions and to move up and down. Preferably, in the wafer feeding device of the present utility model, two second storage frames are disposed on the frame, the second storage frames are used for placing wafer trays, and a plurality of positioning round grooves are disposed on the wafer trays for placing wafers. Preferably, in the wafer feeding device of the present utility model, a tray handling mechanism is further disposed between the two second storage racks, and the tray handling mechanism is configured to handle the empty wafer tray on the second storage rack to the loading station, and send the wafer tray loaded with the wafer back to the second storage rack. Preferably, in the wafer feeding device of the present utility model, the tray conveying mechanism includes a plate turnover mechanism, and a plate turnover plate of the plate turnover mechanism is set to be turned horizontally by 180 ° and is used for conveying the wafer trays of the second material storage racks on two sides. Preferably, in the wafer feeding device of the present utility model, the tray conveying mechanism further includes a second driving mechanism, and the second driving mechanism is used for driving the plate turnover mechanism to move horizontally along the X axis and move up and down. Preferably, in the wafer feeding device of the present utility model, a wafer handling manipulator is further disposed between the two second storage frames, and the wafer handling manipulator is configured to handle the wafer on the material taking frame i