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CN-224234180-U - Detection device for front and back sides of wafer and turn-over cleaning equipment

CN224234180UCN 224234180 UCN224234180 UCN 224234180UCN-224234180-U

Abstract

The utility model provides a device for detecting the front and back sides of a wafer and a turn-over cleaning device, which comprises a detection mechanism, a temporary storage area, a detection mechanism and a control mechanism, wherein the temporary storage area is arranged in the turn-over cleaning device and used for temporarily storing the wafer, the detection mechanism is used for detecting whether a detection surface of the wafer to be detected is provided with a core particle and groove structure on the front side of the wafer to be detected, if yes, the detection surface is judged to be the front side of the wafer, and if not, the detection surface is judged to be the back side of the wafer. According to the utility model, the detection mechanism is arranged in the turn-over cleaning equipment, when the turn-over cleaning equipment is down, the detection device detects the front and back sides of the wafer to be detected, which is taken out from the wafer front-washing chamber or the wafer back-washing chamber, and the wafer to be detected is not required to be conveyed to another sorting machine or a sheet conveying machine for detection, so that cross contamination among different machines can be effectively prevented, and meanwhile, the labor cost is reduced.

Inventors

  • CHENG XIANG
  • LI MIAOMIAO

Assignees

  • 芯恩（青岛）集成电路有限公司

Dates

Publication Date
20260512
Application Date
20250521

Claims (10)

  1. 1. The utility model provides a detection device of wafer positive and negative, its characterized in that includes: the detecting mechanism is arranged in a temporary storage area for temporarily storing the wafer in the turn-over cleaning equipment and used for detecting whether a detecting surface of the wafer to be detected is provided with a core particle and groove structure on the front surface of the wafer to be detected, if so, the detecting surface is judged to be the front surface of the wafer, and if not, the detecting surface is judged to be the back surface of the wafer.
  2. 2. The apparatus according to claim 1, wherein the detecting means comprises: The beam emission component is arranged in the temporary storage area and is used for emitting a plurality of parallel beams to the detection surface; and the light beam receiving component is arranged in the temporary storage area and is used for receiving a reflected light beam formed by reflection of the detection surface.
  3. 3. The apparatus of claim 2, wherein the beam emitting assembly comprises a plurality of beam emitters spaced apart for emitting the beam, and/or, The beam receiving assembly includes a plurality of beam receivers disposed at intervals for receiving the reflected light beams.
  4. 4. The apparatus of claim 2, wherein the projected spots of the plurality of light beams on the wafer to be inspected are distributed in a linear array, a circular array, or a rectangular array, or A plurality of projection points of the light beams on the wafer to be tested are distributed at intervals along the radial direction of the wafer to be tested, or And the projection point of the plurality of light beams on the wafer to be tested covers the diameter area of the wafer to be tested.
  5. 5. The apparatus for detecting the front and back sides of a wafer as set forth in claim 2, further comprising: And the controller is in communication connection with the light beam receiving component and is used for processing and analyzing the signals of the reflected light beams, judging whether the signal fluctuation of the reflected light beams exceeds a preset range, if so, judging that the detection surface is the front surface of the wafer, and if not, judging that the detection surface is the back surface of the wafer.
  6. 6. The apparatus according to claim 1, wherein the detecting means comprises: The image collector is arranged in the temporary storage area and is used for collecting detection images of the detection surface.
  7. 7. The apparatus for detecting front and back sides of a wafer as set forth in claim 6, further comprising: And the controller is in communication connection with the image collector and is used for comparing the detection image with a standard image of the front surface of the wafer to be detected, judging whether the detection image is matched with the standard image, if so, judging that the detection surface is the front surface of the wafer, and if not, judging that the detection surface is the back surface of the wafer.
  8. 8. The apparatus according to claim 5 or 7, wherein the controller is in control connection with a wafer transfer mechanism, and when the controller detects that the detection surface is the front surface of the wafer, the controller controls the wafer transfer mechanism to transfer the wafer to be tested back to the wafer box.
  9. 9. The apparatus according to claim 8, wherein the controller is further in control connection with a robot and a turnover unit, and when the controller detects that the detection surface is the back surface of the wafer, the controller controls the robot to transfer the wafer to be tested to the turnover unit, the wafer to be tested is turned to the right side up by the turnover unit, and then controls the transfer mechanism to transfer the wafer to be tested back to the wafer box.
  10. 10. A turn-over cleaning device is characterized by comprising the detection device for the front and the back of the wafer, wherein the detection device is used for detecting the front and the back of the wafer to be detected, which is taken out from a wafer front washing chamber or a wafer back washing chamber, when the turn-over cleaning device is down.

Description

Detection device for front and back sides of wafer and turn-over cleaning equipment Technical Field The utility model relates to the technical field of semiconductors, in particular to a device for detecting the front and back sides of a wafer and a turnover cleaning device. Background The Depth of Focus (DOF) and overlay tolerance of the lithography decreases as the device geometry required for advanced nodes shrinks, thus requiring pre-cleaning of the backside before the wafer enters lithography. In addition, advanced node thin film material/chemical/integration schemes become more complex, and after multiple processes, particle and metal contamination on the wafer backside and edge can cause cross contamination to different tools, thus, wafer backside quality improvement is very challenging. Defects on the back side of the wafer come from a variety of sources including particles, residues, scratches, etc., and backside cleaning techniques are therefore emerging. The general turn-over cleaning equipment needs to go through the process that the wafer is turned back to the front from the front to the back, is influenced by various aspects such as machine stability, and is very likely to have the condition of downtime when the machine is down, so whether the wafer is a return wafer box with the front facing upwards or not needs multiple confirmation. The conventional detection method is that after the turn-over cleaning equipment alarms, the front and back sides of the wafer are judged by reading the ID identification code of the back side of the wafer through a sorting machine or a wafer conveying machine after the wafer exits to the wafer box, if the wafer is provided with pollutants, other machines are polluted by the fact that the front side of the wafer faces downwards when the ID identification code of the back side of the wafer is detected, so that labor cost is increased, and the probability of cross contamination of the machines is increased. In view of the foregoing, it is necessary to provide a wafer front and back surface detection device and a turn-over cleaning apparatus to solve the above-mentioned problems. Disclosure of utility model The utility model aims to provide a device for detecting the front and back sides of a wafer and a turnover cleaning device, which are used for improving the problems that the existing method for detecting the front and back sides of the wafer not only increases labor cost, but also increases the probability of cross contamination of a machine. The utility model provides a device for detecting the front and back sides of a wafer, which comprises: the detecting mechanism is arranged in a temporary storage area for temporarily storing the wafer in the turn-over cleaning equipment and used for detecting whether a detecting surface of the wafer to be detected is provided with a core particle and groove structure on the front surface of the wafer to be detected, if so, the detecting surface is judged to be the front surface of the wafer, and if not, the detecting surface is judged to be the back surface of the wafer. In one possible embodiment, the detection mechanism comprises: The beam emission component is arranged in the temporary storage area and is used for emitting a plurality of parallel beams to the detection surface; and the light beam receiving component is arranged in the temporary storage area and is used for receiving a reflected light beam formed by reflection of the detection surface. In one possible embodiment, the beam emitting assembly includes a plurality of beam emitters disposed in spaced relation for emitting the beam, and/or, The beam receiving assembly includes a plurality of beam receivers disposed at intervals for receiving the reflected light beams. In one possible embodiment, the projection points of the multiple beams on the wafer to be tested are distributed in a linear array, a circular array or a rectangular array, or A plurality of projection points of the light beams on the wafer to be tested are distributed at intervals along the radial direction of the wafer to be tested, or And the projection point of the plurality of light beams on the wafer to be tested covers the diameter area of the wafer to be tested. In a possible embodiment, the detection device further comprises: And the controller is in communication connection with the light beam receiving component and is used for processing and analyzing the signals of the reflected light beams, judging whether the signal fluctuation of the reflected light beams exceeds a preset range, if so, judging that the detection surface is the front surface of the wafer, and if not, judging that the detection surface is the back surface of the wafer. In one possible embodiment, the detection mechanism comprises: The image collector is arranged in the temporary storage area and is used for collecting detection images of the detection surface. In a possible embodiment, the detection device furthe