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CN-224234197-U - TSSOP20 lead frame and punching assembly

CN224234197UCN 224234197 UCN224234197 UCN 224234197UCN-224234197-U

Abstract

The utility model discloses a TSSOP20 lead frame and a stamping assembly, wherein the TSSOP20 lead frame comprises a rectangular frame and a subunit, the subunit comprises a base island and pins, the base island is sunk in the rectangular frame, the base island is in a rectangular-like shape, corners of the base island are provided with radians, two ends of the base island are respectively provided with a first connecting rib, the other ends of the first connecting ribs are connected with the rectangular frame, the pins are arranged on the side edges of the base island and have included angles, the pins are provided with second connecting ribs, and the other ends of the second connecting ribs are connected with the rectangular frame. The stamping assembly comprises an upper die and a lower die, and the upper die and the lower die are matched and stamped to form the TSSOP20 lead frame. The utility model has the beneficial effects that the corners of the base island are arranged into the arc shape, so that the base island can be effectively prevented from being broken, the four corners of the base island are locked by the L-shaped pins, so that the structure shape of the base island is more stable, and the positioning structure and the adjusting assembly are arranged on the stamping assembly, so that the processed lead frame can be ensured to have higher yield.

Inventors

  • XIAO CHUANXING
  • XU HONGBO

Assignees

  • 宁波港波电子有限公司

Dates

Publication Date
20260512
Application Date
20250611

Claims (10)

  1. 1. The TSSOP20 lead frame is characterized by comprising a rectangular frame (1) and a subunit (2), wherein the subunit (2) comprises a base island (21) and pins (22), the base island (21) sinks to the rectangular frame (1), the base island (21) is similar to a rectangular shape, corners of the base island (21) are provided with radians, two ends of the base island (21) are respectively provided with a first connecting rib (100), the other ends of the first connecting ribs (100) are connected with the rectangular frame (1), the pins (22) are arranged on the side edges of the base island (21) and have included angles between the two, second connecting ribs (200) are arranged on the pins (22), and the other ends of the second connecting ribs (200) are connected with the rectangular frame (1).
  2. 2. The TSSOP20 lead frame of claim 1, wherein the leads (22) comprise a "one" lead (22) and an "L" lead (22), the "one" lead (22) is symmetrically disposed above and below the base island (21), the "L" lead (22) is symmetrically disposed at four corners of the base island (21), and the opening of the "L" lead (22) is oriented toward the corners of the base island (21).
  3. 3. The TSSOP20 leadframe of claim 2, characterized in that the inner corners of the "L" -shaped leads (22) also have a curvature that is the same as the corner curvature of the islands (21).
  4. 4. A TSSOP20 lead frame according to claim 3, characterized in that the distance between adjacent pins (22) is in the range of 0.200mm ± 0.025mm, the angle between the pins (22) and the islands (21) being 30 °.
  5. 5. The TSSOP20 lead frame of claim 4, characterized in that the leads (22) are provided with a plating, and the outer edges of the islands (21) are provided with a plating.
  6. 6. The TSSOP20 lead frame of claim 5, wherein the plated areas on the leads (22) and the islands (21) form a "back" shape, and the plated areas have a width in the range of 0.700mm to 1.100mm.
  7. 7. The TSSOP20 lead frame according to claim 1, wherein a plurality of rectangular holes (11) are symmetrically arranged on the upper side and the lower side of the subunit (2), positioning holes (12) are arranged on the rectangular frame (1), and the positioning holes (12) are positioned at the head end and the tail end of the plurality of subunits (2) arranged in a row.
  8. 8. A stamping assembly, characterized in that the stamping assembly is suitable for stamping and producing the TSSOP20 lead frame as claimed in any one of claims 1-7, and comprises an upper die (3) and a lower die (4), wherein the lower die (4) is provided with a concave plate (41), the upper die (3) is provided with a stamping plate (31) for matching the concave plate (41) with the stamping lead frame, and a positioning structure is arranged between the upper die (3) and the lower die (4).
  9. 9. The stamping assembly according to claim 8, wherein the concave plate (41) is provided with a plurality of groups of stamping holes (410), the stamping plate (31) is provided with a punch (310), the punch (310) is matched with the stamping holes (410) to stamp and form gaps of pins (22), the concave plate (41) is further provided with an adjusting assembly (5) for adjusting the gap of the pins (22), the positioning structure comprises a plurality of groups of mutually matched positioning grooves (401) and positioning nails (400), the stamping plate (31) and the concave plate (41) are both provided with perforations (402), one end of each positioning nail (400) is connected with the upper die (3) or the lower die (4) through a spring (403), and the other end of each positioning nail extends into the corresponding positioning groove (401) through each perforation (402).
  10. 10. The punching assembly according to claim 9, characterized in that a bending module (300) and a shearing module (301) are also mounted on the concave plate (41), the bending module being used for bending the pins (22), the shearing module (301) being used for cutting the rectangular frame (1).

Description

TSSOP20 lead frame and punching assembly Technical Field The application relates to the technical field of lead frames, in particular to a TSSOP20 lead frame and a stamping assembly. Background The TSSOP20 package is a compact package having 20 pins, and is suitable for circuit designs requiring high density layout. TSSOP20 packages have a lower external size and narrower pitch, and thus can integrate more functions in a limited space. Such packages are commonly used for logic devices, memories, amplifiers and other various electronic components in integrated circuits. Corners of the base island in the traditional lead frame are at right angles, so that the liquid medicine can be deposited at four corners of the base island to cause excessive corrosion during subsequent corrosion of the liquid medicine, and the yield of the lead frame is affected; in addition, the rectangular islands may concentrate stress at corners during subsequent use, and break easily, so that improvement of the existing island structure is necessary. Stamping is an important link in lead frame processing, in the prior art, most of the lead frames are stamped and formed on a plate material directly by using stamping plates, the distances between the leads on the lead frames of different types are not communicated, and when the distance between the leads is changed, different stamping templates are required to be replaced, so that the processing efficiency of the lead frames is definitely reduced. In addition, the lead frame has a precise structure, and the yield of the lead frame is reduced when the angle error or the stamping force is overlarge in the stamping process, so that a safe and efficient stamping assembly is needed. Disclosure of utility model It is an object of the present application to provide a TSSOP20 leadframe that addresses at least one of the above-mentioned drawbacks of the prior art. It is another object of the present application to provide a stamping assembly that addresses at least one of the above-mentioned drawbacks of the prior art. In order to achieve at least one purpose, the TSSOP20 lead frame comprises a rectangular frame and a subunit, wherein the subunit comprises a base island and pins, the base island is sunk in the rectangular frame, the base island is rectangular-like, corners of the base island are provided with radians, first connecting ribs are arranged at two ends of the base island, the other ends of the first connecting ribs are connected with the rectangular frame, the pins are equidistantly distributed on the side edges of the base island and have included angles, second connecting ribs are arranged on the pins, and the other ends of the second connecting ribs are connected with the rectangular frame. Through the arrangement, the sub-units can compactly package the chip, so that hollowed-out areas of the parts, close to the base islands and the pins, of the base islands are uniform, the heat dissipation capacity of the lead frame is enhanced, the four corners of the base islands are arranged into arc shapes, so that the stress of the four corners of the base islands can be effectively reduced, the base islands are prevented from being broken in the subsequent processing and use processes, and meanwhile, the integral structural strength of the lead frame can be further improved through the first connecting ribs and the second connecting ribs. Preferably, the pins comprise a one-shaped pin and an L-shaped pin, the one-shaped pin is symmetrically arranged above and below the base island, the L-shaped pin is symmetrically arranged at four corners of the base island, and the opening of the L-shaped pin faces to the corners of the base island. The L-shaped pins can lock four corners of the base island, so that the structural shape of the base island is more stable, and thermal cycle stress cracking of the base island is avoided. Preferably, the inner corners of the L-shaped pins also have radians, and the radians of the L-shaped pins are the same as the radians of the corners of the islands. By the arrangement, the four sides of the base island can be subjected to more fitting edge locking, so that the stress in the base island is uniformly diffused to the L-shaped pins. Preferably, the distance between the adjacent pins is in the range of 0.200mm plus or minus 0.025mm, and the angle between the pins and the base island is 30 degrees. So set up, can make the pin laminate circuit structure more, the elastic design after bending simultaneously also can further cushion external force, and the pin can absorb kinetic energy through self deformation when lead frame takes place striking or vibration, reduces the cracked probability of pin. Preferably, a plating layer is arranged on the pin, and a plating layer is arranged on the outer edge of the base island. The arrangement can reduce the resistance and the signal transmission loss on one hand, and can prevent the surface oxidation of the pins and the b