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CN-224234179-U - Wafer vacuum adsorption positioning platform

CN224234179UCN 224234179 UCN224234179 UCN 224234179UCN-224234179-U

Abstract

The utility model relates to the field of semiconductor processing, and particularly discloses a wafer vacuum adsorption positioning platform; according to the utility model, the turntable, the cover plate, the sliding groove and the sliding block are arranged, when a user needs to adsorb wafers with different sizes, the turntable can be driven by the motor to rotate, the rotating turntable drives the sliding block to slide in the sliding groove, so that the sliding block is moved to the positions below the wafers with different sizes, a negative pressure environment is created in the air suction holes through the air distribution piece and the first air pipe, the wafers are adsorbed through the air suction holes, the subsequent processing is facilitated, the air outlet holes and the rubber sealing film are additionally arranged, when the user needs to adjust the positions of the wafers on the cover plate, the air distribution piece and the second air pipe can be used for inflating the air outlet holes, the rubber sealing film is raised, the raised rubber sealing film is contacted with the wafers, then the sliding block and the rubber sealing film are controlled to move, and the positions of the wafers are adjusted through friction force between the rubber sealing film and the wafers, so that the wafers are moved to proper processing positions.

Inventors

  • Shen Luman
  • Jia Xinzhong
  • LIU TIANSHENG

Assignees

  • 山西华耀亿嘉集成电路有限公司

Dates

Publication Date
20260512
Application Date
20250606

Claims (6)

  1. 1. The wafer vacuum adsorption positioning platform is characterized by comprising: The mounting table (1), the bottom of the mounting table (1) is fixedly connected with a support column (2) and a motor (3); The rotary table (4) is rotationally connected to the mounting table (1), the rotary table (4) is fixedly connected with an output shaft of the motor (3), and grooves which are arranged in a vortex-shaped line are formed in the rotary table (4); The cover plate (5), the cover plate (5) is fixedly installed on the installation table (1), the cover plate (5) is located above the rotary table (4), a sliding groove (6) is formed in the cover plate (5), a sliding block (7) in transmission connection with the rotary table (4) is connected inside the sliding groove (6) in a sliding mode, a first air pipe (71) is fixedly connected to the sliding block (7), and an air suction hole (72) communicated with the first air pipe (71) is formed in the sliding block (7); The air distribution piece (8), air distribution piece (8) fixed mounting is in on mount table (1), just air distribution piece (8) with first gas tube (71) are connected.
  2. 2. The wafer vacuum adsorption positioning platform of claim 1, wherein a second air pipe (73) is fixedly connected to the sliding block (7), an air outlet hole (74) communicated with the second air pipe (73) is formed in the sliding block (7), a rubber sealing film (75) is fixedly connected to the inner wall of the air outlet hole (74), and the second air pipe (73) is connected with the air distribution piece (8).
  3. 3. A wafer vacuum chuck positioning stage according to claim 2, wherein the upper surface of the slider (7) is lower than the upper surface of the cover plate (5).
  4. 4. The wafer vacuum adsorption positioning platform according to claim 1, wherein the vertical section of the sliding block (7) is in an inverted T-shaped arrangement, and one side of the sliding block (7) is clamped between the turntable (4) and the cover plate (5).
  5. 5. The wafer vacuum adsorption positioning platform of claim 1, wherein the gas distribution piece (8) is fixedly connected with a mounting column (9), an inclined plane is arranged at the upper end of the mounting column (9), and a camera (10) is fixedly connected to the inclined plane at the upper end of the mounting column (9).
  6. 6. The wafer vacuum adsorption positioning platform as set forth in claim 1, wherein a plurality of sliding grooves (6) and sliding blocks (7) are arranged on the cover plate (5), and the sliding grooves (6) and the sliding blocks (7) are arranged in an equidistant and radial mode.

Description

Wafer vacuum adsorption positioning platform Technical Field The utility model belongs to the technical field of semiconductor processing, and particularly relates to a wafer vacuum adsorption positioning platform. Background In the wafer processing process, the adsorption is a key step and is mainly used for fixing and stabilizing the wafer so as to ensure the processing precision and the process consistency, the wafer is adsorbed on a processing platform, the displacement of the wafer in the processing process can be reduced, and meanwhile, the surface smoothness of the wafer can be ensured. Common wafer adsorption technology has vacuum adsorption and electrostatic adsorption, wherein vacuum adsorption is fixed through negative pressure, is used for machining or detection equipment in many ways, and common vacuum adsorption equipment is to set up multiunit hole on placing the platform, builds negative pressure environment through negative pressure equipment connection hole, adsorbs the wafer through negative pressure hole, but current these adsorption equipment can build negative pressure environment in all holes when the operation, and the wafer size is different, when processing small-size wafer, unnecessary hole still communicates with the external world, can lead to the wasting of resources, and the inside negative pressure of hole that is difficult to regulate and control and contact with the wafer exists the use defect. Disclosure of utility model The utility model aims to provide a wafer vacuum adsorption positioning platform, which solves the problems that adsorption holes of the existing wafer adsorption equipment cannot be adjusted according to the wafer size and have using defects. In order to achieve the above purpose, the present utility model provides the following technical solutions: A wafer vacuum chuck positioning platform, comprising: The mounting table is fixedly connected with a support column and a motor at the bottom of the mounting table; The rotary table is rotationally connected to the mounting table and fixedly connected with an output shaft of the motor, and grooves which are arranged in a vortex-shaped line are formed in the rotary table; The cover plate is fixedly arranged on the mounting table, the cover plate is positioned above the turntable, a chute is formed in the cover plate, a sliding block in transmission connection with the turntable is connected in the chute in a sliding manner, a first air pipe is fixedly connected to the sliding block, and an air suction hole communicated with the first air pipe is formed in the sliding block; the air distribution piece is fixedly installed on the installation table and connected with the first air pipe. Preferably, a second air pipe is fixedly connected to the sliding block, an air outlet hole communicated with the second air pipe is formed in the sliding block, a rubber sealing film is fixedly connected to the inner wall of the air outlet hole, and the second air pipe is connected with the air distribution piece. Preferably, the upper surface of the slider is lower than the upper surface of the cover plate. Preferably, the vertical section of the sliding block is in an inverted T-shaped arrangement, and one side of the sliding block is clamped between the turntable and the cover plate. Preferably, the gas distribution piece is fixedly connected with a mounting column, the upper end of the mounting column is provided with an inclined plane, and the inclined plane of the upper end of the mounting column is fixedly connected with a camera. Preferably, a plurality of sliding grooves and sliding blocks are arranged on the cover plate, and the sliding grooves and the sliding blocks are arranged in an equidistant radial mode. Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the turntable, the cover plate, the sliding chute and the sliding block are arranged, when a user needs to adsorb wafers with different sizes, the turntable can be driven by the motor to rotate, and the rotating turntable drives the sliding block to slide in the sliding chute, so that the sliding block is moved to the positions below the wafers with different sizes, a negative pressure environment is created in the air suction hole through the air distribution piece and the first air pipe, and the wafers are adsorbed through the air suction hole, so that subsequent processing is facilitated; in addition, the air outlet hole and the rubber sealing film are arranged, when a user needs to adjust the position of the wafer on the cover plate, the air can be pumped into the air outlet hole through the air distribution piece and the second air pipe, a pressurized environment is created, the rubber sealing film is raised, the rubber sealing film contacts with the wafer through the raised rubber sealing film, then the sliding block and the rubber sealing film are controlled to move, the position of the wafer is