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CN-224234174-U - Wafer lifting device and semiconductor device

CN224234174UCN 224234174 UCN224234174 UCN 224234174UCN-224234174-U

Abstract

The utility model relates to the technical field of semiconductors, and discloses a wafer lifting device and semiconductor equipment, wherein the wafer lifting device comprises a lifting mechanism, a plurality of thimble units and a spacer, the lifting mechanism comprises a lifting platform and a driving piece connected with the lifting platform, the driving piece is used for driving the lifting platform to lift along the height direction, the thimble units are arranged on the lifting platform at intervals, the thimble units comprise a fixer and lifting support pieces, the fixer is arranged on the lifting platform, the lifting support pieces are arranged on the fixer, the lifting support pieces are used for supporting wafers, the isolating pieces are arranged at one ends of the lifting support pieces, facing the lifting platform, of the isolating pieces, and the isolating pieces are used for isolating the lifting support pieces and the lifting platform. According to the wafer lifting device, the isolating piece is arranged between the lifting supporting piece and the lifting platform, so that the direct contact and abrasion between the lifting supporting piece and the lifting platform are effectively reduced, the service life is prolonged, meanwhile, the particle pollution caused by the abrasion between the lifting supporting piece and the lifting platform is reduced, and the process quality of a wafer is ensured.

Inventors

  • Guo Tiaoyuan
  • XU KANGYUAN

Assignees

  • 成都高真科技有限公司

Dates

Publication Date
20260512
Application Date
20250611

Claims (10)

  1. 1. A wafer lift apparatus, comprising: The lifting mechanism comprises a lifting platform and a driving piece connected with the lifting platform, and the driving piece is used for driving the lifting platform to lift along the height direction; The plurality of thimble units are arranged on the lifting platform at intervals, the thimble units comprise a fixer and a lifting support piece, the fixer is arranged on the lifting platform, the lifting support piece is arranged on the fixer, and the lifting support piece is used for supporting a wafer; The isolating piece is arranged at one end of the lifting support piece, which faces the lifting platform, and is used for isolating the lifting support piece from the lifting platform.
  2. 2. The wafer lift apparatus of claim 1, wherein the spacer has a hardness that is the same as the lift support and greater than the lift platform.
  3. 3. The wafer lift apparatus of claim 1, wherein the spacer comprises a spacer pad, the spacer pad being the same material as the lift support.
  4. 4. The wafer lift apparatus of claim 3, wherein the spacer is a sapphire spacer.
  5. 5. The wafer lift apparatus of any one of claims 1 to 4, wherein the ejector pin unit further comprises a fixing cover covering an outside of the holder, and the length of the spacer in the horizontal direction is smaller than the length of the fixing cover in the horizontal direction and larger than the length of the holder in the horizontal direction.
  6. 6. The wafer lift apparatus of any of claims 1 to 4, wherein the holder comprises a fixing base and a limiting portion, the limiting portion is disposed at an end of the fixing base away from the lift platform, first through holes penetrating through the fixing base and the fixing base are disposed in a height direction, and the lift support member is disposed through the first through holes.
  7. 7. The wafer lifting device of claim 6, wherein the limiting portion comprises an equal-diameter section and an expanded-diameter section which are coaxially connected, the equal-diameter section is connected to one end of the fixed base far away from the lifting platform, the expanded-diameter section is connected to one end of the equal-diameter section far away from the fixed base, and the first through hole penetrates through opposite ends of the equal-diameter section and the expanded-diameter section along the axial direction.
  8. 8. The wafer lift apparatus of claim 7, wherein the diameter of the expanded section has an inner diameter equal to the inner diameter of the constant diameter section, and wherein the outer diameter of the expanded section increases gradually from an end connected to the constant diameter section to an end remote from the constant diameter section.
  9. 9. The wafer lift apparatus of any one of claims 1 to 4, further comprising a base, wherein the base is disposed at top portions of the plurality of thimble units at intervals along a height direction, a second through hole is disposed on the base along the height direction, and the lift support is movably disposed in the second through hole.
  10. 10. A semiconductor apparatus comprising a chamber and the wafer lift apparatus of any one of claims 1 to 9, the wafer lift apparatus being disposed inside the chamber.

Description

Wafer lifting device and semiconductor device Technical Field The present utility model relates to the field of semiconductor technologies, and in particular, to a wafer lifting device and a semiconductor device. Background This section provides merely background information related to the present disclosure and is not necessarily prior art. In semiconductor manufacturing processes, the lifting and lowering operations are required to be continued to achieve wafer transfer between different process locations. However, in the long-term use process of the existing thimble and lifting platform, the contact part between the thimble and the lifting platform is easy to wear due to material difference and frequent movement, and the wear can generate particle pollution, so that the process quality of the wafer is affected. Disclosure of utility model The utility model aims to at least solve the problem of particle pollution caused by abrasion of contact parts between a thimble and a lifting platform. The aim is achieved by the following technical scheme: A first aspect of the present utility model provides a wafer lifting apparatus, including: The lifting mechanism comprises a lifting platform and a driving piece connected with the lifting platform, and the driving piece is used for driving the lifting platform to lift along the height direction; The plurality of thimble units are arranged on the lifting platform at intervals, the thimble units comprise a fixer and a lifting support piece, the fixer is arranged on the lifting platform, the lifting support piece is arranged on the fixer, and the lifting support piece is used for supporting a wafer; The isolating piece is arranged at one end of the lifting support piece, which faces the lifting platform, and is used for isolating the lifting support piece from the lifting platform. According to the wafer lifting device, the isolation piece is arranged between the lifting support piece and the lifting platform, so that the direct contact and abrasion between the lifting support piece and the lifting platform are effectively reduced in the lifting process, the service lives of the thimble unit and the lifting platform are prolonged, and meanwhile, the particle pollution caused by the abrasion of the thimble unit and the lifting platform is reduced, so that the pollution to the surface of a wafer is reduced, and the process quality of the wafer is ensured. In addition, the wafer lifting device according to the utility model can also have the following additional technical characteristics: In some embodiments of the utility model, the spacer has a hardness that is the same as the lift support and greater than the lift platform. In some embodiments of the utility model, the spacer comprises a spacer, and the spacer is made of the same material as the lifting support. In some embodiments of the utility model, the spacer is a sapphire spacer. In some embodiments of the present utility model, the ejector pin unit further includes a fixing cover covering the outside of the holder, and the length of the spacer in the horizontal direction is smaller than the length of the fixing cover in the horizontal direction and larger than the length of the holder in the horizontal direction. In some embodiments of the present utility model, the fixing device includes a fixing base and a limiting portion, the limiting portion is disposed at an end of the fixing base away from the lifting platform, first through holes penetrating through the fixing base and the limiting portion are disposed on the fixing base along a height direction, and the lifting support member is penetrating through the first through holes. In some embodiments of the present utility model, the limiting portion includes an equal-diameter section and an expanded-diameter section that are coaxially connected, the equal-diameter section is connected to an end of the fixed seat that is far away from the lifting platform, the expanded-diameter section is connected to an end of the equal-diameter section that is far away from the fixed seat, and the first through hole penetrates through opposite ends of the equal-diameter section and the expanded-diameter section in an axial direction. In some embodiments of the utility model, the inner diameter of the expanded diameter section is the same as the inner diameter of the constant diameter section, and the outer diameter of the expanded diameter section gradually increases from the end connected to the constant diameter section to the end far away from the constant diameter section. In some embodiments of the present utility model, the wafer lifting device further includes a base, the base is disposed at the top of the plurality of thimble units at intervals along the height direction, a second through hole is disposed on the base along the height direction, and the lifting support is movably disposed in the second through hole. Another aspect of the present utility model provides