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CN-224234170-U - Wafer moving device of semiconductor process equipment and process semiconductor equipment

CN224234170UCN 224234170 UCN224234170 UCN 224234170UCN-224234170-U

Abstract

The utility model belongs to the technical field of semiconductor processing, and discloses a wafer moving device of semiconductor process equipment and the process semiconductor equipment. The wafer moving device comprises a wafer fixing piece and a turnover assembly. The turnover assembly is connected with the wafer fixing piece and is used for driving the wafer fixing piece and the wafer substrate fixed by the wafer fixing piece to turn after receiving the turnover instruction, so that the surface of the wafer to be processed is turned horizontally upwards or horizontally downwards. Therefore, when the wafer moving device is used, the wafer can be turned over by turning over the wafer fixing piece, the wafer substrate is not required to be clamped, carried and the complicated path planning is not required, the other surface of the wafer substrate can be exposed timely, quickly and safely, the whole operation flow is simplified, the time is saved, the possibility that the wafer substrate is polluted or damaged can be reduced, and the final processing quality and the product yield are effectively improved.

Inventors

  • LIANG DEFU
  • TIAN YUFENG

Assignees

  • 江苏无锡经纬天地半导体科技有限公司

Dates

Publication Date
20260512
Application Date
20250523

Claims (10)

  1. 1. A wafer moving apparatus of a semiconductor processing device, comprising: A wafer holder (1) configured to receive and hold a wafer substrate; and the overturning assembly (2) is connected with the wafer fixing piece (1) and is configured to drive the wafer fixing piece (1) and the wafer substrate fixed by the wafer fixing piece to overturn after receiving an overturning instruction, so that the surface of the wafer substrate to be processed is overturned and then horizontally upwards or horizontally downwards.
  2. 2. The wafer moving apparatus of the semiconductor processing equipment according to claim 1, wherein the wafer holder (1) has a snap ring groove (11) on a side surface thereof, and the flip assembly (2) comprises: the overturning part (21) is partially clamped in the clamping ring groove (11) and is in sliding connection with the clamping ring groove (11); And the overturning driving piece (22) is connected with the overturning part (21) to drive the overturning part (21) to overturn.
  3. 3. The wafer moving apparatus of the semiconductor processing equipment according to claim 2, wherein the turning part (21) has a protruding part (212) and a fixing block (211) connected to the protruding part (212), a concave area on both sides is formed at a connection between the protruding part (212) and the fixing block (211), so that a cross section of the protruding part (212) is trapezoidal, and a cross section of the fixing block (211) is square; The shape of the clamping ring groove (11) is matched with the shape of the protruding portion (212), so that the protruding portion (212) can form a clamping state with the clamping ring groove (11), and in the clamping state, the wafer fixing piece (1) can rotate around the protruding portion (212) through the clamping ring groove (11).
  4. 4. The wafer moving apparatus of semiconductor processing equipment of claim 1, further comprising: and the rotating assembly (3) is configured to be in transmission connection with the wafer fixing piece (1) so as to drive the wafer fixing piece (1) and the wafer substrate fixed by the wafer fixing piece to rotate.
  5. 5. Wafer moving apparatus of a semiconductor process equipment according to claim 4, characterized in that the wafer holder (1) is externally provided with a driven gear (13); The rotating assembly (3) comprises: a rotation driving member (31); the driving gear (32) is arranged at the output end of the rotary driving piece (31), the driving gear (32) can be meshed with the driven gear (13) and is configured to drive the driven gear (13) to work so as to drive the wafer fixing piece (1) and the wafer substrate fixed by the wafer fixing piece to rotate.
  6. 6. The wafer moving apparatus of a semiconductor processing apparatus according to claim 4, further comprising: And the translation device (4) is connected with the overturning assembly or/and the rotating assembly (3), and the translation device (4) is configured to drive the wafer fixing piece (1) and the rotating assembly (3) to be close to each other to form transmission connection or to be far away from each other so that the overturning assembly (2) drives the wafer fixing piece (1) and the wafer substrate fixed by the overturning assembly to overturn.
  7. 7. Wafer moving apparatus of a semiconductor processing apparatus according to claim 6, characterized in that the translation means (4) comprises: And the first translation assembly (41) is connected with the overturning assembly, and the first translation assembly (41) is configured to drive the wafer fixing piece (1) to be close to or far away from the rotating assembly (3) by moving the overturning assembly (2).
  8. 8. Wafer moving apparatus of a semiconductor processing apparatus according to claim 6, characterized in that the translation means (4) comprises: And the second translation assembly (42) is connected with the rotation assembly (3), and the second translation assembly (42) is configured to drive the rotation assembly (3) to be close to or far away from the wafer fixing piece (1).
  9. 9. Wafer moving apparatus of a semiconductor processing apparatus according to claim 6, characterized in that the translation means (4) comprises: A connecting part (45), one end of which is connected with the overturning assembly (2) or the rotating assembly (3); a drive screw (44) which is screwed to the other end of the connecting portion (45); And the translation driving piece (43) is connected with the driving screw (44), and the translation driving piece (43) is configured to drive the driving screw (44) to rotate so as to drive the connecting part (45) to reciprocate along the axial direction of the driving screw (44).
  10. 10. A process semiconductor device, comprising: A processing chamber; A wafer handling device for a semiconductor processing apparatus according to any one of claims 1 to 9, part or all of the wafer handling device being disposed within the processing chamber.

Description

Wafer moving device of semiconductor process equipment and process semiconductor equipment Technical Field The present utility model relates to the field of semiconductor processing technology, and in particular, to a wafer moving device for semiconductor processing equipment and a processing semiconductor device. Background In the semiconductor manufacturing process, the coating process is a key element, which plays a crucial role in the final performance of the chip. The coating technology can endow the wafer with specific optical, electrical or mechanical properties, such as enhanced conductivity, insulation, reflectivity or corrosion resistance, and the like, so as to meet the requirements of different types of chips in various complex application scenes. In the prior art, a common structure of a wafer moving device for wafer double-sided coating is mainly designed based on a traditional step-by-step operation mode. The structure is usually equipped with a fixture device specially used for fixing the wafer, the wafer is firstly placed on the fixture in a front direction, and the wafer is ensured to be stable in the coating process by a specific fixing mechanism such as vacuum adsorption, mechanical clamping and the like. And the film coating source performs accurate film coating operation on the front surface of the wafer according to preset parameters. After the front surface coating is finished, the fixture device can release the fixation of the wafer, so that the wafer can be in a freely movable state. Then, the wafer is taken out from the current position through the intervention of a mechanical arm or other overturning components, overturning for 180 degrees, enabling the back surface of the wafer to face upwards, then, placing the wafer on a clamp again for fixing, and finally, coating the back surface of the wafer. However, when the wafer needs to be released and fixed again in the overturning process, the process is influenced by factors such as mechanical response speed, sensor detection precision and the like, the movement track of the mechanical arm or the overturning assembly needs to be accurately planned to avoid collision with other parts of the equipment, the position of the wafer needs to be readjusted after overturning, the accurate placement of the wafer on the clamp is ensured, and the operations lead to complicated whole process and long time consumption. In addition, the repeated wafer clamping and turning operations also increase the risk of contamination or damage to the wafer surface, which may affect the final coating quality and product yield. Disclosure of utility model The utility model aims to provide a wafer moving device of semiconductor process equipment and the process semiconductor equipment, which solve the problems of complicated whole overturning process and long time consumption caused by the fact that the wafer needs to be grabbed and positioned again when the wafer is overturned in the double-sided processing of the wafer in the prior art, and also solve the risk of being polluted or damaged easily in the overturning process. To achieve the purpose, the utility model adopts the following technical scheme: In a first aspect, the present utility model provides a wafer moving apparatus for semiconductor processing equipment, comprising: a wafer holder configured to receive and hold a wafer substrate; And the turnover assembly is connected with the wafer fixing piece and is configured to drive the wafer fixing piece and the wafer substrate fixed by the wafer fixing piece to turn over after receiving the turnover instruction, so that the surface of the wafer substrate to be processed is turned over and then horizontally upwards or horizontally downwards. Optionally, the side of the wafer fixing piece is provided with a clamping ring groove, and the overturning assembly comprises: The overturning part is partially clamped in the clamping ring groove and is in sliding connection with the clamping ring groove; And the overturning driving piece is connected with the overturning part to drive the overturning part to overturn. Optionally, the turnover part is provided with a protruding part and a fixed block connected with the protruding part, a concave area on two sides is formed at the connection part between the protruding part and the fixed block, so that the cross section of the protruding part is trapezoid, and the cross section of the fixed block is square; The shape of the clamping ring groove is matched with the shape of the protruding portion, so that the protruding portion can form a clamping state with the clamping ring groove, and in the clamping state, the wafer fixing piece can rotate around the protruding portion through the clamping ring groove. Optionally, the method further comprises: And the rotating assembly is configured to be in transmission connection with the wafer fixing piece so as to drive the wafer fixing piece and the wafer substrate fixed by t