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CN-224234199-U - Packaging base, combined board and electronic device

CN224234199UCN 224234199 UCN224234199 UCN 224234199UCN-224234199-U

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a packaging base, a combined board and an electronic device, wherein the packaging base comprises an insulating substrate, a metal layer, an electrode pad and a plurality of electroplating wires; the insulating substrate comprises a substrate main body and a frame part, wherein the outer peripheral side wall of the substrate main body and the outer peripheral side wall of the frame part extend in the first direction to form an outer side wall, a plurality of electroplating wires are positioned in the insulating substrate, one ends of the electroplating wires extend in the substrate main body and are connected with the electrode pads, and the other ends extend in the frame part and are exposed out of the outer side wall to form an electroplating wire exposure part. The utility model has the beneficial effects that the electroplating wiring is arranged far away from the surface of the dividing groove, and the adjacent packaging bases can be conducted, so that the problem that the adjacent packaging bases are stuck in the dividing groove area due to the fact that the electroplating wiring is exposed out of the surface of the dividing groove is avoided, and the production efficiency is improved.

Inventors

  • LI GANG

Assignees

  • 德阳三环科技有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (10)

  1. 1. A package base is characterized by comprising an insulating substrate, a metal layer, an electrode pad and a plurality of electroplating wires; The insulation substrate comprises a substrate main body and a frame part which are sequentially arranged in a first direction, wherein the frame part is provided with a through groove, one end face of the substrate main body and the side wall of the through groove are surrounded to form a mounting cavity, one end of the substrate main body, which is far away from the frame part, is provided with a first surface, one end of the frame part, which is far away from the substrate main body, is provided with a second surface, the peripheral side wall of the substrate main body and the peripheral side wall of the frame part extend in the first direction to form an outer side wall, one end of the outer side wall in the first direction is connected with the first surface through a split inclined surface, and/or the other end of the outer side wall in the first direction is connected with the second surface through a split inclined surface; the metal layer is arranged around the mounting cavity on the second surface; The electrode pad is arranged in the mounting cavity; And a plurality of plated wires are positioned in the insulating substrate, one ends of the plated wires extend in the substrate main body and are connected with the electrode pads, and the other ends extend in the frame part and are exposed at the outer side wall to form plated wire exposed parts for connecting with the plated wires in the adjacent package bases.
  2. 2. The package substrate of claim 1, wherein the insulating substrate has a length T in the first direction, and a minimum distance between the exposed portion of the plated wiring and the second surface in the first direction is D1, 0.1≤D1/T≤0.5.
  3. 3. The package substrate of claim 1, wherein the minimum distance between the plated wire and the first surface in the first direction is D2, and the length of the substrate body in the first direction is H1, 0.65≤D2/H1≤0.95.
  4. 4. The package base of claim 1 wherein the area of overlap of the projection of the plated wire and the electrode pad onto the first surface is A1, and the projected area of the electrode pad onto the first surface is A2, 0.05≤A1/A2≤0.35.
  5. 5. The package base of claim 1, wherein an angle θ between a tangent to an extension path of an end of the plated wire connected to the electrode pad and the first surface is equal to or less than 45 °.
  6. 6. The package base of claim 1 further comprising a plurality of external terminals disposed on and spaced apart from said first surface, said electrode pads being connected to one of said external terminals by a via conductor.
  7. 7. The package base of claim 6 wherein said electrode pad has a first region for connection to said plated wire, said via conductor at least partially coinciding with a projection of said first region onto said first surface.
  8. 8. The package substrate of claim 1, wherein the insulating substrate has a first diagonal and a second diagonal that intersect, the insulating substrate has a first corner region and a third corner region that are disposed opposite each other in an extending direction of the first diagonal, and the insulating substrate has a second corner region and a fourth corner region that are disposed opposite each other in an extending direction of the second diagonal; the second corner region and the fourth corner region are each provided with the plating wiring for connection with the electrode pad, or, The first corner region and the third corner region are each provided with the plating wiring for the electrode pad connection, or, The side region is provided with the plating wiring for connection with the electrode pad.
  9. 9. A package base assembly board is formed by arranging a plurality of package bases according to any one of claims 1 to 8, wherein the electroplating wiring which is connected and conducted with each other is arranged between the adjacent package bases, and the split inclined surfaces of the adjacent package bases are mutually matched to form a split groove.
  10. 10. An electronic device comprising the package base of any one of claims 1-8, further comprising an electronic component disposed in the mounting cavity, and a cover plate sealing the mounting cavity.

Description

Packaging base, combined board and electronic device Technical Field The present utility model relates to the field of electronic packaging technology, and in particular, to a packaging base, a composite board, and an electronic device. Background The package base is generally used for packaging electronic components such as quartz crystal and semiconductor chip, and the packaged components (such as semiconductor device, temperature compensated oscillator TCXO, tuning fork resonator, thermosensitive resonator, vehicle-mounted component, general oscillator OSC, pressure compensated oscillator VCXO, etc.) are widely used in various electronic devices. The package base is usually manufactured by processing a large-sized insulating substrate to obtain a package base assembly board formed by arranging a plurality of package bases, and connecting conductive patterns on two adjacent package bases through electroplating wiring on the package base assembly board so as to realize electroplating of all the package bases. After the electroplating is completed, the combined board can be divided into single package bases by utilizing a preset dividing groove. However, when connecting two adjacent package bases, some of the plating wires are exposed on the surface of the dividing groove, so that adhesion occurs in the area exposed with the plating wires in the plating process, so that it becomes difficult to divide the composite board into the individual package bases, and the production efficiency of the package bases is reduced. Disclosure of utility model The utility model aims to provide a packaging base, a combined board and an electronic device, wherein electroplating wiring is arranged far away from the surface of a dividing groove, and adjacent packaging bases can be conducted, so that the problem that the adjacent packaging bases are stuck in the dividing groove area during electroplating due to the fact that the electroplating wiring is exposed out of the surface of the dividing groove is avoided, and the production efficiency is improved. In order to achieve the above object, the present utility model provides a package base including an insulating substrate, a metal layer, an electrode pad, and a plurality of plated wirings; The insulation substrate comprises a substrate main body and a frame part which are sequentially arranged in a first direction, wherein the frame part is provided with a through groove, one end face of the substrate main body and the side wall of the through groove are surrounded to form a mounting cavity, one end of the substrate main body, which is far away from the frame part, is provided with a first surface, one end of the frame part, which is far away from the substrate main body, is provided with a second surface, the peripheral side wall of the substrate main body and the peripheral side wall of the frame part extend in the first direction to form an outer side wall, one end of the outer side wall in the first direction is connected with the first surface through a split inclined surface, and/or the other end of the outer side wall in the first direction is connected with the second surface through a split inclined surface; the metal layer is arranged around the mounting cavity on the second surface; The electrode pad is arranged in the mounting cavity; And a plurality of plated wires are positioned in the insulating substrate, one ends of the plated wires extend in the substrate main body and are connected with the electrode pads, and the other ends extend in the frame part and are exposed at the outer side wall to form plated wire exposed parts for connecting with the plated wires in the adjacent package bases. Further, the insulating substrate has a length T in the first direction, and a minimum distance between an end of the exposed portion of the plated wiring exposed on the outer side wall and the second surface in the first direction is D1, 0.1≤D1/T≤0.5. Further, the minimum distance between the electroplated wire and the first surface in the first direction is D2, and the length of the substrate main body in the first direction is H1, and D2/H1 is more than or equal to 0.65 and less than or equal to 0.95. Further, the overlapping area of the projection of the electroplating wiring and the electrode pad on the first surface is A1, and the projection area of the electrode pad on the first surface is A2, wherein A1/A2 is more than or equal to 0.05 and less than or equal to 0.35. Further, an angle θ between a tangent line of an extension path of an end of the plating wiring connected to the electrode pad and the first surface is θ, θ is 45 ° or less. Still further, the battery pack further comprises a plurality of external terminals provided on the first surface and spaced apart from each other on the first surface, and the electrode pads are connected to one of the external terminals through via conductors. Further, the electrode pad is provided with a first region for connect