Search

CN-224234196-U - Semiconductor device and electrical equipment

CN224234196UCN 224234196 UCN224234196 UCN 224234196UCN-224234196-U

Abstract

The application discloses a semiconductor device and electrical equipment, wherein the semiconductor device comprises a substrate, a lead frame and a plastic package body, a fan inversion bonding pad part, a compressor inversion bonding pad part, a power bonding pad part and a rectification bonding pad part are arranged on a first main surface of the substrate, the plastic package body is used for plastic packaging at least part of the substrate and part of the lead frame, a radiator is arranged on a second main surface side and is in heat conduction connection with at least part of the plastic package body and/or at least part of the substrate, a containing cavity is surrounded between the radiator and the substrate, the projection of the containing cavity in the direction vertical to the first main surface is at least partially overlapped with the fan inversion bonding pad part, or is at least partially overlapped with the compressor inversion bonding pad part, or is at least partially overlapped with the area between the fan inversion bonding pad part and the compressor inversion bonding pad part, and a temperature detector is positioned in the containing cavity. The temperature detector does not occupy the space of the first main surface of the substrate, is beneficial to reducing the size of the substrate and improving the accuracy of temperature detection of the temperature detector.

Inventors

  • JIN KEKE
  • LI ZHENGKAI

Assignees

  • 海信家电集团股份有限公司

Dates

Publication Date
20260512
Application Date
20250530

Claims (12)

  1. 1. A semiconductor device externally connected with a processor, a heat sink, and a temperature detector, the semiconductor device comprising: A substrate having first and second opposed major faces, the first major face having thereon a fan inversion pad portion, a compressor inversion pad portion, a power pad portion, and a rectifying pad portion, the fan inversion pad portion and the compressor inversion pad portion being adjacent and spaced apart; The fan inverter circuit, the compressor inverter circuit, the power factor corrector and the rectifier are respectively arranged on the fan inverter pad part, the compressor inverter pad part, the power pad part and the rectification pad part; The lead frame comprises a driving lead frame, a rectifying lead frame and a temperature control lead frame, wherein a fan driving circuit, a compressor driving circuit and a power driving circuit are arranged on the driving lead frame, the fan driving circuit is electrically connected between the processor and the fan inverter circuit, the compressor driving circuit is electrically connected between the processor and the compressor inverter circuit, and the power driving circuit is electrically connected between the processor and the power factor corrector; The plastic package body is used for plastic packaging at least part of the substrate and part of the lead frame, and the other part of the lead frame is exposed out of the plastic package body; The radiator is arranged on the second main surface side and is in heat conduction connection with at least part of the plastic package body and/or at least part of the substrate, a containing cavity is surrounded between the radiator and the substrate, and the projection of the containing cavity in the direction perpendicular to the first main surface is at least partially overlapped with the fan inversion bonding pad part, or is at least partially overlapped with the compressor inversion bonding pad part, or is at least partially overlapped with the area between the fan inversion bonding pad part and the compressor inversion bonding pad part; the temperature detector is positioned in the accommodating cavity and used for detecting and obtaining a temperature sampling signal, and the temperature detector is electrically connected with the processor through the temperature control lead frame so as to send the temperature sampling signal to the processor through the temperature control lead frame.
  2. 2. The semiconductor device of claim 1, wherein a projection of the temperature detector in a direction perpendicular to the first major face at least partially coincides with the fan inverter circuit or at least partially coincides with the compressor inverter circuit.
  3. 3. The semiconductor device according to claim 1, wherein the temperature detector includes a thermosensitive element attached to the second main surface of the substrate or thermally connected to the second main surface of the substrate through a thermally conductive layer.
  4. 4. The semiconductor device according to claim 3, wherein a sink is provided on the second main surface of the substrate, and at least part of the thermosensitive element is located in the sink.
  5. 5. The semiconductor device according to claim 1, wherein at least a portion of the second main surface of the substrate is exposed outside the plastic package; The heat radiator comprises a heat conducting plate and a heat radiating part, wherein the heat conducting plate is provided with a first side face and a second side face which are opposite, the heat radiating part is arranged on the first side face of the heat conducting plate, and the second side face of the heat conducting plate is connected to a part, exposed out of the plastic package, on the second main face; wherein, the second side of the heat-conducting plate is provided with a containing groove as at least part of the space of the containing cavity.
  6. 6. The semiconductor device according to claim 5, wherein a heat insulating layer is provided on a wall of the accommodating groove, and the temperature detector and the heat sink are spaced apart from each other by the heat insulating layer.
  7. 7. The semiconductor device according to claim 1, wherein the substrate has a transverse direction and a longitudinal direction perpendicular to each other, and the fan inversion pad portion, the compressor inversion pad portion, the power pad portion, and the rectifying pad portion are sequentially arranged at intervals in the transverse direction of the substrate on the first main surface of the substrate.
  8. 8. The semiconductor device according to claim 1, wherein a threading hole communicating with the accommodating chamber is provided in the heat sink, and the temperature-controlled lead frame is electrically connected to the temperature detector through a lead wire penetrating into the threading hole.
  9. 9. The semiconductor device according to claim 1, wherein the substrate is provided with a temperature detection pad portion on the second main surface, and the temperature detector is electrically bonded to the temperature detection pad portion; the radiator is internally provided with a threading hole communicated with the accommodating cavity, and the temperature control lead frame is electrically connected with the temperature detection pad part through a lead wire penetrating through the threading hole.
  10. 10. The semiconductor device according to claim 1, wherein a temperature detecting pad portion is provided on the second main surface of the substrate, a transfer pad portion is provided on the first main surface of the substrate, at least a part of the transfer pad portion is arranged opposite to and at a distance from the temperature detecting pad portion, the substrate includes an insulating layer between the transfer pad portion and the temperature detecting pad portion, the temperature detector is electrically bonded to the temperature detecting pad portion, a contact plug is provided through the insulating layer, and both ends of the contact plug are electrically bonded to the transfer pad portion and the temperature detecting pad portion, respectively; A portion of the temperature controlled leadframe extends onto the transfer pad portion to electrically engage the transfer pad portion; Or/and the substrate is provided with a transverse direction and a longitudinal direction which are perpendicular to each other, the temperature control lead frame and the transfer pad part are arranged at intervals in the longitudinal direction of the substrate, and the temperature control lead frame and the transfer pad part are electrically connected through a lead.
  11. 11. The semiconductor device of claim 1, wherein a projection of the temperature detector onto the substrate in a direction perpendicular to the first major face is located within a peripheral edge of the substrate and proximate to the temperature controlled leadframe.
  12. 12. An electrical apparatus comprising the semiconductor device according to any one of claims 1 to 10.

Description

Semiconductor device and electrical equipment Technical Field The present application relates to the field of semiconductor technology, and in particular, to a semiconductor device and an electrical apparatus. Background The intelligent power module (INTELLIGENT POWER MODULE, IPM) and other semiconductor devices can be arranged on the electric control boards of the air conditioner compressor, the washing machine motor and other equipment, and the IPM adopts the insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) of the power switch device, so that the intelligent power module has the advantages of high current density, low saturation voltage, high voltage resistance and the like. For example, the air conditioner electronic control board may include components independently packaged such as a rectifier, a power factor corrector (Power Factor Correction, PFC), a compressor IPM, and a blower IPM, which are discrete components, occupy a large area on the electronic control board, require multiple plug-ins for production, and have a risk of burning out the components due to a rapid rise in temperature of the semiconductor device during operation. Disclosure of utility model In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description. The summary of the utility model is not intended to define the key features and essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. In order to solve the above-described problems at least in part, according to a first aspect of the present application, there is provided a semiconductor device externally connected with a processor, a heat sink, and a temperature detector, the semiconductor device comprising: A substrate having first and second opposed major faces, the first major face having thereon a fan inversion pad portion, a compressor inversion pad portion, a power pad portion, and a rectifying pad portion, the fan inversion pad portion and the compressor inversion pad portion being adjacent and spaced apart; The fan inverter circuit, the compressor inverter circuit, the power factor corrector and the rectifier are respectively arranged on the fan inverter pad part, the compressor inverter pad part, the power pad part and the rectification pad part; The lead frame comprises a driving lead frame, a rectifying lead frame and a temperature control lead frame, wherein a fan driving circuit, a compressor driving circuit and a power driving circuit are arranged on the driving lead frame, the fan driving circuit is electrically connected between the processor and the fan inverter circuit, the compressor driving circuit is electrically connected between the processor and the compressor inverter circuit, and the power driving circuit is electrically connected between the processor and the power factor corrector; The plastic package body is used for plastic packaging at least part of the substrate and part of the lead frame, and the other part of the lead frame is exposed out of the plastic package body; The radiator is arranged on the second main surface side and is in heat conduction connection with at least part of the plastic package body and/or at least part of the substrate, a containing cavity is surrounded between the radiator and the substrate, and the projection of the containing cavity in the direction perpendicular to the first main surface is at least partially overlapped with the fan inversion bonding pad part, or is at least partially overlapped with the compressor inversion bonding pad part, or is at least partially overlapped with the area between the fan inversion bonding pad part and the compressor inversion bonding pad part; The temperature detector is positioned in the accommodating cavity and used for detecting and obtaining a temperature sampling signal, and is electrically connected with the processor through the temperature control lead frame so as to send the temperature sampling signal to the processor through the temperature control lead frame. The technical scheme has the advantages that the temperature detector for detecting the temperature is arranged on the second main surface side of the substrate, so that the temperature detector does not occupy the space of the first main surface of the substrate, a larger installation area is provided for the fan inverter circuit, the compressor inverter circuit, the power factor corrector and the rectifier, and meanwhile, the size of the substrate is reduced, and the integration and the miniaturization of the power device are facilitated. In addition, a large amount of heat is generated in the high-frequency switching process of the power devices (such as IGBT) in the fan inverter circuit and the compressor inverter circuit, and the power devices are the main heat sources of the device. In some embodiments, a projection