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CN-224234175-U - Vacuum adsorption device for semiconductor production

CN224234175UCN 224234175 UCN224234175 UCN 224234175UCN-224234175-U

Abstract

The utility model discloses a vacuum adsorption device for semiconductor production, and belongs to the field of semiconductor production equipment. The technical scheme includes that the vacuum adsorption device for semiconductor production comprises a sucker connecting component and a negative pressure equipment connecting component which are designed in a split mode, wherein an air guide channel is coaxially arranged in the negative pressure equipment connecting component and the negative pressure equipment connecting component, the negative pressure equipment connecting component is connected in the negative pressure equipment connecting component in a sliding mode, an elastic piece is fixedly connected between the negative pressure equipment connecting component and the negative pressure equipment connecting component, and the vacuum adsorption device can provide a buffering effect through the elastic piece, and increase flexibility through sliding connection, so that the mechanical damage risk of semiconductor materials is effectively reduced, meanwhile, adsorption stability and device adaptability are improved, and requirements for nondestructive transportation and positioning of precise elements in semiconductor production can be better met.

Inventors

  • CAI CHENGWEI
  • AO ZHIBIN
  • ZHANG ZHIHUA
  • XU XIQI

Assignees

  • 山东海声尼克微电子有限公司

Dates

Publication Date
20260512
Application Date
20250325

Claims (9)

  1. 1. The vacuum adsorption device for the semiconductor production is characterized by comprising a sucking disc connecting component and a negative pressure equipment connecting component which are designed in a split mode, wherein an air guide channel is coaxially arranged inside the sucking disc connecting component and the negative pressure equipment connecting component, the negative pressure equipment connecting component is slidingly connected inside the sucking disc connecting component, and an elastic piece (4) is fixedly connected between the sucking disc connecting component and the negative pressure equipment connecting component.
  2. 2. The vacuum adsorption device for semiconductor production according to claim 1, wherein the sucker connecting assembly comprises a connector (1) and an air duct (2) which are designed in a split mode, the end part of the air duct (2) is provided with internal threads, and the end part of the connector (1) is provided with external threads matched with the internal threads.
  3. 3. Vacuum adsorption device for semiconductor production according to claim 2, wherein the inner cavity of the air duct (2) is provided with a sliding groove (21), the negative pressure equipment connecting assembly comprises a connecting pipe (3), the connecting pipe (3) is provided with a sliding part in sliding fit with the sliding groove (21), and the side wall of the sliding part is provided with a limit boss matched with the sliding groove (21).
  4. 4. A vacuum adsorption device for semiconductor production according to claim 3 wherein a sealing ring (13) is provided between the connector (1) and the air duct (2), and a tightening boss (12) for fixing the sealing ring (13) is provided at one end of the connector (1) close to the air duct (2).
  5. 5. A vacuum adsorption device for semiconductor production according to claim 3 wherein the upper end of the air duct (2) is provided with a first boss (22), the side wall of the connecting tube (3) is provided with a second boss (31), and the elastic member (4) is located between the first boss (22) and the second boss (31).
  6. 6. A vacuum adsorption device for semiconductor production according to claim 3 wherein the outer wall of the connecting tube (3) and the inner wall of the gas-guide tube (2) have an overlap region, and the outer wall of the connecting tube (3) located in the overlap region is provided with a plurality of first sealing rubber rings (33).
  7. 7. The vacuum adsorption device for semiconductor production according to claim 6, wherein a connecting port (32) is arranged at the upper end of the connecting pipe (3), and a second sealing rubber ring is arranged in the connecting port (32).
  8. 8. A vacuum adsorption device for semiconductor production according to claim 3 wherein the end of the connector (1) remote from the airway tube (2) is provided with a suction cup connector, the outer wall of which is provided with a plurality of anti-drop flanges (11).
  9. 9. Vacuum suction device for semiconductor production according to any of claims 1-8, characterized in that the elastic element (4) is a compression spring.

Description

Vacuum adsorption device for semiconductor production Technical Field The utility model belongs to the field of semiconductor production equipment, and particularly relates to a vacuum adsorption device for semiconductor production. Background In the semiconductor production process, the vacuum adsorption device has the core function of realizing nondestructive transportation and positioning of precise elements such as wafers, chips and the like in a negative pressure adsorption mode. Due to the extremely high brittleness and stringent requirements for surface integrity of semiconductor materials, any improper mechanical contact or pressure may damage the material, resulting in reduced product yields. Therefore, the design of the vacuum adsorption device is required to ensure stable adsorption force, and also has good buffering and pressure adjusting functions so as to avoid excessive mechanical stress on the semiconductor material in the adsorption process. In the adsorption process of the traditional integrated vacuum adsorption device, when the sucker is in contact with the semiconductor material, mechanical pressure is often directly transmitted, and an effective buffer mechanism is lacked. Such designs tend to result in excessive contact pressure between the suction tip and the semiconductor material, especially when the suction tip is depressed, which may cause scratches or microcracks to the semiconductor surface, affecting the quality and performance of the product. In addition, the rigid connection mode of the traditional device between the negative pressure equipment connecting component and the sucker connecting component also limits the flexibility and adaptability of the device, and semiconductor materials with different thicknesses or surface characteristics cannot be effectively processed. In order to solve the above problems, some improved vacuum suction devices incorporate an elastic member and a relative sliding arrangement between the negative pressure device connection assembly and the suction cup connection assembly. These designs are important in improving device performance: First, the introduction of the elastic member provides an effective cushioning effect. When the adsorption end is contacted with the semiconductor material and pressed down, the elastic piece can provide flexible buffer force, so that mechanical pressure is effectively absorbed and dispersed, and excessive pressure is prevented from being directly transmitted to the surface of the semiconductor material. The design significantly reduces the risk of mechanical damage to the semiconductor material during the adsorption process, and is particularly suitable for wafers and chips with extremely high surface integrity requirements. Second, the relative sliding arrangement between the negative pressure device connection assembly and the suction cup connection assembly increases the flexibility of the apparatus. The sliding connection design not only improves the adaptability of the device, but also can automatically adjust the position and pressure of the adsorption end according to the thickness and surface characteristics of the semiconductor material. For example, when wafers of different thicknesses are to be adsorbed, the sliding connection design ensures that the adsorption end is always in contact with the material surface at an appropriate pressure without damage caused by excessive pressing down. In addition, through the synergistic effect of the elastic piece and the sliding connection, the improved vacuum adsorption device can realize uniform distribution and dynamic adjustment of pressure in the adsorption process. When the adsorption end is contacted with the semiconductor material, the compression of the elastic piece and the relative movement of the sliding connection act together, so that the adsorption force is always in a safe range, and the local pressure is avoided being too large. The design not only protects the semiconductor material, but also improves the stability and reliability of the adsorption process. However, while these improved designs have solved the problems of conventional vacuum adsorption devices to some extent, there are still some limitations. For example, the choice of spring and mounting location has a large impact on the performance of the device, and different semiconductor materials may require different spring rates, which increases the complexity and difficulty of use of the device. Furthermore, the sliding connection design may introduce new problems such as reduced sealing performance, accelerated wear of the components, etc., which all require trade-offs and optimizations in practical applications. Disclosure of utility model The present utility model provides a vacuum adsorption apparatus for semiconductor production to solve at least one of the above technical problems. The technical scheme adopted by the utility model is as follows: The utility model provides a vacuum