CN-224234187-U - Chip heat dissipation lid convenient to temperature measurement

Abstract

The utility model relates to the technical field of radiators, and discloses a chip radiating cover convenient for temperature measurement. The shell is of a hollow structure, a flow cavity for fluid circulation is defined in the shell through the inner wall, a water inlet and a water outlet are formed in two sides of the top surface of the shell and communicated with the flow cavity, and a mounting hole is formed in the top surface of the shell and communicated with the flow cavity.

Inventors

• LIU BOYANG
• LIN TONGSHENG

Assignees

• 湖南志浩航精密科技有限公司

Dates

Publication Date

20260512

Application Date

20250520

Claims (10)

1. 1. A chip heat sink cap for facilitating temperature measurement, comprising: The inner part of the shell is of a hollow structure, and a flow cavity for fluid circulation is defined by the inner wall of the shell; the water inlet and the water outlet are arranged on two sides of the top surface of the shell and are communicated with the flow cavity; and the mounting hole is arranged on the top surface of the shell and is communicated with the flow cavity.
2. 2. The heat sink cover for chips for facilitating temperature measurement according to claim 1, wherein side walls of said inner cavities on both sides of said housing adjacent to said water inlet and said water outlet are in a "V" shape.
3. 3. A chip heat sink cover for facilitating temperature measurement according to claim 1 or 2, wherein at least two heat radiating fins are arranged on the inner wall of the housing at intervals, and the heat radiating fins are arranged along a direction parallel to a connecting line between the water inlet and the water outlet.
4. 4. The chip heat radiation cover convenient for temperature measurement according to claim 1 or 2, wherein a base is arranged at the bottom of the shell, a working medium accommodating cavity is formed between the base and the shell, a working medium injection pipe is arranged on the side face of the base, and the working medium injection pipe is communicated with the working medium accommodating cavity.
5. 5. The chip heat dissipation cover for facilitating temperature measurement according to claim 4, further comprising a heat conducting column disposed in the working medium accommodating cavity and abutting between the housing and the base.
6. 6. The heat dissipating cover for a chip for facilitating temperature measurement according to claim 5, wherein the outer circumference of said heat conducting post is sequentially fitted with a first heat conducting plate, a collar and a second heat conducting plate in the axial direction thereof, said collar being for forming a heat dissipating gap between said first heat conducting plate and said second heat conducting plate.
7. 7. The heat dissipating cover for a chip for temperature measurement according to claim 5 or 6, wherein the bottom of the base is concavely provided with a receiving groove, the receiving groove is concavely formed along the axial direction of the heat conducting column, and the receiving groove is used for receiving the chip.
8. 8. The heat sink cover for chips with temperature measurement function according to claim 5 or 6, wherein a groove is formed on a side surface of the base, the working medium injection tube is disposed in the groove, and the groove is used for protecting the working medium injection tube.
9. 9. The chip heat dissipation cover for facilitating temperature measurement according to claim 6, wherein a limiting block is arranged on the inner bottom surface of the base, and limiting holes for matching with the limiting block are formed in the first heat conduction plate and the second heat conduction plate.
10. 10. The chip heat dissipation cover for facilitating temperature measurement according to claim 6, further comprising a plurality of evaporation capillary holes, wherein the plurality of evaporation capillary holes are arranged in the cross section of the lantern ring, and the plurality of evaporation capillary holes enable the working medium in the working medium accommodating cavity to conduct heat rapidly and uniformly.

Description

Chip heat dissipation lid convenient to temperature measurement Technical Field The utility model relates to the technical field of radiators, in particular to a chip radiating cover convenient for temperature measurement. Background With the trend of increasingly higher performance of electronic devices, the requirements of heat-generating elements such as chips on heat-dissipating systems are increasing. Conventional heat sinks typically achieve rapid removal of heat by using a coolant circulation. The existing radiator also has the problems that the existing temperature monitoring method is mostly dependent on an external sensor or an indirect temperature measuring mode, and the problems of low response speed and low measuring precision exist in the methods, so that the actual temperature change condition of the fluid can not be accurately reflected. Because of lack of accurate and timely temperature data feedback, the heat dissipation system is difficult to adjust, and the cooling effect is affected, so that the chip is at risk of damage caused by overheating. Therefore, a chip heat sink cover that facilitates temperature measurement is needed to solve the above-mentioned problems. Disclosure of utility model Based on the above, the present utility model aims to provide a chip heat dissipation cover for facilitating temperature measurement, so as to solve the problem of low efficiency of temperature monitoring of a radiator. In order to solve the technical problems, the utility model adopts the following technical scheme that the chip heat dissipation cover convenient for temperature measurement comprises: The inner part of the shell is of a hollow structure, and a flow cavity for fluid circulation is defined by the inner wall of the shell; the water inlet and the water outlet are arranged on two sides of the top surface of the shell and are communicated with the flow cavity; and the mounting hole is arranged on the top surface of the shell and is communicated with the flow cavity. As a preferable scheme of the chip heat dissipation cover convenient for temperature measurement, the side walls of the inner cavities of the two sides of the shell, which are close to the water inlet and the water outlet, are in a V-shaped structure. As a preferable scheme of the chip heat radiation cover convenient for temperature measurement, at least two heat radiation fins are arranged on the inner wall of the shell at intervals, and the heat radiation fins are arranged along a direction parallel to a connecting line between the water inlet and the water outlet. As a preferred scheme of chip heat dissipation lid convenient to temperature measurement, the bottom of casing is equipped with the base, the base with be formed with working medium holding chamber between the casing, the side of base is equipped with the working medium injection pipe, the working medium injection pipe with the working medium holding chamber switches on. As a preferred scheme of the chip heat dissipation cover convenient for temperature measurement, the chip heat dissipation cover further comprises a heat conduction column which is arranged in the working medium accommodating cavity and is abutted between the shell and the base. As an optimal scheme of the chip heat dissipation cover convenient for temperature measurement, a first heat conduction plate, a lantern ring and a second heat conduction plate are sleeved on the periphery of the heat conduction column in sequence along the axial direction of the heat conduction column, and the lantern ring is used for enabling a heat dissipation gap to be formed between the first heat conduction plate and the second heat conduction plate. As a preferred scheme of chip heat dissipation lid convenient to temperature measurement, the bottom of base is concave to be equipped with the storage tank, the axial along the heat conduction post of storage tank is sunken, the storage tank is used for placing the chip. As a preferred scheme of chip heat dissipation lid convenient to temperature measurement, the side of base is equipped with the recess, working medium injection tube set up in the recess, the recess is used for the protection working medium injection tube. As a preferred scheme of chip heat dissipation lid convenient to temperature measurement, the interior bottom surface of base is equipped with the stopper, first heat-conducting plate with the spacing hole that is used for the cooperation stopper is all seted up to the second heat-conducting plate. As a preferred scheme of chip heat dissipation lid convenient to temperature measurement, still include evaporation capillary hole, be equipped with several evaporation capillary hole in the cross-section of lantern ring, evaporation capillary hole makes the quick and even heat conduction of working medium in the working medium accommodation chamber. The utility model has the beneficial effects that the flow cavity formed by the hollow structure in the she