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CN-224234198-U - Packaging base and electronic device

CN224234198UCN 224234198 UCN224234198 UCN 224234198UCN-224234198-U

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a packaging base and an electronic device, wherein the packaging base comprises an insulating substrate, an annular metal layer and a conductive wiring, the insulating substrate comprises a main body part and an annular part, a first end face is arranged at one end, close to the annular part, of the main body part, a second end face is arranged at one end, far away from the main body part, of the annular part, one end of the conductive wiring is positioned in the main body part, the other end of the conductive wiring is positioned in the annular part and extends to the second end face to be in contact with the annular metal layer, the minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the second end face is S1, and the minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the first end face is S2, and S1> S2. The utility model has the beneficial effects of avoiding the breakage of the conductive wiring, reducing the risk of air leakage of the packaging base and prolonging the service life of the packaging base.

Inventors

  • LI GANG

Assignees

  • 潮州三环（集团）股份有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (10)

  1. 1. A package base is characterized by comprising an insulating substrate, an annular metal layer and conductive wiring; The insulation substrate comprises a main body part and an annular part, wherein a first end face is arranged at one end, close to the annular part, of the main body part, a concave cavity is formed by surrounding the first end face and the circumferential inner wall of the annular part, and a second end face is arranged at one end, far away from the main body part, of the annular part; the annular metal layer is attached to the second end face; the conductive wiring is arranged in the insulating substrate, one end of the conductive wiring is positioned in the main body part, the other end of the conductive wiring is positioned in the annular part and extends to the second end face to be in contact with the annular metal layer; The minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the second end face is S1, and the minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the first end face is S2, wherein S1 is more than S2.
  2. 2. The package base of claim 1 wherein S2/S1 is 0.2≤S 2≤0.7.
  3. 3. The package base of claim 1 wherein the thickness W between the inner wall of the cavity and the outer wall of the insulating substrate is 0.1≤S1/W≤0.5.
  4. 4. The package substrate of claim 1, wherein the conductive trace has a strip-like configuration and the minimum spacing between the conductive trace and the inner wall of the cavity decreases in sequence along an extended path between the plane of the second end surface and the plane of the first end surface.
  5. 5. The package base of claim 4 wherein the conductive trace includes a first conductor and a second conductor, the first conductor being located within the body portion, the other end of the first conductor being connected to the second conductor, the second conductor being located within the annular portion, and the other end being connected to the annular metal layer.
  6. 6. The package substrate of claim 5, wherein the second conductor extends along a first arc in a vertical direction, wherein an angle between a connecting line of two ends of the first arc and the first end face is equal to or less than 1,55 DEG and equal to or less than 83 DEG, wherein an angle between a tangent line of the first arc and the first end face is equal to or less than 2, and/or wherein an angle between a tangent line of the first arc and the first end face is equal to or less than 83 DEG, The path of the first conductor extending in the horizontal direction is a second arc line, an included angle between a connecting line at two ends of the second arc line and the first end face is theta 3, theta 3 is more than or equal to 0 degree and less than or equal to 45 degrees, and an included angle between a tangent line of the second arc line and the first end face is theta 4, and theta 4 is less than or equal to 45 degrees.
  7. 7. The package base of claim 6 wherein the angle between the line connecting the ends of the first arc and the line connecting the ends of the second arc is θ 5,90≤135 °.
  8. 8. The package base of claim 5 further comprising a plurality of external connection terminals, said first conductor being connected to one of said external connection terminals by a via conductor; The first conductor at least partially coincides with the projection of the external connection terminal on the first end face, and/or, The minimum distance between the first conductor and the external connection terminal in the vertical direction is H1, and the thickness of the main body part in the vertical direction is H0, wherein H1/H0 is more than or equal to 0.65 and less than or equal to 0.85.
  9. 9. The package base of claim 5 further comprising a plurality of electrode pads spaced apart on said first end face, said first conductor being non-coincident with a projection of said electrode pads on said first end face, and/or, The minimum distance between the first conductor and the electrode pad in the vertical direction is H2, and the thickness of the main body part in the vertical direction is H0, wherein H2/H0 is more than or equal to 0.05 and less than or equal to 0.4.
  10. 10. An electronic device comprising a package base according to any one of claims 1-9.

Description

Packaging base and electronic device Technical Field The present utility model relates to the field of electronic packaging technology, and in particular, to a packaging base and an electronic device. Background The package base is generally used for packaging electronic components such as quartz crystal and semiconductor chip, and the packaged components (such as semiconductor device, temperature compensated oscillator TCXO, tuning fork resonator, thermosensitive resonator, vehicle-mounted component, general oscillator OSC, pressure compensated oscillator VCXO, etc.) are widely used in various electronic devices. The common packaging base is composed of an insulating substrate and a conductive pattern arranged on the insulating substrate, wherein the insulating substrate comprises a main body part and an annular part, the main body part and the annular part are matched to form a concave cavity for placing the electronic element, and after the electronic element is placed in the concave cavity, the concave cavity is covered by a cover plate in a sealing welding mode, so that the electronic element is packaged. When the cover plate is subjected to seal welding, because of the corner area of the connection of the main body part and the annular part, the thermal stress influence of seal welding is easy to generate stress concentration, so that the inner side crack of the circumferential inner wall (namely the inner wall of the concave cavity) of the annular part is generated and extends to the conductive wiring structure in the annular part, and meanwhile, along with the miniaturization design of the packaging base, the volume of the insulating substrate is reduced, and the risk of the outer side crack of the circumferential outer wall (namely the outer side of the concave cavity) of the annular part is increased. In the existing packaging base, because the distance between the conductive wiring and the circumferential outer wall of the annular part is too small, the outer crack easily extends to the conductive wiring to break the conductive wiring, meanwhile, because the material density of the conductive wiring is smaller than that of the insulating substrate, when the inner crack and the outer crack simultaneously extend to the conductive wiring, the conductive wiring breaks, so that the risk of air leakage of the packaging base is caused, and the service life of the packaging base is reduced. Disclosure of utility model The utility model aims to provide a packaging base and an electronic device, which are used for avoiding the breakage of conductive wires, reducing the risk of air leakage of the packaging base and prolonging the service life of the packaging base. In order to achieve the above object, the present utility model provides a package base including an insulating substrate, a ring-shaped metal layer, and conductive wirings; The insulation substrate comprises a main body part and an annular part, wherein a first end face is arranged at one end, close to the annular part, of the main body part, a concave cavity is formed by surrounding the first end face and the circumferential inner wall of the annular part, and a second end face is arranged at one end, far away from the main body part, of the annular part; the annular metal layer is attached to the second end face; The conductive wiring is arranged in the insulating substrate, and one end of the conductive wiring is positioned in the main body part; the other end of the conductive wiring is positioned in the annular part and extends to the second end face to be in contact with the annular metal layer; The minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the second end face is S1, and the minimum distance between the conductive wiring and the circumferential inner wall of the annular part on the plane of the first end face is S2, wherein S1 is more than S2. Still further, the method further comprises the steps of, S2 is more than or equal to 0.2% S1 is less than or equal to 0.7. Further, the thickness W between the inner wall of the concave cavity and the outer wall of the insulating substrate is more than or equal to 0.1 and less than or equal to 0.5. Further, S1/W is more than or equal to 0.15 and less than or equal to 0.35. Further, the conductive wiring is in a strip-shaped structure, and on an extending path between the plane of the second end face and the plane of the first end face, a minimum distance between the conductive wiring and the inner wall of the concave cavity is sequentially reduced. Still further, the conductive wiring includes a first conductor and a second conductor, the first conductor is provided in the main body portion, the other end of the first conductor is connected with the second conductor, the second conductor is provided in the annular portion, and the other end is connected with the annular metal layer. Further, the extending path of the second