Search

CN-224234188-U - Microchannel radiator with internal tooth structure

CN224234188UCN 224234188 UCN224234188 UCN 224234188UCN-224234188-U

Abstract

The application discloses a microchannel radiator with an internal tooth structure, which relates to the field of high-power heat dissipation technology and comprises a heat dissipation plate and a heat exchanger, wherein the heat dissipation plate is communicated with the heat exchanger through a steam conveying pipe and a condensation return pipe, an evaporation chamber is vertically arranged on the heat dissipation plate, one end of the steam conveying pipe, which is close to the heat dissipation plate, is communicated with the evaporation chamber, one end of the condensation return pipe, which is close to the heat dissipation plate, is communicated with the evaporation chamber, a plurality of guide plates are vertically arranged on the bottom wall of the evaporation chamber at intervals, a plurality of heat dissipation elements for enhancing contact between a liquid working medium and a hot wall surface are further arranged on the bottom wall of the evaporation chamber, and the plurality of heat dissipation elements are arranged in the evaporation chamber at intervals in an array. According to the application, the radiating elements distributed in the interval array are arranged on the inner bottom wall of the evaporating cavity and form a synergistic effect with the flow guide plate, so that the contact area between the liquid working medium and the hot wall surface is effectively increased, the working medium fully absorbs heat and is vaporized in the evaporating cavity, the phase-change heat transfer efficiency is improved, and the effect of reducing the local thermal resistance is achieved.

Inventors

  • ZHU SHUTING

Assignees

  • 上海热拓电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250710

Claims (9)

  1. 1. A microchannel radiator with an internal tooth structure comprises a radiating plate (1) and a heat exchanger (2), wherein the radiating plate (1) is communicated with the heat exchanger (2) through a steam conveying pipe (3) and a condensation return pipe (4), an evaporation chamber (7) is vertically arranged on the radiating plate (1), one end, close to the radiating plate (1), of the steam conveying pipe (3) is communicated with the evaporation chamber (7), one end, close to the radiating plate (1), of the condensation return pipe (4) is communicated with the evaporation chamber (7), a plurality of guide plates (8) are vertically arranged on the inner bottom wall of the evaporation chamber (7) at intervals, and the microchannel radiator is characterized in that a plurality of radiating pieces (9) are further arranged on the inner bottom wall of the evaporation chamber (7) at intervals and are distributed in the evaporation chamber (7) at intervals.
  2. 2. The microchannel heat sink with internal tooth structure according to claim 1, wherein the heat dissipation plate (1) comprises a cover plate (12) and a base plate (11), the evaporation chamber (7) is vertically arranged on the base plate (11), the cover plate (12) is located at one side of the evaporation chamber (7), and the cover plate (12) covers the evaporation chamber (7) and is fixedly connected with the base plate (11).
  3. 3. The microchannel radiator with the internal tooth structure according to claim 1, wherein the radiating piece (9) comprises a plurality of fin bodies (91), the fin bodies (91) are bent back and forth in the width direction to form a zigzag structure, a first channel (911) and a second channel (912) which are staggered in sequence are formed, the first channel (911) and the second channel (912) are of opening structures, the opening directions of the first channel (911) and the second channel (912) are opposite, the cross sections of the first channel (911) and the second channel (912) are rectangular, the fin bodies (91) are staggered back and forth along the flowing direction of a liquid working medium, the adjacent fin bodies (91) are connected, and the first channel (911) and the second channel (912) are communicated.
  4. 4. A microchannel radiator with internal tooth structure according to claim 2, characterized in that the end of the steam delivery pipe (3) remote from the heat exchanger (2) is connected to the top of the evaporation chamber (7) through the cover plate (12), and the end of the condensate return pipe (4) remote from the heat exchanger (2) is connected to the bottom of the evaporation chamber (7) through the cover plate (12).
  5. 5. The microchannel radiator with the internal tooth structure according to claim 1, wherein the heat exchanger (2) comprises a steam chamber (21), a liquid return chamber (22) and phase-change flat tubes (23), the steam chamber (21) and the liquid return chamber (22) are arranged at intervals, the phase-change flat tubes (23) are multiple, the phase-change flat tubes (23) are located between the steam chamber (21) and the liquid return chamber (22), and two ends of the phase-change flat tubes (23) are respectively communicated with the steam chamber (21) and the liquid return chamber (22).
  6. 6. The microchannel heat radiator with internal tooth structure according to claim 5, wherein the number of the heat exchangers (2) is two, the number of the heat exchangers (2) is respectively a first heat exchanger (24) and a second heat exchanger (25), the first heat exchanger (24) and the second heat exchanger (25) are arranged in parallel, and a communicating pipe (5) is arranged between a vapor chamber (21) and a liquid reflux chamber (22) of the first heat exchanger (24) and the second heat exchanger (25) in a communicating way.
  7. 7. A microchannel radiator with internal tooth structure according to claim 6, characterized in that the end of the steam delivery pipe (3) remote from the radiator plate (1) is in communication with the steam chamber (21) on the first heat exchanger (24), and the end of the condensate return pipe (4) remote from the radiator plate (1) is in communication with the liquid return pipe on the first heat exchanger (24).
  8. 8. The microchannel radiator with the internal tooth structure according to claim 1 is characterized in that a plurality of mounting columns (10) are arranged in the evaporation chamber (7), the plurality of mounting columns (10) are uniformly distributed on the bottom wall of the evaporation chamber (7), threaded holes (13) connected with a high-power semiconductor device are formed in the mounting columns (10), and the threaded holes (13) penetrate through the mounting columns (10) and the base plate (11).
  9. 9. A microchannel heat sink with internal tooth structure according to claim 6, characterized in that the liquid return chamber (22) of the first heat exchanger (24) is provided with a valve (6).

Description

Microchannel radiator with internal tooth structure Technical Field The application relates to the technical field of high-power heat dissipation, in particular to a microchannel heat radiator with an internal tooth structure. Background With the increasing market demands of high-power semiconductor devices such as communication, new energy, rail transit, smart grids and medical equipment, the high-power semiconductor devices such as GTO, MCT, IGBT are rapidly developed, so the current situation of troublesome heat dissipation demands is faced nowadays, namely, firstly, the packaging density of the high-power semiconductor devices is continuously improved, the heat flux density of the high-power semiconductor devices is continuously increased, secondly, the heating loss of the high-power semiconductor devices is higher and higher due to the continuous improvement of the performance of the high-power semiconductor devices, and in addition, the application environments of the high-power semiconductor devices are continuously expanded, the used thermal environments are greatly different, and the problem of overheating of electronic equipment is more and more prominent due to the development trends of the high-power semiconductor devices. At present, the gas-liquid two-phase heat dissipation technology gradually becomes an effective solution for high-power heat dissipation due to the advantages of high heat transfer efficiency, good temperature uniformity and the like. Such systems typically include an evaporation end (heat sink) and a condensation end (heat exchanger), the evaporation end (heat sink) being configured to couple to the high power semiconductor device to dissipate heat from the high power semiconductor device, the evaporation end (heat sink) and the condensation end (heat exchanger) being in communication through a plurality of conduits, and efficient heat transfer being achieved through phase change cycles of the liquid working medium. At present, the evaporation end heat dissipation plate mostly adopts an evaporation chamber structure, a guide plate and a capillary structure are generally designed in the evaporation end heat dissipation plate to regulate and control the flow of liquid working medium, and parallel or grid-shaped guide plates are arranged in the evaporation chamber to form a directional flow channel. However, the baffle physically divides the space of the chamber, so that the flow path can be standardized, but the direct contact area of the liquid working medium and the hot wall surface is reduced, the evaporation heat exchange efficiency is reduced, the local thermal resistance is increased, and even the problems of uneven distribution, rising drying risk and the like of the liquid working medium can be possibly caused. Disclosure of utility model Aiming at the technical problems, in order to solve the problems of reduced evaporation heat exchange efficiency, increased local thermal resistance and the like, the applicant provides a microchannel radiator with an internal tooth structure. The application provides a microchannel radiator with an internal tooth structure, which adopts the following technical scheme: A microchannel radiator with an internal tooth structure comprises a radiating plate and a heat exchanger, wherein the radiating plate is communicated with the heat exchanger through a steam conveying pipe and a condensation return pipe, an evaporation chamber is vertically arranged on the radiating plate, one end of the steam conveying pipe, which is close to the radiating plate, is communicated with the evaporation chamber, one end of the condensation return pipe, which is close to the radiating plate, is communicated with the evaporation chamber, a plurality of guide plates are vertically arranged on the bottom wall of the evaporation chamber at intervals, a plurality of radiating pieces used for enhancing contact between a liquid working medium and a hot wall are further arranged on the bottom wall of the evaporation chamber, and a plurality of radiating pieces are arranged in the evaporation chamber at intervals in an array. Through adopting above-mentioned technical scheme, the array structure of radiating piece can effectively increase the area of contact of liquid working medium and hot wall, makes up the guide plate and cuts apart the area of contact that the cavity leads to not enough problem, makes the working medium more fully absorb heat and vaporization in evaporating cavity, promotes phase transition heat transfer efficiency, reduces local thermal resistance. The synergistic effect of the guide plate and the heat dissipation piece can standardize the working medium flow path, avoid local drying, strengthen heat exchange and realize the balance of heat dissipation efficiency and temperature uniformity. Preferably, the heat dissipation plate comprises a cover plate and a substrate, the evaporation chamber is vertically arranged on the substrate, the cover pl