CN-224234191-U - Double-sided radiating packaging unit and packaging structure

CN224234191UCN 224234191 UCN224234191 UCN 224234191UCN-224234191-U

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a packaging unit and a packaging structure with double-sided heat dissipation. The double-sided radiating packaging unit comprises a unit frame, a chip, a radiating copper block and a packaging body, wherein the unit frame comprises a base island, the base island is provided with a working surface and a first radiating surface which are oppositely arranged, the chip is arranged on the working surface, the radiating copper block is oppositely arranged with the base island, the chip is positioned between the base island and the radiating copper block, one surface of the radiating copper block, which is away from the chip, is provided with a second radiating surface, and the packaging body is used for coating the unit frame, the chip and the radiating copper block, and both the first radiating surface and the second radiating surface are exposed out of the packaging body. The heat generated in the chip working process can be radiated through the first radiating surface and the second radiating surface, so that the radiating performance of the packaging unit is improved.

Inventors

Xia daquan
ZHOU PING
SUN XUEYIN
YAN RUIDONG
ZHOU YUFENG
XU XIANGTAO

Assignees

重庆平伟实业股份有限公司
博世华域转向系统有限公司

Dates

Publication Date: 20260512
Application Date: 20250418

Claims (10)

1. A double-sided heat dissipating packaging unit, comprising: the unit frame comprises a base island, wherein the base island is provided with a working surface and a first radiating surface which are oppositely arranged; the chip is arranged on the working surface; The heat dissipation copper block is arranged opposite to the base island, the chip is positioned between the base island and the heat dissipation copper block, and one surface of the heat dissipation copper block, which is away from the chip, is arranged as a second heat dissipation surface; the packaging body is used for coating the unit frame, the chip and the heat dissipation copper block, and the first heat dissipation surface and the second heat dissipation surface are exposed out of the packaging body.
2. The double-sided radiating packaging unit of claim 1, wherein the unit frame further comprises a first pin and a second pin which are oppositely arranged, the first pin and the base island are connected into a whole, the second pin and the base island are arranged in a flush manner, a gap is arranged between the second pin and the base island, and the second pin is connected with the radiating copper block.
3. The double-sided radiating packaging unit of claim 2, wherein the welding parts of the first pin and the second pin are exposed out of the packaging body and are arranged flush with the surface of the packaging body.
4. The package unit according to claim 3, wherein the base island comprises a gate base island and a source base island which are arranged at intervals, the first pin comprises a gate pin and a source pin, the gate base island is connected with the gate pin into a whole, the source base island is connected with the source pin into a whole, and the gate pin and the source pin are arranged in parallel or the gate pin and the source pin are arranged vertically.
5. The double-sided heat dissipating packaging unit of claim 4 wherein said gate pin is positioned near a middle of said package when said gate pin and said source pin are disposed vertically.
6. The double-sided heat dissipating packaging unit as set forth in any one of claims 1-5, wherein the working surface is provided with a solder recess where the chip is soldered.
7. The double-sided radiating packaging unit of claim 6, wherein a first step is arranged on one side of the unit frame, which faces away from the chip, and a second step is arranged on one side of the radiating copper block, which faces away from the chip, and the packaging body wraps the first step and the second step.
8. The double-sided heat dissipating packaging unit of claim 7 wherein the heat dissipating copper block has a first protrusion and a second protrusion disposed on a circumferential sidewall thereof, the first protrusion and the second protrusion are both disposed on the second step, and the package body encapsulates the first protrusion and the second protrusion.
9. A package structure, comprising: a lead frame divided into a plurality of frame units; The double-sided heat dissipating packaging unit as set forth in any one of claims 1-8, disposed on the lead frame, and a number of the packaging units are disposed within each of the frame units.
10. The package structure of claim 9, wherein the unit frames are further provided with connecting ribs, and two adjacent unit frames are connected through the connecting ribs.

Description

Double-sided radiating packaging unit and packaging structure Technical Field The utility model relates to the technical field of semiconductor packaging, in particular to a packaging unit and a packaging structure with double-sided heat dissipation. Background Power MOSFET devices are used as a core component in modern power electronics systems, whose performance directly affects the efficiency, reliability, and cost of the overall system. With the development of power electronics technology to high efficiency, high power density and high reliability, the performance requirements on power MOSFET devices are also increasing. Conventional power MOSFET devices typically employ a source up structure, i.e., source on top of the chip and drain on bottom of the chip, and are connected to external circuitry by wire bonding. Although the structure is mature in process and low in cost, the structure has obvious limitations in practical application. First, the heat dissipation performance is limited. In the traditional packaging structure, heat generated by the chip is mainly dissipated through the drain electrode at the bottom, the heat dissipation path is longer, the thermal resistance is larger, the temperature rise of the device is higher when the device works at high power, and the power density and the working efficiency of the device are limited. Second, the parasitic parameters are larger. Wire bonding introduces additional parasitic inductance and resistance that affects the high frequency characteristics and switching speed of the device, especially in high frequency applications. In addition, the traditional packaging structure needs to reserve a wire bonding space, so that the packaging size is large, and the requirements of miniaturization and light weight of modern electronic equipment are difficult to meet. The traditional power MOSFET packaging structure has certain limitations in heat dissipation performance, parasitic parameters, packaging size and the like, and is difficult to meet the increasing application demands. Therefore, a new solution is needed to solve the above technical problems. Disclosure of utility model In view of the above drawbacks of the prior art, an object of the present utility model is to provide a dual-sided heat dissipation packaging unit and a dual-sided heat dissipation packaging structure, which are used for solving the problem of poor heat dissipation performance of the power MOSFET packaging structure in the prior art. In order to achieve the above and other related objects, the utility model provides a double-sided heat dissipation packaging unit, which is specifically configured to include a unit frame, a chip, a heat dissipation copper block and a packaging body, wherein the unit frame includes a base island, the base island has a working surface and a first heat dissipation surface which are oppositely arranged, the chip is arranged on the working surface, the heat dissipation copper block is oppositely arranged with the base island, the chip is located between the base island and the heat dissipation copper block, one surface of the heat dissipation copper block, which is away from the chip, is provided with a second heat dissipation surface, and the packaging body is used for wrapping the unit frame, the chip and the heat dissipation copper block, and the first heat dissipation surface and the second heat dissipation surface are exposed out of the packaging body. Optionally, the unit frame further comprises a first pin and a second pin which are oppositely arranged, the first pin and the base island are connected into a whole, the second pin and the base island are arranged in a flush manner, a gap is arranged between the second pin and the base island, and the second pin is connected with the heat dissipation copper block. Optionally, the welding parts of the first pin and the second pin are exposed out of the package body and are arranged flush with the surface of the package body. Optionally, the base island includes a gate base island and a source base island that are arranged at intervals, the first pin includes a gate pin and a source pin, the gate base island is integrally connected with the gate pin, the source base island is integrally connected with the source pin, and the gate pin and the source pin are arranged in parallel, or the gate pin and the source pin are arranged vertically. Optionally, when the gate pin and the source pin are vertically disposed, the gate pin is located near a middle portion of the package. Optionally, a welding groove is formed in the working face where the chip is welded. Optionally, a first step is arranged on one side of the unit frame, which is away from the chip, a second step is arranged on one side of the heat dissipation copper block, which is away from the chip, and the package body wraps the first step and the second step. Optionally, a first protruding portion and a second protruding portion are disposed on a circu