CN-224234193-U - Integrated circuit board

Abstract

The application provides an integrated circuit board. The integrated circuit board comprises a lath area and a frame area. The strip section includes a plurality of integrated circuit strips. The border region surrounds the slat region. The border region includes a first layer and a second layer. The first layer includes a first conductive material. The second layer is located above the first layer. A plurality of segments formed from a stack of conductive material are distributed in the second layer, and a plurality of the segments are separated by an insulating material.

Inventors

• Hai Wenjing
• LI JIE
• CHEN JUNYUE
• LU WEI
• Qu Lianye
• YANG ZHUZHU
• LIN JIADE

Assignees

• 日月光半导体(上海)有限公司

Dates

Publication Date

20260512

Application Date

20250523

Claims (10)

1. 1. An integrated circuit board, comprising: a strip section comprising a plurality of integrated circuit strips; a bezel area surrounding the slat area, comprising: A first layer comprising a first conductive material; A second layer over the first layer, wherein a plurality of segments formed from a stack of conductive material are distributed in the second layer, and a plurality of the segments are separated by an insulating material.
2. 2. The integrated circuit board of claim 1, wherein the stack of conductive materials comprises a lower layer of second conductive material and an upper layer of third conductive material.
3. 3. The integrated circuit board of claim 2, wherein the first conductive material comprises copper, the second conductive material comprises nickel, and the third conductive material comprises gold.
4. 4. The integrated circuit board of claim 2, wherein the second conductive material and the insulating material are disposed on an upper surface of the first conductive material.
5. 5. The integrated circuit board of claim 1, wherein the border region includes first and second edges on opposite sides, the first and second edges each including one of the plurality of segments.
6. 6. The integrated circuit board of claim 5, wherein the first edge and the second edge comprise the segment that is located intermediate the first edge and the second edge.
7. 7. The integrated circuit board of claim 6, wherein the one segment each of the first edge and the second edge comprises a straight segment.
8. 8. The integrated circuit board of claim 5, wherein the border region includes a third side and a fourth side on opposite sides, the third side and the fourth side each including a plurality of segments of the plurality of segments.
9. 9. The integrated circuit board of claim 8, wherein the plurality of segments respectively included by the third side and the fourth side have straight line segments and meandering segments.
10. 10. The integrated circuit board of claim 1, wherein the insulating material is solder resist ink.

Description

Integrated circuit board Technical Field The present application relates to the field of semiconductors, and more particularly, to an integrated circuit board. Background In the prior art, nickel layers are typically electroplated onto the integrated circuit board to achieve the desired circuit function. However, the electroplated nickel layer generally has a non-uniform phenomenon that the thickness is thinner near the edge of the plate and thicker near the center of the plate, resulting in poor yield. In order to increase the thickness of the nickel layer on the integrated circuit board strip near the edges of the board, attempts are often made to change the current distribution during electroplating. However, it is difficult to grasp the accuracy of the current by changing the current distribution. Therefore, there is currently a lack of an efficient and cost-effective way to improve the uniformity of the nickel layer thickness. Disclosure of utility model Accordingly, an objective of the present application is to provide an integrated circuit board for solving the above-mentioned problems. According to one embodiment of the present application, an integrated circuit board is provided. The integrated circuit board comprises a lath area and a frame area. The strip section includes a plurality of integrated circuit strips. The border region surrounds the slat region. The border region includes a first layer and a second layer. The first layer includes a first conductive material. The second layer is located above the first layer. A plurality of segments formed from a stack of conductive material are distributed in the second layer, and a plurality of the segments are separated by an insulating material. According to an embodiment of the application, the conductive material stack comprises a lower layer of a second conductive material and an upper layer of a third conductive material. According to an embodiment of the application, the first conductive material comprises copper, the second conductive material comprises nickel and the third conductive material comprises gold. According to an embodiment of the present application, the second conductive material and the insulating material are disposed on an upper surface of the first conductive material. According to an embodiment of the application, the rim area comprises a first edge and a second edge on opposite sides, the first edge and the second edge each comprising one of the plurality of segments. According to an embodiment of the application, the first and second sides comprise a section which is located at an intermediate position of the first and second sides. According to an embodiment of the application, the one section comprised by each of the first and second sides is a straight section. According to an embodiment of the application, the rim area comprises a third side and a fourth side at opposite sides, the third side and the fourth side respectively comprising a plurality of segments of the plurality of segments. According to an embodiment of the application, the plurality of segments comprised by the third side and the fourth side, respectively, have a straight line segment and a meandering segment. According to an embodiment of the application, the insulating material is a solder resist ink. Drawings The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification, illustrate the application and together with the description serve to explain, without limitation, the application. In the drawings: FIG. 1 illustrates a schematic diagram of an integrated circuit board in accordance with one embodiment of the present application. Fig. 2 illustrates a cross-sectional view of a bezel area in accordance with an embodiment of the present application. FIG. 3 illustrates a schematic view of a process window according to one embodiment of the application. Detailed Description The following disclosure provides various embodiments or examples that can be used to implement the various features of the present disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. It is to be understood that these descriptions are merely exemplary and are not intended to limit the present disclosure. For example, in the description below, forming a first feature on or over a second feature may include embodiments in which the first and second features are in direct contact with each other, and may also include embodiments in which additional components are formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. Such reuse is for brevity and clarity purposes and does not itself represent a relationship between the different embodiments and/or configuration