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CN-224234182-U - Dual-chip cascade acquisition circuit

CN224234182UCN 224234182 UCN224234182 UCN 224234182UCN-224234182-U

Abstract

The utility model discloses a double-chip cascade acquisition circuit which comprises a mounting base and chip bearing mechanisms for bearing and positioning two groups of chips, wherein radiating fins contacting with the bottoms of the chips are arranged at the top of the mounting base, radiating fin plugging fixing mechanisms are arranged at the top of the mounting base, and chip fixing mechanisms are arranged at two sides of the chip bearing mechanisms. The chip bearing mechanism provided by the utility model can bear and initially position two groups of chips to be mounted, and the chip fixing mechanism is arranged outside the chip bearing mechanism, so that the chips can be prevented from being separated from the inside of the chip bearing mechanism when working, the chip fixing mode does not need to directly mount by using screws, the possibility of damaging the chips is prevented to a certain extent, the heat generated by the chips can be conveniently and rapidly dissipated by the arranged radiating fins, the concentrated accumulation of the heat is prevented, and the radiating fins can be fixed by the arranged radiating fin plugging and fixing mechanism.

Inventors

  • ZHANG WEI
  • XIE ZHIQIANG
  • Lan Renlang

Assignees

  • 深圳市芮能科技有限公司

Dates

Publication Date
20260512
Application Date
20250424

Claims (6)

  1. 1. The double-chip cascading acquisition circuit comprises an installation base (1), wherein two groups of first locking frames (2) are fixedly installed on two sides of the installation base (1), a plurality of groups of supporting rods (3) are fixedly installed on the top of the installation base (1), and the double-chip cascading acquisition circuit is characterized in that a chip bearing mechanism (6) for bearing and positioning two groups of chips is fixedly installed on the top of the supporting rods (3), cooling fins (4) in contact with the bottoms of the chips are arranged on the top of the installation base (1), cooling fin plugging fixing mechanisms (5) for locating the cooling fins (4) are arranged on the top of the installation base (1), and chip fixing mechanisms (7) for enabling chips to be installed inside the chip bearing mechanism (6) are arranged on two sides of the chip bearing mechanism (6).
  2. 2. The dual-chip cascade acquisition circuit of claim 1, wherein the chip bearing mechanism (6) comprises a connecting frame (8), a mounting groove (9), a bearing frame (10), a bearing groove (11) and first locking threaded holes (12), the mounting groove (9) is formed in the connecting frame (8), the bearing frame (10) is fixedly connected to the top of the connecting frame (8), the bearing groove (11) for bearing the chip is formed in the bearing frame (10), and two groups of first locking threaded holes (12) are formed in the top of the bearing frame (10).
  3. 3. The dual-chip cascade collection circuit of claim 2, wherein the radiating fin plugging fixing mechanism (5) comprises a positioning frame (13), a second locking frame (14), a connecting plate (15), a plugging block (16) and a third locking frame (17), the top of the mounting base (1) is fixedly provided with the positioning frame (13), the radiating fin (4) is slidably mounted in the positioning frame (13), one side top of the positioning frame (13) is fixedly provided with the second locking frame (14), one side of the connecting plate (15) is fixedly connected with the plugging block (16) inserted into the positioning frame (13), and the top of the connecting plate (15) is fixedly connected with the third locking frame (17) corresponding to the position of the second locking frame (14).
  4. 4. The dual-chip cascade acquisition circuit as set forth in claim 3, wherein the chip fixing mechanism (7) comprises a fixing frame (18), a second locking threaded hole (19), a taking plate (20) and a first avoiding chamfer (21), the fixing frame (18) is inserted into the outside of the bearing frame (10), the second locking threaded hole (19) is formed in the fixing frame (18) and corresponds to the first locking threaded hole (12), the taking plate (20) is fixedly connected to one side of the fixing frame (18), and the first avoiding chamfer (21) is formed in the inner wall of the fixing frame (18).
  5. 5. The dual-chip cascade collection circuit as claimed in claim 4, wherein the cross section of the plugging block (16) is in an isosceles trapezoid shape, and the plugging block (16) is made of rubber material.
  6. 6. The dual-chip cascade collection circuit as claimed in claim 4, wherein arc-shaped second avoiding chamfers (22) are formed at four corners of the bearing groove (11).

Description

Dual-chip cascade acquisition circuit Technical Field The utility model relates to an acquisition circuit, in particular to a double-chip cascade acquisition circuit. Background A dual chip cascade acquisition circuit is a design strategy that combines the functions of two or more chips to achieve more efficient and accurate data acquisition. Such architectures are commonly used in applications where high performance data processing and signal conditioning are required. Two groups of chips are required to be fixedly installed when the double-chip cascade acquisition circuit is used, and most of the chips are fixedly installed by utilizing a plurality of groups of locking screws when the chips are installed, so that the chips are easy to damage in the direct installation mode, a large amount of heat is generated when the chips work, and if the heat is continuously accumulated, the chips cannot be normally used because of high temperature, therefore, the double-chip cascade acquisition circuit is provided. Disclosure of utility model The utility model aims to provide a double-chip cascade acquisition circuit for solving the problems in the background technology. In order to achieve the purpose, the technical scheme is that the double-chip cascade acquisition circuit comprises a mounting base, two groups of first locking frames are fixedly mounted on two sides of the mounting base, a plurality of groups of supporting rods are fixedly mounted on the top of the mounting base, a chip bearing mechanism for bearing and positioning two groups of chips is fixedly mounted on the top of the supporting rods, cooling fins in contact with the bottoms of the chips are arranged on the top of the mounting base, cooling fin plugging and fixing mechanisms for positioning the cooling fins are arranged on the top of the mounting base, and chip fixing mechanisms for enabling the chips to be mounted in the chip bearing mechanism are arranged on two sides of the chip bearing mechanism. Further, the chip bearing mechanism comprises a connecting frame, an installing groove, a bearing frame, a bearing groove and first locking threaded holes, wherein the installing groove is formed in the connecting frame, the bearing frame is fixedly connected to the top of the connecting frame, the bearing groove for bearing the chip is formed in the bearing frame, and two groups of first locking threaded holes are formed in the top of the bearing frame. Further, fin shutoff fixed establishment includes locating frame, second locking frame, connecting plate, shutoff piece and third locking frame, the top fixed mounting of installation base has the locating frame, fin slidable mounting is inside the locating frame, one side top fixed mounting of locating frame has the second locking frame, one side fixedly connected with of connecting plate inserts the shutoff piece to the locating frame inside, the top of connecting plate just corresponds the position fixedly connected with third locking frame of second locking frame. Further, chip fixed establishment includes mount, second locking screw hole, takes the board and first chamfer of dodging, the mount is pegged graft to the bearing frame outside, the second locking screw hole has been seted up to the position that just corresponds first locking screw hole on the mount, one side fixedly connected with of mount takes the board, the first chamfer of dodging has been seted up to the inner wall of mount. Further, the cross section of the plugging block is in an isosceles trapezoid shape, and the manufacturing material of the plugging block is rubber material. Further, arc-shaped second avoidance chamfers are arranged at four corners of the bearing groove. Compared with the prior art, the utility model has the advantages that the mounting base and the first locking frame are mutually matched to fixedly mount the whole device, the chip bearing mechanism can bear and initially position two groups of chips to be mounted, and then the chip fixing mechanism is arranged outside the chip bearing mechanism, so that the chips can be prevented from being separated from the chip bearing mechanism when working, the chip fixing mode does not need to be directly mounted by using screws, the possibility of damaging the chips is prevented to a certain extent, the heat generated by the chips can be conveniently and rapidly dissipated by the heat radiating fins, the heat is prevented from being accumulated intensively, and the heat radiating fin can be fixed by the heat radiating fin plugging fixing mechanism; And the radiating fins, the radiating fin plugging fixing mechanism, the chip bearing mechanism and the chip fixing mechanism are mostly arranged in a detachable mode when the whole device is damaged in use, so that the whole device can be independently replaced and maintained after a certain part is damaged. Drawings FIG. 1 is a schematic perspective view of the present utility model; FIG. 2 is a schematic perspective v