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CN-224234176-U - Wafer adsorption device

CN224234176UCN 224234176 UCN224234176 UCN 224234176UCN-224234176-U

Abstract

The utility model provides a wafer adsorption device which comprises a fixed seat, wherein a plurality of vacuum chuck assemblies are arranged on the fixed seat and used for adsorbing and fixing a wafer, the vacuum chuck assemblies comprise a supporting mechanism and a vacuum chuck, the supporting mechanism is connected to the fixed seat, the vacuum chuck is connected to one end of the supporting mechanism, which is far away from the fixed seat, through a rotating connecting mechanism, an included angle between the axis of the vacuum chuck and the axis of the supporting mechanism is adjustable, and the vacuum chuck is used for adsorbing the back surface of the wafer through negative pressure. The wafer adsorption device of the utility model adopts a structure form of combining a plurality of vacuum chucks to carry out vacuum adsorption on the wafer, thereby solving the problem that the wafer cannot be fixed by the vacuum chucks due to wafer back dirt and wafer warping in the prior art.

Inventors

  • LI NINGNING

Assignees

  • 芯恩（青岛）集成电路有限公司

Dates

Publication Date
20260512
Application Date
20250522

Claims (8)

  1. 1. The wafer adsorption device is characterized by comprising a fixed seat, wherein a plurality of vacuum chuck assemblies are arranged on the fixed seat, and the vacuum chuck assemblies are used for adsorbing and fixing wafers; wherein, the vacuum chuck assembly includes: the supporting mechanism is connected with the fixing seat; The vacuum chuck is connected to one end of the supporting mechanism, which is away from the fixed seat, through the rotating connecting mechanism, and an included angle between the axis of the vacuum chuck and the axis of the supporting mechanism is adjustable, and the vacuum chuck is used for adsorbing the back surface of the wafer through negative pressure; The rotary connecting mechanism comprises a second gas flow passage, wherein the second gas flow passage is communicated with the first gas flow passage, and the second gas flow passage is communicated with the vacuum chuck; The rotary connecting mechanism comprises a first connector and a second connector, the first connector is connected with the supporting rod, the second connector is connected with the vacuum chuck, and the first connector and the second connector are rotationally connected through a spherical pair.
  2. 2. The wafer chucking apparatus of claim 1, wherein: The first joint has a first passage and the second joint has a second passage, the first passage and the second passage communicating to form the second gas flow passage.
  3. 3. The wafer chucking apparatus of claim 1, further comprising a lift mechanism; The bottom end of the supporting mechanism is connected with the fixed seat through the lifting device and driven by the lifting device to reciprocate along the direction vertical to the top surface of the fixed seat.
  4. 4. The wafer chucking apparatus as recited in claim 3, wherein said support mechanism includes a pressure sensor for sensing a pressure applied to said support mechanism and transmitting pressure data to a control system of said lift apparatus.
  5. 5. The wafer chucking apparatus as recited in claim 4, wherein said support mechanism includes a first support rod and a second support rod; the pressure sensor is connected between the first support rod body and the second support rod body, and bears the pressure of the first support rod body and the extrusion force of the second support rod body.
  6. 6. The wafer sucking device as set forth in claim 1, wherein a plurality of sucking holes are provided on a disk surface of the vacuum chuck, and the plurality of sucking holes are uniformly distributed on the disk surface of the vacuum chuck.
  7. 7. The wafer sucking device as set forth in claim 1, wherein N of said supporting mechanisms are equally spaced apart along a circumference of said holder to form a supporting group, wherein N is a positive integer greater than or equal to 1.
  8. 8. The wafer sucking device as set forth in claim 7, wherein the number of the supporting groups is plural, and the plural supporting groups are coaxially disposed on the holder.

Description

Wafer adsorption device Technical Field The utility model relates to the technical field of semiconductor processing, in particular to a wafer adsorption device. Background Vacuum chucks are commonly used to secure wafers within a variety of semiconductor devices. The chuck (chuck) in the form of a vacuum chuck only contacts the back of the wafer during operation, and does not need additional pins to support or limit the edge of the wafer, thereby avoiding the influence on the process of the front of the wafer. And can realize adsorbing and releasing operation in a short time, response speed is fast, this can improve production efficiency greatly on automated production line, reduces the loading and unloading time of work piece, realizes quick processing flow and switches. The vacuum chuck used in the existing machine is an integral chuck (as shown in fig. 1), and the structure of the vacuum chuck is that a plurality of air holes are formed in the vacuum chuck 30a to adsorb the wafer 70. However, such a vacuum chuck has high requirements on wafer warpage (Bow value) and wafer back cleanliness, and if the wafer 70 is too high in warpage (as shown in fig. 1) or the wafer back is dirty, the vacuum chuck cannot adsorb the wafer. Disclosure of utility model In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a wafer suction apparatus, which is used for solving the problem that the vacuum chuck cannot suck the wafer in the case of too high wafer warpage or wafer back contamination in the prior art. The utility model provides a wafer adsorption device, which comprises a fixed seat, wherein a plurality of vacuum chuck assemblies are arranged on the fixed seat and used for adsorbing and fixing a wafer, the vacuum chuck assemblies comprise a supporting mechanism and a vacuum chuck, the supporting mechanism is connected to the fixed seat, the vacuum chuck is connected to one end of the supporting mechanism, which is far away from the fixed seat, through a rotating connecting mechanism, an included angle between an axis of the vacuum chuck and an axis of the supporting mechanism is adjustable, and the vacuum chuck is used for adsorbing the back surface of the wafer through negative pressure. The wafer vacuum adsorption device has the advantages that the wafer is subjected to vacuum adsorption in the structure mode of a plurality of vacuum chuck combinations, when adsorption is unstable due to dirt on a certain position of the wafer back, other vacuum chucks in the vacuum chuck combinations can still keep stable adsorption on the wafer, the problem that the wafer cannot be fixed by the vacuum chucks due to dirt on the wafer back in the prior art is further solved, and further, the vacuum chucks are connected with the supporting mechanism through the rotating connecting mechanism, so that self-adaptive adjustment of the vacuum chucks is realized to better attach the wafer, and further, a better vacuum adsorption effect is obtained. Further, the supporting mechanism comprises a supporting rod, a first gas flow passage is arranged in the supporting rod and is communicated with the air extractor, the rotating connecting mechanism comprises a second gas flow passage, the second gas flow passage is communicated with the first gas flow passage, and the second gas flow passage is communicated with the vacuum chuck. The wafer adsorption device has the beneficial effects that the first gas flow passage and the second gas flow passage for providing vacuum adsorption force are respectively arranged in the supporting rod and the rotating connecting mechanism, so that the structural compactness of the wafer adsorption device is effectively improved, and the problems of extra occupied space of the peripheral vacuum pipeline and interference among components caused by the peripheral vacuum pipeline are avoided. Further, the rotary connecting mechanism comprises a first connector and a second connector, the first connector is connected with the supporting rod, the second connector is connected with the vacuum chuck, and the first connector and the second connector are rotationally connected through a spherical pair. The spherical pair has the beneficial effects that the second joint can realize movement with multiple degrees of freedom by using the spherical pair, so that the movement flexibility of the vacuum chuck is greatly improved. When the vacuum chuck contacts with the wafer which is warped, the vacuum chuck can adaptively adjust the gesture under the pressure of the wafer so as to better attach to the back of the wafer. Preferably, the first joint has a first passage and the second joint has a second passage, the first passage and the second passage communicating to form the second gas flow passage. The vacuum connector has the beneficial effects that the design can keep the overturning flexibility of the second connector and keep the smoothness of the vacuum gas path.