CN-224234169-U - Wafer clamping device

Abstract

The application discloses a wafer clamping device, which belongs to the technical field of semiconductor processing and comprises a wafer rotating disc, a chuck pin, a driving mechanism and a driving mechanism, wherein at least four mounting holes are circumferentially formed in the wafer rotating disc, the chuck pin is movably arranged in the mounting holes, the chuck pin comprises a fixing part and a replacing part which are clamped up and down, the replacing part comprises a chuck support and a clamping piece, the upper end face of the clamping piece is higher than the upper end face of the chuck support, the chuck support and the clamping piece are integrally formed and can rotate around the axis of the chuck support, the upper surface of the chuck support is used for supporting a wafer, the clamping piece rotates around the axis of the chuck support and then is used for clamping the wafer, and the driving mechanism is used for driving the wafer to rotate around the axis of the chuck support and can drive the chuck pin to rotate around the axis of the chuck support. Through the whole design of the wafer clamping device, the problem caused by abrasion of the chuck pins is solved, the efficiency of replacement work is improved, the stability of experience clamping is optimized, and the production cost is saved.

Inventors

• CHEN YANBING
• REN GUANGJIE
• CHANG SHENG

Assignees

• 青岛贝斯兰半导体科技有限公司

Dates

Publication Date

20260512

Application Date

20250519

Claims (10)

1. 1. A wafer clamping apparatus, comprising: The wafer rotating disc is provided with a round hole in the middle, and at least four mounting holes are formed in the circumferential direction; The chuck pin is movably arranged in the mounting hole, the chuck pin comprises a fixing part and a replacing part which are clamped up and down, the replacing part comprises a chuck support and a clamping piece, the upper end face of the clamping piece is higher than the upper end face of the chuck support, the chuck support and the clamping piece are integrally formed and can rotate around the axis of the chuck support, the upper surface of the chuck support is used for supporting a wafer, and the clamping piece is used for clamping the wafer after rotating around the axis of the chuck support; And the driving mechanism is used for driving the wafer to rotate around the axis of the wafer rotating disc and can drive the chuck pins to rotate around the axis of the chuck support.
2. 2. The wafer clamping device according to claim 1, wherein the upper end of the fixing portion is provided with a protrusion having a cross-shaped cross section, and the lower end of the replacing portion is provided with a groove, and the groove is matched with the protrusion of the fixing portion in shape.
3. 3. The wafer clamping device of claim 2 wherein the height of the cross-shaped protrusion is 0.3-0.5 times the height of the replacement portion.
4. 4. The wafer clamping device according to claim 2, wherein the cross section of the end of the protrusion of the fixing portion in each direction is trapezoidal.
5. 5. The wafer clamping device as recited in claim 4, wherein the outer surface of the distal end of the fixing portion in each direction of the protrusion is provided with a friction bar.
6. 6. The wafer clamping device of claim 1 wherein a maximum distance between the chuck support and a center of the wafer rotating disk is greater than a radius of the wafer.
7. 7. The wafer clamping device as recited in claim 1, wherein the chuck base is provided with a plurality of smooth punctiform protrusions.
8. 8. The wafer clamping apparatus of claim 1 wherein the clamping member has an included angle of 15 ° to 30 ° from vertical with respect to a side elevation of the clamping member.
9. 9. The wafer clamping device of claim 1 wherein an upper surface of said wafer rotating disk is tapered.
10. 10. The wafer clamping device of claim 9 wherein the included angle between the generatrix of the conical surface and the horizontal plane is 2-5 °.

Description

Wafer clamping device Technical Field The application relates to a wafer clamping device, and belongs to the technical field of semiconductor processing. Background In integrated circuit fabrication processes, multiple wafer wet processing steps are involved. The wet process is to soak or rinse the wafer with liquid chemicals such as acid-base organic matters, so as to achieve the purposes of cleaning surface particles, removing reaction polymers, etching surface film layers, and the like. With the increasing demands on process availability, the types of wet equipment are gradually changed from earlier batch processing wafers to monolithic processing wafers. Because the thickness of the wafer is generally not large, and the use of acid-base and organic solvents is often involved in the processing process, the chuck pins used for clamping the wafer wear faster, the clamping capacity of the chuck pins after wear is reduced, and the risk of scraping the wafer exists. The replacement of conventional chuck pins needs to be stopped and the chuck pins are assembled and disassembled one by one, so that the production efficiency is affected. Disclosure of utility model In order to solve the above problems, the application provides a wafer clamping device, which can directly and rapidly disassemble, assemble and replace parts of chuck pins, saves the steps and time for replacing the chuck pins, and improves the production efficiency. According to an aspect of the present application, there is provided a wafer holding apparatus comprising: The wafer rotating disc is provided with a round hole in the middle, and at least four mounting holes are formed in the circumferential direction; The chuck pin is movably arranged in the mounting hole, the chuck pin comprises a fixing part and a replacing part which are clamped up and down, the replacing part comprises a chuck support and a clamping piece, the upper end face of the clamping piece is higher than the upper end face of the chuck support, the chuck support and the clamping piece are integrally formed and can rotate around the axis of the chuck support, the upper surface of the chuck support is used for supporting a wafer, and the clamping piece is used for clamping the wafer after rotating around the axis of the chuck support; And the driving mechanism is used for driving the wafer to rotate around the axis of the wafer rotating disc and can drive the chuck pins to rotate around the axis of the chuck support. The wafer rotating disc comprises an upper layer, a metal middle layer and a lower layer, wherein the upper layer is an isolation layer, a corrosion-resistant material is adopted, the metal middle layer is provided with a transmission mechanism, the transmission mechanism can be electrically connected with a driving mechanism and used for realizing rotation of chuck pins, and the lower layer is provided with mounting holes and used for being connected with the driving mechanism and realizing motion control of the wafer rotating disc. Optionally, the upper end of the fixing part is provided with a bulge with a cross-shaped cross section, the lower end of the replacing part is provided with a groove, and the groove is matched with the bulge of the fixing part in shape. Optionally, the height of the cross-shaped protrusion is 0.3-0.5 times of the height of the replacement part. Optionally, the cross section of the end of the protrusion of the fixing part in each direction is trapezoidal. Optionally, friction strips are arranged on the outer surfaces of the tail ends of the protrusions of the fixing parts in all directions. Optionally, a maximum distance between the chuck support and a center of the wafer rotating disk is larger than a radius of the wafer. Optionally, the chuck support is provided with a plurality of smooth punctiform protrusions. Optionally, an included angle is formed between the side elevation of the clamping piece and the vertical direction, and the included angle is 15-30 degrees. Optionally, the upper surface of the wafer rotating disc is a conical surface. Optionally, an included angle between the generatrix of the conical surface and the horizontal plane is 2-5 degrees. The beneficial effects that can be produced by the present application include, but are not limited to: 1. According to the wafer clamping device provided by the application, the chuck pins are arranged as the fixing part and the replacing part, so that when the replacing part is worn to a certain degree, the replacing part can be quickly replaced without integrally disassembling and replacing the chuck pins, the working efficiency is improved, the corrosion of the disassembling and assembling of the chuck pins to the metal middle layer of the wafer rotating disc is avoided, and meanwhile, the material cost of the replacing part is also saved. 2. According to the wafer clamping device provided by the application, the bulges are arranged at the upper end of the fixing part and t