CN-224234171-U - Wafer lifting equipment

CN224234171UCN 224234171 UCN224234171 UCN 224234171UCN-224234171-U

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to wafer lifting equipment, which comprises a thin air cylinder, a floating connecting piece, a corrugated pipe assembly, a vacuum cavity and a wafer bearing mechanism, wherein the corrugated pipe assembly comprises a corrugated pipe and a guide piece arranged in the corrugated pipe, the corrugated pipe and the wafer bearing mechanism are positioned in the vacuum cavity, the thin air cylinder, the floating connecting piece and the guide piece are sequentially connected, one end of the corrugated pipe, which is close to the floating connecting piece, is connected with the inner wall of the vacuum cavity, and one end of the corrugated pipe, which is far away from the floating connecting piece, is connected with the wafer bearing mechanism. The floating connecting piece is connected with the thin cylinder and used for buffering and counteracting lateral stress generated by the thin cylinder, and only the up-down thrust is reserved, so that the bellows assembly is driven to stably lift.

Inventors

ZHANG FUWEN
ZHU XIAOPENG
ZHANG WENQING
LI CHAO

Assignees

海创智能装备(烟台)有限公司

Dates

Publication Date: 20260512
Application Date: 20250527

Claims (7)

1. The wafer lifting device is characterized by comprising a thin air cylinder, a floating connecting piece, a corrugated pipe assembly, a vacuum cavity and a wafer bearing mechanism, wherein the corrugated pipe assembly comprises a corrugated pipe and a guide piece arranged in the corrugated pipe, the corrugated pipe and the wafer bearing mechanism are positioned in the vacuum cavity, the thin air cylinder, the floating connecting piece and the guide piece are sequentially connected, one end, close to the floating connecting piece, of the corrugated pipe is connected with the inner wall of the vacuum cavity, and one end, far away from the floating connecting piece, of the corrugated pipe is connected with the wafer bearing mechanism.
2. The wafer lift apparatus of claim 1, wherein the bellows assembly further comprises a first flange and a second flange, wherein an end of the bellows proximate the floating connection is coupled to an inner wall of the vacuum chamber via the first flange, and wherein an end of the bellows distal from the floating connection is coupled to the wafer carrier via the second flange.
3. The wafer lift apparatus of claim 2, wherein the first flange is coupled to an inner wall of the vacuum chamber by a first bolt and the second flange is coupled to the wafer carrier by a second bolt.
4. The wafer lifting apparatus of claim 1, wherein the wafer carrying mechanism comprises a connection platform and at least one wafer fixing member, the connection platform is provided with a groove, and the wafer fixing member is disposed at a position where the connection platform is not provided with the groove.
5. The wafer lift apparatus of claim 4, wherein each wafer holder is uniformly and/or intermittently disposed on the connection stage when the number of wafer holders is greater than one.
6. The wafer lifting apparatus of claim 4 or 5, wherein the wafer fixing member comprises a fixing column and a clamping portion connected to each other, wherein an end of the fixing column away from the clamping portion is connected to the connection platform, and the clamping portion is disposed toward the recess.
7. The wafer lift apparatus of claim 1, wherein the floating connection is a floating joint and the guide is a guide post.

Description

Wafer lifting equipment Technical Field The utility model relates to the technical field of semiconductor equipment, in particular to wafer lifting equipment. Background In the field of semiconductor manufacturing, operations such as processing and detecting a wafer are generally required to be performed in a vacuum cavity environment, and a wafer lifting mechanism is a key component for realizing accurate lifting and positioning of the wafer in the vacuum cavity. At present, most of existing wafer lifting mechanisms used in vacuum cavity environments adopt cylinder structures such as a sliding table cylinder, a two-axis cylinder, a three-axis cylinder and the like in lifting driving. These conventional cylinder driving methods have limitations in practical applications. From the perspective of space applicability, the structural body types of the sliding table cylinder, the biaxial cylinder, the triaxial cylinder and the like are larger. However, with the continuous development of semiconductor manufacturing technology, the integration degree of devices is increasing, and the volume of devices is moving toward miniaturization. These larger cylinders are difficult to reasonably layout and install in limited small spaces, limiting the further miniaturization and integration development of equipment, and failing to meet the requirements of modern semiconductor manufacturing equipment for compact designs. In order to solve the problem of overlarge volume of a conventional cylinder, attempts are being made in the industry to replace a sliding table cylinder, a biaxial cylinder, a triaxial cylinder and the like with a thin cylinder. Because the thin cylinder is thin in width, short in stroke and large in thrust, the thin cylinder is just suitable for being applied to the position, the whole volume of equipment can be reduced to a certain extent, and the partial requirement of equipment miniaturization is met. However, when the thin cylinder is actually applied to driving the wafer to lift, a new problem is also exposed, compared with the common types such as a sliding table cylinder, a biaxial cylinder, a triaxial cylinder and the like, the thin cylinder lacks a guide shaft, the driving force in the vertical direction generated by the thin cylinder is unstable, lateral stress is possibly generated, and in the process of driving the wafer to lift, the lateral stress possibly causes unnecessary deviation or shaking of the wafer, and the positioning precision of the wafer is affected. In the semiconductor manufacturing process, high-precision positioning of the wafer is a key factor for ensuring the manufacturing quality and yield of chips. The wafer positioning deviation caused by the lateral stress may cause errors of circuit patterns on the surface of the wafer, thereby affecting the performance and reliability of the chip and increasing the defective rate and production cost in the production process. In addition, friction is frequently generated between the protruding shaft of the slim cylinder and the sidewall of the cylinder body due to the existence of lateral stress, resulting in a shortened life of the slim cylinder. In summary, the conventional wafer lifting mechanism driven by the thin air cylinder still has defects, and cannot completely meet the requirements of the industries such as semiconductor manufacturing on high precision and high stability of wafer lifting. Accordingly, there is a need to develop a new wafer lift apparatus or mechanism that overcomes the above-described drawbacks of the prior art. Disclosure of utility model In order to solve the technical problems in the prior art, the utility model provides wafer lifting equipment. The technical scheme for solving the technical problems is as follows: The utility model provides wafer lifting equipment which comprises a thin air cylinder, a floating connecting piece, a corrugated pipe assembly, a vacuum cavity and a wafer bearing mechanism, wherein the corrugated pipe assembly comprises a corrugated pipe and a guide piece arranged in the corrugated pipe, the corrugated pipe and the wafer bearing mechanism are positioned in the vacuum cavity, the thin air cylinder, the floating connecting piece and the guide piece are sequentially connected, one end, close to the floating connecting piece, of the corrugated pipe is connected with the inner wall of the vacuum cavity, and one end, far away from the floating connecting piece, of the corrugated pipe is connected with the wafer bearing mechanism. The wafer lifting equipment provided by the utility model is connected with the thin air cylinder by adopting the floating connecting piece, so that lateral stress generated by the thin air cylinder is buffered and counteracted, only the up-down thrust is reserved, the corrugated pipe assembly is driven to stably lift, the number of the corrugated pipe assembly can be effectively prevented from amplifying the lateral stress, in addition, the floating conne