CN-224234181-U - Wafer detection device and wafer detection system

CN224234181UCN 224234181 UCN224234181 UCN 224234181UCN-224234181-U

Abstract

The utility model provides a wafer detection device and a wafer detection system, which comprise a fixing mechanism and a detection mechanism, wherein the fixing mechanism comprises a retainer and a claw, one side of the retainer in the horizontal direction is provided with a connecting surface, the connecting surface is vertical to the horizontal plane, a connecting area is arranged on the connecting surface, the claw is arranged around the connecting area and can move along the thickness direction of the retainer, at least part of the claw can press the edge of a wafer to be detected, and the detection mechanism comprises a probe which can be close to/far away from the wafer to be detected. The utility model can fix the wafer to be detected in the vertical direction, is convenient for observation, thereby ensuring the detection accuracy degree, and simultaneously, the surface of the vertically arranged wafer is not easy to accumulate scraps and impurities, thereby improving the detection quality. Compared with the existing wafer detection equipment, the utility model has the advantages of strong controllability, strong compatibility, high detection quality, capability of avoiding wafer damage and the like, and has wide application prospect in the industry.

Inventors

Wu Chendanqing
DAI JUAN
JIN YONGBIN
WANG QIANG
HE TAO
DING NING
ZHU WEI

Assignees

苏州法特迪科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250523

Claims (10)

1. A wafer detecting device is characterized by comprising: The fixing mechanism comprises a retainer and at least three clamping claws, one side of the retainer in the horizontal direction is provided with a connecting surface which is perpendicular to the horizontal plane, a connecting area is arranged on the connecting surface, at least three clamping claws are connected with the retainer and are arranged around the connecting area, any clamping claw can move along the thickness direction of the retainer, at least part of the clamping claws extend towards the connecting area so as to press the edge of a wafer to be detected, and the wafer to be detected is fixed in the connecting area through the clamping claws; The detecting mechanism comprises a plurality of probes, and the probes can be close to/far away from the wafer to be detected along the horizontal direction.
2. The wafer inspection apparatus according to claim 1, wherein the holder has at least three guide grooves formed in a body thereof, any of the guide grooves extending in a thickness direction of the body, the guide grooves being disposed in one-to-one correspondence with the claws, at least a part of the claws being inserted into the guide grooves and being movable along the guide grooves.
3. The wafer inspection apparatus according to claim 1, wherein the chuck includes a socket portion and a stopper portion, the socket portion extends in a thickness direction of the holder, one end of the socket portion is connected to the holder in a penetrating manner, the other end of the socket portion is connected to the stopper portion, and the stopper portion and the socket portion are disposed to be inclined toward the connection region so as to abut against the wafer to be inspected.
4. The wafer inspection apparatus according to claim 1, wherein the holder has a connection passage provided with at least one suction port, and one end of the connection passage is connected to the suction port, and the other end is connected to a vacuum generating device.
5. The wafer probing apparatus as recited in claim 1 wherein the fixing mechanism further comprises a suction wire connected to the holder and disposed in the connection area and externally connected to a power source for sucking a wafer to be probed.
6. The wafer probing apparatus as recited in claim 1 wherein the probing mechanism further comprises a chuck, and a plurality of the probes are spaced apart on one side of the chuck and disposed toward the connection region.
7. A wafer detecting system, characterized by comprising the wafer detecting device according to any one of claims 1 to 6.
8. The wafer inspection system of claim 7 wherein the wafer inspection system comprises a transport mechanism disposed on a side of the wafer inspection apparatus comprising a robotic arm that carries a wafer to be inspected for movement into the wafer inspection apparatus.
9. The wafer probing system as recited in claim 8 further comprising a signal transmission module coupled to the holder and disposed toward the connection region.
10. The wafer inspection system of claim 9 further comprising a control mechanism, wherein the transmission mechanism and the signal transmission module are each coupled to the control mechanism.

Description

Wafer detection device and wafer detection system Technical Field The utility model relates to the technical field of wafer detection, in particular to a wafer detection device and a wafer detection system. Background In the semiconductor wafer manufacturing process, the wafer detector is used as core equipment for electrical performance test, and the structural design of the wafer detector directly influences the test precision, the production efficiency and the equipment maintenance cost. Conventional wafer probers typically place a wafer at a load port, remove it from a wafer cassette by a transfer mechanism, place it horizontally on a chuck after calibration, move the chuck up to a corresponding position for electrical testing by the probe apparatus, and manually lock the probe head onto an inner ring (INNER RING) and contact a stationary device (e.g., a POGO Tower) that connects the tester interface board to the probe card, moving close to the wafer to be probed by lifting. However, in the lifting detection process, an operator cannot observe the downward-arranged probe in real time, and chips generated by friction may accumulate on the wafer, so that the probe has impact risk, not only the test accuracy is affected, but also the wafer is scrapped even when serious, and meanwhile, the wafer is horizontally arranged, and the surface of the wafer is easy to accumulate chips and impurities, which is one of the main reasons for affecting the detection result of the wafer. Disclosure of Invention Therefore, the utility model aims to solve the technical problems that the wafer is difficult to monitor and the detection quality is easily affected when the wafer is horizontally detected in the prior art, and provides a wafer detection device and a wafer detection system. In order to solve the technical problems, the utility model provides a wafer detection device which comprises a fixing mechanism and a detection mechanism, wherein the fixing mechanism comprises a retainer and at least three clamping claws, one side of the retainer in the horizontal direction is provided with a connecting surface which is perpendicular to the horizontal plane and is provided with a connecting area, at least three clamping claws are connected with the retainer and are arranged around the connecting area, any clamping claws can move along the thickness direction of the retainer, at least part of the clamping claws extend towards the connecting area so as to press the edge of a wafer to be detected, the wafer to be detected is fixed in the connecting area through the clamping claws, and the detection mechanism comprises a plurality of probes which can be close to/far away from the wafer to be detected along the horizontal direction. In one embodiment of the present utility model, the body of the retainer is provided with at least three guide grooves, any guide groove extends along the thickness direction of the body, the guide grooves are arranged in one-to-one correspondence with the claws, and at least part of the claws are inserted into the guide grooves and can move along the guide grooves. In one embodiment of the utility model, the claw comprises a plugging part and a limiting part, wherein the plugging part extends along the thickness direction of the retainer, one end of the plugging part is connected with the retainer in a penetrating way, the other end of the plugging part is connected with the limiting part, and the limiting part and the plugging part are obliquely arranged towards the connecting area so as to be abutted against the wafer to be detected. In one embodiment of the utility model, a connecting channel is arranged on the body of the retainer, at least one adsorption port is arranged on the connecting region, one end of the connecting channel is communicated with the adsorption port, and the other end of the connecting channel is externally connected with vacuum generating equipment. In one embodiment of the present utility model, the fixing mechanism further includes an adsorption wire connected to the holder and disposed in the connection area, and externally connected to a power source for adsorbing the wafer to be probed. In one embodiment of the present utility model, the probing mechanism further includes a chuck, and the plurality of probes are spaced apart on one side of the chuck and disposed toward the connection region. The utility model also provides a wafer detection system which comprises the wafer detection device. In one embodiment of the present utility model, the wafer detection system includes a transmission mechanism, where the transmission mechanism is disposed at one side of the wafer detection device, and includes a mechanical arm, and the mechanical arm carries a wafer to be detected to move into the wafer detection device. In one embodiment of the utility model, the wafer probing system further comprises a signal transmission module coupled to the holder and disposed toward the connec