CN-224234178-U - Wafer adsorption device

Abstract

The embodiment of the application provides a wafer adsorption device. The wafer adsorption device comprises an adsorption body and a flexible film. The adsorption body comprises an adsorption surface and is provided with adsorption holes, and the adsorption holes penetrate through the adsorption surface. The flexible membrane is positioned on the adsorption surface and is provided with a through hole. Wherein, the through hole runs through the flexible film along the thickness direction of the flexible film, and the through hole is communicated with the adsorption hole. Thus, when the adsorption body is utilized to grasp the wafer, the adsorption body plays a supporting role on the wafer, and the through holes on the flexible film adsorb the wafer, so that the flexible film is in direct contact with the wafer, and the problem that the wafer is scratched due to the direct contact between the adsorption body and the wafer is solved.

Inventors

• DING YONGLU
• CHEN JIE
• LIANG JINXUE

Assignees

• 浙江芯微泰克半导体有限公司

Dates

Publication Date

20260512

Application Date

20250530

Claims (10)

1. 1. A wafer chucking apparatus, comprising: the adsorption body comprises an adsorption surface and is provided with adsorption holes, and the adsorption holes penetrate through the adsorption surface; And the flexible film is positioned on the adsorption surface and is provided with a through hole, wherein the through hole penetrates through the flexible film along the thickness direction of the flexible film, and the through hole is communicated with the adsorption hole.
2. 2. The wafer chucking apparatus of claim 1, wherein the flexible film comprises an adhesive layer and an antistatic layer, the adhesive layer being located between the chucking face and the antistatic layer.
3. 3. The wafer chucking apparatus of claim 2, wherein the antistatic layer has a thickness of 40-60 microns.
4. 4. The wafer chucking apparatus of claim 1, wherein the flexible film has a thickness of 0.5mm to 1.2mm.
5. 5. The wafer adsorbing device as set forth in claim 1, wherein said adsorbing surface is further provided with protrusions, a groove is provided between two adjacent protrusions, said flexible film is located on said protrusions, and said adsorbing hole communicates with said through hole through said groove.
6. 6. The wafer suction device of claim 5, wherein the protrusions comprise a plurality of first protrusions, the grooves comprise first grooves, the plurality of first protrusions extend in a first direction and are arranged at intervals in a second direction, the first grooves are disposed between adjacent first protrusions, and the first direction intersects the second direction.
7. 7. The wafer chucking apparatus of claim 6, wherein a dimension of the first projection is less than a dimension of the first recess in the second direction.
8. 8. The wafer chucking apparatus of claim 6, wherein said projection further comprises a second projection disposed about a plurality of said first projections, said first recess also being disposed between said second projection and said first projection; The grooves further comprise second grooves, each first protrusion comprises a first end and a second end which are opposite, the first ends of the first protrusions are connected with the second protrusions, the second grooves are arranged between the second ends of the first protrusions and the second protrusions, and the second grooves extend along the second direction and are communicated with the plurality of first grooves.
9. 9. The wafer chucking apparatus of claim 8, wherein the chucking hole extends through a bottom of the second recess.
10. 10. The wafer chucking apparatus as recited in any one of claims 1 to 9, further comprising a stem connected to said chucking body and having a cavity disposed therein, said cavity being in communication with said chucking hole, and/or, The diameter of the adsorption hole is larger than that of the through hole, and/or, The diameter of the through holes is 200-300 microns, and/or, The distribution density of the through holes is 15/cm 2 -25/cm 2 .

Description

Wafer adsorption device Technical Field The application relates to the technical field of semiconductors, in particular to a wafer adsorption device. Background In the field of semiconductor manufacturing, vacuum suction pens are widely used as key tools for wafer processing in the process flows of quality detection, wafer sorting, cross-carrier transfer and the like. Particularly in the processing link of ultrathin wafers (the thickness is less than or equal to 200 mu m), a large number of production scenes depending on manual operation still exist due to the insufficient coverage rate (< 30%) of the existing full-automatic wafer processing equipment. The existing manual operation mode has the obvious technical defects that an operator needs to carry out high-frequency contact type grabbing (single shift operation >200 times) on the wafer through a vacuum suction pen, and mechanical scratches are easily generated on the surface of the wafer in the physical contact process. The microscopic damage caused by the mechanical scratches not only directly affects the product yield, but also causes pattern distortion in the subsequent photolithography process, and finally leads to the reduction of the reliability of the microelectronic device. Disclosure of utility model The embodiment of the application provides a wafer adsorption device, which reduces the risk of scratching a wafer when the wafer adsorption device grabs the wafer, so as to at least partially solve the technical problems. In order to achieve the above object, according to a first aspect of the present application, there is provided a wafer adsorbing device including an adsorbing body and a flexible film. The adsorption body comprises an adsorption surface and is provided with adsorption holes, and the adsorption holes penetrate through the adsorption surface. The flexible membrane is positioned on the adsorption surface and is provided with a through hole. Wherein, the through hole runs through the flexible membrane along the thickness direction of the flexible membrane, and the through hole is communicated with the adsorption hole. Optionally, the flexible film includes an adhesive layer and an antistatic layer, the adhesive layer being located between the adsorption surface and the antistatic layer. Optionally, the thickness of the antistatic layer is 40 micrometers to 60 micrometers. Optionally, the thickness of the flexible film is 0.5 mm-1.2 mm. Optionally, the adsorption surface is further provided with a protrusion, a groove is arranged between two adjacent protrusions, the flexible membrane is located on the protrusion, and the adsorption hole is communicated with the through hole through the groove. Optionally, the protrusions include a plurality of first protrusions, the grooves include first grooves, the plurality of first protrusions extend along a first direction and are arranged at intervals along a second direction, the first grooves are arranged between adjacent first protrusions, and the first direction intersects with the second direction. Optionally, in the second direction, the first protrusion has a size smaller than a size of the first groove. Optionally, the protrusion further comprises a second protrusion, the second protrusion is arranged around the first protrusions, and the first groove is also arranged between the second protrusion and the first protrusion; The grooves further comprise second grooves, each first protrusion comprises a first end and a second end which are opposite, the first end of each first protrusion is connected with the second protrusion, the second grooves are arranged between the second ends of each of the plurality of first protrusions and the second protrusions, and the second grooves extend along the second direction and are communicated with the plurality of first grooves. Optionally, the adsorption hole penetrates through the bottom of the second groove. Optionally, the wafer adsorption device further comprises a rod portion, the rod portion is connected with the adsorption body, a cavity is arranged in the rod portion, and the cavity is communicated with the adsorption hole. Optionally, the diameter of the adsorption hole is larger than the diameter of the penetration hole. Optionally, the diameter of the through hole is 200 micrometers to 300 micrometers. Optionally, the distribution density of the through holes is 15/cm 2 -25/cm 2. In the wafer adsorption device according to some embodiments of the present application, a flexible film is added on an adsorption surface of an adsorption body, the flexible film is provided with a through hole, and the through hole is communicated with the adsorption hole penetrating through the adsorption surface. Thus, when the adsorption body is utilized to grasp the wafer, the adsorption body plays a supporting role on the wafer, and the through holes on the flexible film adsorb the wafer, so that the flexible film is in direct contact with the wafer, and